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公开(公告)号：US20200301129A1
公开(公告)日：2020-09-24
申请号：US16552207
申请日：2019-08-27
发明人： Honam KWON , Koichi Ishii , Ikuo Fujiwara , Kazuhiro Suzuki
摘要： According to an embodiment, a semiconductor device includes a first actuator, a second actuator, a first frame provided between the first actuator and the second actuator, a first connection member connecting the first actuator and the first frame to each other, a second connection member connecting the first actuator and the first frame to each other at a position different from a position at which the first connection member connects the first actuator and the first frame to each other, a third connection member connecting the second actuator and the first frame to each other, a fourth connection member connecting the second actuator and the first frame to each other at a position different from a position at which the third connection member connects the second actuator and the first frame to each other.
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公开(公告)号：US09799700B2
公开(公告)日：2017-10-24
申请号：US14844319
申请日：2015-09-03
发明人： Koichi Ishii , Hideyuki Funaki
IPC分类号： G01J5/20 , H01L27/146
CPC分类号： H01L27/14649 , H01L27/14618 , H01L27/14623 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： An infrared sensor according to an embodiment includes a housing, a detector, a lid, and a light shielding film. The detector is mounted on the bottom surface of the housing and includes a heat-sensitive pixel region and a reference pixel region. The lid seals the housing and includes a support member and a window member. The support member is bonded to the side surfaces of the housing and has an opening positioned above the heat-sensitive pixel region. The window member is bonded to a surface of the support member on a side of the detector so as to cover the opening. The light shielding film is formed on a surface of the window member on a side of the detector and arranged on an optical path of the infrared rays entering the reference pixel region.
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3.发明授权公开(公告)号：US09404963B2
公开(公告)日：2016-08-02
申请号：US14064588
申请日：2013-10-28
发明人： Hiroto Honda , Koichi Ishii , Hideyuki Funaki , Keita Sasaki
CPC分类号： G01R31/2829 , G01R31/2635
摘要： An apparatus includes: a current control unit to control an amount of constant current and supply a first and second constant currents to an infrared detection pixel; a constant current supply time control unit to control periods of time in which the first and second constant currents are supplied to the infrared detection pixel; an A-D converter to convert a first and second electrical signals from the infrared detection pixel into a first and second digital signals, the first and second electrical signals being generated when the first and second constant currents is supplied to the infrared detection pixel, respectively; a subtracting unit to calculate a difference between the first and second digital signals; and a determining unit to determine whether the infrared detection pixel is a defective pixel based on the absolute value of the difference calculated by the subtracting unit.
摘要翻译： 一种装置包括：电流控制单元，用于控制恒定电流量并向红外检测像素提供第一和第二恒定电流; 恒定电流供应时间控制单元，用于控制将第一和第二恒定电流提供给红外线检测像素的时间段; A-D转换器，用于将来自红外检测像素的第一和第二电信号转换成第一和第二数字信号，当第一和第二恒定电流分别提供给红外检测像素时，产生第一和第二电信号; 减法单元，用于计算第一和第二数字信号之间的差; 以及确定单元，用于基于由减法单元计算的差的绝对值来确定红外检测像素是否是缺陷像素。
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公开(公告)号：US09170160B2
公开(公告)日：2015-10-27
申请号：US14693661
申请日：2015-04-22
发明人： Hiroto Honda , Kazuhiro Suzuki , Hideyuki Funaki , Masaki Atsuta , Keita Sasaki , Koichi Ishii , Honam Kwon
CPC分类号： G01J5/12 , G01J5/023 , G01J5/20 , G01J5/22 , G01J2005/0077 , H01L27/14649 , H04N5/33
摘要： An imaging device according to an embodiment includes: a semiconductor substrate; a reference pixel with a first concave portion disposed in a first portion of a surface of the semiconductor substrate; and one or more infrared detection pixels each configured to detect light with a second concave portion disposed in a second portion of the surface of the semiconductor substrate, the reference pixel being directly connected to the semiconductor substrate at a position where the first concave portion is not present, and including a first thermoelectric conversion unit configured to convert heat to an electric signal, the first thermoelectric conversion unit being disposed in the first concave portion and including a first thermoelectric conversion element, each infrared detection pixel including a second thermoelectric conversion unit being disposed in the second concave portion and including a second thermoelectric conversion element.
摘要翻译： 根据实施例的成像装置包括：半导体衬底; 参考像素，其具有设置在所述半导体衬底的表面的第一部分中的第一凹部; 以及一个或多个红外检测像素，每个红外检测像素被配置为利用设置在所述半导体衬底的表面的第二部分中的第二凹部来检测光，所述参考像素在所述第一凹部不在所述位置处直接连接到所述半导体衬底 存在并且包括被配置为将热量转换为电信号的第一热电转换单元，第一热电转换单元设置在第一凹部中并且包括第一热电转换元件，每个红外检测像素包括第二热电转换单元， 在第二凹部中并且包括第二热电转换元件。
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公开(公告)号：US11598858B2
公开(公告)日：2023-03-07
申请号：US16812435
申请日：2020-03-09
发明人： Honam Kwon , Koichi Ishii , Ikuo Fujiwara , Kazuhiro Suzuki
IPC分类号： G01S7/4863 , G01S17/931 , G01S7/4865 , H01L31/02
摘要： According to one embodiment, a light detector includes a conductive layer, a first element, a second element, a first member, a first insulating part, and a second insulating part. The conductive layer includes a first conductive portion and a second conductive portion. The first element includes a first semiconductor layer and a second semiconductor layer. The second element includes a fourth semiconductor layer and a fifth semiconductor layer. The first member is provided between the first element and the second element and electrically connected to the conductive layer. The first member is conductive. The first insulating part is provided between the first element and the first member. The second insulating part is provided between the second element and the first member.
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公开(公告)号：US10600930B2
公开(公告)日：2020-03-24
申请号：US15384938
申请日：2016-12-20
发明人： Kazuhiro Suzuki , Risako Ueno , Hiroto Honda , Koichi Ishii , Toshiya Yonehara , Hideyuki Funaki
IPC分类号： G01S17/00 , H01L31/107 , G01S17/08 , G01S17/89 , H01L31/18 , H01L31/028 , H01L31/02
摘要： A photodetector according to an embodiment includes: a first semiconductor layer; a porous semiconductor layer disposed on the first semiconductor layer; and at least one photo-sensing element including a second semiconductor layer of a first conductivity type disposed in a region of the porous semiconductor layer and a third semiconductor layer of a second conductivity type disposed on the second semiconductor layer.
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公开(公告)号：US20140132279A1
公开(公告)日：2014-05-15
申请号：US14064588
申请日：2013-10-28
发明人： Hiroto Honda , Koichi Ishii , Hideyuki Funaki , Keita Sasaki
IPC分类号： G01R31/00
CPC分类号： G01R31/2829 , G01R31/2635
摘要： An apparatus includes: a current control unit to control an amount of constant current and supply a first and second constant currents to an infrared detection pixel; a constant current supply time control unit to control periods of time in which the first and second constant currents are supplied to the infrared detection pixel; an A-D converter to convert a first and second electrical signals from the infrared detection pixel into a first and second digital signals, the first and second electrical signals being generated when the first and second constant currents is supplied to the infrared detection pixel, respectively; a subtracting unit to calculate a difference between the first and second digital signals; and a determining unit to determine whether the infrared detection pixel is a defective pixel based on the absolute value of the difference calculated by the subtracting unit.
摘要翻译： 一种装置包括：电流控制单元，用于控制恒定电流量并向红外检测像素提供第一和第二恒定电流; 恒定电流供应时间控制单元，用于控制将第一和第二恒定电流提供给红外线检测像素的时间段; A-D转换器，用于将来自红外检测像素的第一和第二电信号转换成第一和第二数字信号，当第一和第二恒定电流分别提供给红外检测像素时，产生第一和第二电信号; 减法单元，用于计算第一和第二数字信号之间的差; 以及确定单元，用于基于由减法单元计算的差的绝对值来确定红外检测像素是否是缺陷像素。
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公开(公告)号：US20150136984A1
公开(公告)日：2015-05-21
申请号：US14534628
申请日：2014-11-06
发明人： Koichi Ishii , Hideyuki Funaki
IPC分类号： G01J5/12 , H01L27/146
CPC分类号： G01J5/12 , G01J5/023 , G01J5/024 , G01J5/10 , G01J2005/0077 , H01L27/146 , H01L27/14669
摘要： An infrared imaging element of an embodiment includes: a first pixel portion including a first cell portion including a first infrared ray detecting portion detecting a first infrared ray and a second infrared ray with a wavelength different from a wavelength of the first infrared ray, and first supporting legs that support the first cell portion, the first supporting legs including a first and second wiring lines that convey an electrical signals obtained by the first infrared ray detecting portion; and a second pixel portion including a second cell portion including a second infrared ray detecting portion detecting the second infrared ray, and second supporting legs that support the second cell portion, the second supporting legs including a third and fourth wiring lines that convey an electrical signal obtained by the second infrared ray detecting portion.
摘要翻译： 一个实施例的红外成像元件包括：第一像素部分，包括第一单元部分，第一单元部分包括检测第一红外线的第一红外线检测部分和具有与第一红外线的波长不同的波长的第二红外线，以及第一 所述支撑腿支撑所述第一单元部分，所述第一支撑腿包括传送由所述第一红外线检测部分获得的电信号的第一和第二布线; 以及包括第二单元部分的第二像素部分，所述第二单元部分包括检测所述第二红外线的第二红外线检测部分和支撑所述第二单元部分的第二支撑腿，所述第二支撑腿包括传送电信号的第三和第四布线 由第二红外线检测部获得。
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公开(公告)号：US11199696B2
公开(公告)日：2021-12-14
申请号：US16552207
申请日：2019-08-27
发明人： Honam Kwon , Koichi Ishii , Ikuo Fujiwara , Kazuhiro Suzuki
摘要： According to an embodiment, a semiconductor device includes a first actuator, a second actuator, a first frame provided between the first actuator and the second actuator, a first connection member connecting the first actuator and the first frame to each other, a second connection member connecting the first actuator and the first frame to each other at a position different from a position at which the first connection member connects the first actuator and the first frame to each other, a third connection member connecting the second actuator and the first frame to each other, a fourth connection member connecting the second actuator and the first frame to each other at a position different from a position at which the third connection member connects the second actuator and the first frame to each other.
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10.发明授权公开(公告)号：US09857594B2
公开(公告)日：2018-01-02
申请号：US15009989
申请日：2016-01-29
发明人： Yuko Kizu , Yukio Kizaki , Honam Kwon , Machiko Ito , Risako Ueno , Mitsuyoshi Kobayashi , Koichi Ishii , Satoshi Takayama , Tsutomu Nakanishi , Takashi Sasaki , Ryosuke Nonaka , Tomoya Tsuruyama
CPC分类号： G02B27/0172 , G02B3/0056 , G02B3/0087 , G02B2027/0118 , G02F1/13318 , G02F1/133512 , G02F1/29 , G02F2001/294 , H04N5/2254
摘要： An optical device includes a light-shielding layer and a microlens array. The light-shielding layer includes a plurality of openings. The microlens array is divided into a plurality of microlenses corresponding to the respective plurality of openings. A refractive index of the microlens array is variable so that light is incident on the microlenses is focused on the respective plurality of openings. A portion where light is focused includes a central position of the corresponding opening.
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