公开(公告)号：US20150251350A1

公开(公告)日：2015-09-10

申请号：US14481381

申请日：2014-09-09

Applicant: Kabushiki Kaisha Toshiba

Inventor： Yosuke OKAMOTO ,  Nobuhiro KOMINE ,  Kazuhiro SEGAWA ,  Manabu TAKAKUWA ,  Kentaro KASA

IPC: B29C59/16 ,  B29C59/02

CPC classification number: G03F7/0002

Abstract: According to one embodiment, an imprint device includes a holding unit, a mounting unit, a moving unit, a curing unit, a pressing portion, and a detecting portion. The holding unit holds template having a pattern portion pressed onto a transfer portion provided on a substrate. The mounting unit mounts the substrate. The moving unit is provided on at least either the holding unit or the mounting unit. The moving unit moves the holding unit and the mounting unit in directions approaching each other or directions away from each other. The curing unit cures the transfer portion onto which the pattern portion of the template is pressed. The pressing portion pushes the template pressed onto the transfer portion in a direction intersecting a pressing direction of the template. The detecting portion detects a position of the template pushed by the pressing portion.

Abstract translation: 根据一个实施例，压印装置包括保持单元，安装单元，移动单元，固化单元，按压部分和检测部分。 保持单元保持具有压制在设置在基板上的转印部上的图案部分的模板。 安装单元安装基板。 移动单元设置在保持单元或安装单元中的至少一个上。 移动单元在彼此接近或彼此远离的方向上移动保持单元和安装单元。 固化单元固化模板的图案部分被按压到的转印部分。 按压部按照与模板的按压方向交叉的方向推压按压在转印部上的模板。 检测部分检测由按压部分推动的模板的位置。

公开(公告)号：US20160240423A1

公开(公告)日：2016-08-18

申请号：US14692925

申请日：2015-04-22

Applicant: Kabushiki Kaisha Toshiba

Inventor： Kentaro MATSUNAGA ,  Kazuhiro SEGAWA

IPC: H01L21/683 ,  G03F7/26 ,  G03F7/20 ,  H01L21/66 ,  H01L21/324

CPC classification number: G03F7/26 ,  G03F7/70783 ,  H01L21/3247 ,  H01L21/6838 ,  H01L22/12

Abstract: According to one embodiment, there is provided an exposure method. The method includes attaching a thin film sheet thermally shrinkable onto a rear face of a wafer. The method includes heating the wafer provided with the thin film sheet attached thereon, and deforming the wafer into a shape projecting on a front face side of the wafer. The method includes fixing the deformed wafer onto a stage by vacuum suction holding from a rear face side of the wafer. The method includes performing exposure to the fixed wafer.

Abstract translation: 根据一个实施例，提供了曝光方法。 该方法包括将可热收缩的薄膜片附接到晶片的背面上。 该方法包括加热安装有薄膜片的晶片，并使晶片变形为在晶片的正面侧突出的形状。 该方法包括通过从晶片的背面侧保持真空吸附将变形的晶片固定在平台上。 该方法包括对固定晶片进行曝光。

公开(公告)号：US20160223321A1

公开(公告)日：2016-08-04

申请号：US14744453

申请日：2015-06-19

Applicant: Kabushiki Kaisha Toshiba

Inventor： Kazuhiro SEGAWA

IPC: G01B11/27 ,  H01L23/544 ,  H01L21/66

CPC classification number: H01L23/544 ,  G03F7/70633 ,  H01L22/12 ,  H01L27/11582 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/5446

Abstract: According to one embodiment, an optical element branches reflection light from a first mark and a second mark having different focus positions, a first imaging element captures an image of the first mark based on a first branch light branched by the optical element, a second imaging element captures an image of the second mark based on a second branch light branched by the optical element, and an arithmetic processing unit that calculates a misalignment between the first mark and the second mark based on a result of superimposition of the image of the first mark and the image of the second mark.

Abstract translation: 根据一个实施例，光学元件分支来自第一标记的反射光和具有不同对焦位置的第二标记，第一成像元件基于由光学元件分支的第一分支光捕获第一标记的图像，第二成像 基于由光学元件分支的第二分支光，元件捕获第二标记的图像;以及算术处理单元，其基于第一标记的图像的叠加的结果来计算第一标记和第二标记之间的未对准 和第二个标记的图像。

公开(公告)号：US20170271214A1

公开(公告)日：2017-09-21

申请号：US15253476

申请日：2016-08-31

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Kentaro KASA ,  Kazuya FUKUHARA ,  Kazutaka ISHIGO ,  Manabu TAKAKUWA ,  Yoshinori HAGIO ,  Kazuhiro SEGAWA ,  Yuki MURASAKA ,  Tetsuya KUGIMIYA ,  Yuu YAMAYOSE ,  Yosuke OKAMOTO

IPC: H01L21/66 ,  G01B11/30 ,  G01N25/72 ,  G03F7/26 ,  H01L21/027 ,  G03F7/20 ,  G03F7/039 ,  G01B11/27 ,  H01L21/67

CPC classification number: H01L22/20 ,  G01B11/002 ,  G01B11/24 ,  G01B11/27 ,  G01B11/306 ,  G01B2210/44 ,  G01B2210/56 ,  G01N25/72 ,  G03F7/039 ,  G03F7/20 ,  G03F7/26 ,  H01L21/0274 ,  H01L21/67248 ,  H01L21/67288 ,  H01L21/68 ,  H01L22/12

Abstract: A pattern accuracy detecting apparatus includes a stage for supporting a substrate, an optical warpage detecting unit that measures a shape of a substrate disposed on the stage, an optical pattern detection unit that detects a position of a pattern on the substrate, and a processing unit that corrects the detected pattern position based on the measured shape of the substrate.

公开(公告)号：US20160020099A1

公开(公告)日：2016-01-21

申请号：US14572908

申请日：2014-12-17

Applicant: Kabushiki Kaisha Toshiba

Inventor： Kazuhiro SEGAWA ,  Nobuhiro KOMINE ,  Kentaro MATSUNAGA ,  Takehiro KONDOH ,  Shinichi NAKAGAWA

IPC: H01L21/033 ,  H01L21/3213 ,  H01L29/40 ,  H01L29/423

CPC classification number: H01L21/0337 ,  H01L21/28141 ,  H01L21/32 ,  H01L21/32139 ,  H01L21/76807 ,  H01L27/11519 ,  H01L27/11524 ,  H01L29/40114 ,  H01L29/42324 ,  H01L2221/1026

Abstract: According to one embodiment, first, an embedment material is embedded between linear core material patterns in such a manner that a height thereof becomes lower than a height of each of the core material patterns. Then, a shrink agent is supplied and solidified on the embedment material. Subsequently, the solidified shrink agent and the embedment material are removed and a spacer film is formed on an object of processing. Then, the spacer film is etched-back and a spacer pattern is formed by removal of the core material patterns. The solidified shrink agent which is formed in such a manner that a width of the spacer pattern becomes narrow in a region corresponding to a position where the shrink agent, in a sectional surface vertical to an extended direction of the spacer pattern is supplied is removed.

Abstract translation: 根据一个实施例，首先，将嵌入材料以高度变得低于每个芯材图案的高度的方式嵌入在线状芯材图案之间。 然后，在嵌入材料上提供并固化收缩剂。 随后，除去固化的收缩剂和嵌入材料，并且在加工对象上形成间隔膜。 然后，间隔膜被回蚀刻，并且通过去除芯材图案形成间隔图案。 固化的收缩剂以这样的方式形成，即，在与间隔图案的延伸方向垂直的截面中的收缩剂的位置对应的区域中，间隔物图案的宽度变窄。