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    OPTICAL COUPLING DEVICE
    1.
    发明申请
    OPTICAL COUPLING DEVICE 审中-公开

    公开(公告)号：US20170176519A1

    公开(公告)日：2017-06-22

    申请号：US15231319

    申请日：2016-08-08

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Naoya TAKAI

    IPC: G01R31/30 ,  H01L21/66

    CPC classification number: G01R31/3004 ,  G01R31/265 ,  G01R31/31728 ,  H01L22/34 ,  H01L31/167 ,  H02S40/44

    Abstract: An optical coupler device includes, on a substrate, a first light-receiving element coupled to a first light-emitting element and a second light-receiving element coupled to a second light-emitting element. First, second, and third terminals are disposed on the first substrate. A first transistor pair and a second transistor pair are disposed on the first substrate. The first transistor pair is configured to electrically connect and disconnect the first and second terminals in response to a first light signal received by the first light-receiving element. The second transistor pair is configured to electrically connect and disconnect the second and third terminals in response to a second light signal received by the second light-receiving element.

    PHOTORELAY
    2.
    发明申请
    PHOTORELAY 审中-公开
    光电

    公开(公告)号：US20150262985A1

    公开(公告)日：2015-09-17

    申请号：US14474042

    申请日：2014-08-29

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Naoya TAKAI ,  Mami YAMAMOTO ,  Yoshio NOGUCHI ,  Eiji NAKASHIMA

    IPC: H01L25/16 ,  H01L29/78 ,  H01L31/16 ,  H01L23/31 ,  H01L23/538

    CPC classification number: H01L25/167 ,  H01L23/3121 ,  H01L23/66 ,  H01L31/167 ,  H01L2224/0603 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13091 ,  H05K1/0243 ,  H05K1/141 ,  H05K2201/10053 ,  H01L2924/00 ,  H01L2224/4554

    Abstract: A photorelay includes an insulation board, input and output terminals, a die pad portion, a light receiving element, a light emitting element, a MOSFET, and a first sealing resin layer. The insulation board has first and second surfaces. The input terminal includes a first conductive region. The output terminal includes a first conductive region. The light receiving element is bonded on the die pad portion. The light emitting element is bonded on an exposed surface of the light receiving element, and connected to the first conductive region of the input terminal. The MOSFET is connected to the first conductive region of the output terminal. A connecting electrode is included as a part of the input or output terminal. Attachment conductive regions included respectively in the input and output terminals are provided on a side surface of the insulation board as the attachment surface of the photorelay to a wiring substrate.

    Abstract translation: 光电继电器包括绝缘板，输入和输出端子，芯片焊盘部分，光接收元件，发光元件，MOSFET和第一密封树脂层。 绝缘板具有第一和第二表面。 输入端子包括第一导电区域。 输出端子包括第一导电区域。 光接收元件接合在芯片焊盘部分上。 发光元件接合在受光元件的露出面上，与输入端子的第一导电区域连接。 MOSFET连接到输出端子的第一导电区域。 包括连接电极作为输入或输出端子的一部分。 分别包括在输入和输出端子中的附着导电区域设置在绝缘板的侧表面上，作为光电继电器的附着表面与布线基板。

    SEMICONDUCTOR DEVICE
    3.
    发明公开
    SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：US20240105889A1

    公开(公告)日：2024-03-28

    申请号：US18181072

    申请日：2023-03-09

    Applicant: Kabushiki Kaisha Toshiba ,  Toshiba Electronic Devices & Storage Corporation

    Inventor： Mami FUJIHARA ,  Toshihide OSANAI ,  Naoya TAKAI

    IPC: H01L33/56 ,  H01L33/38 ,  H01L33/62

    CPC classification number: H01L33/56 ,  H01L33/382 ,  H01L33/62

    Abstract: A semiconductor device includes an input-side lead, a light-emitting element on the input-side lead, an output-side lead, a switching element on the output-side lead, and a light-receiving element on the switching element. The switching element is provided between the light-emitting element and the output-side lead. The switching element includes a front-side electrode and a control pad arranged along a front surface side thereof. The light-receiving element is provided on the front-side electrode of the switching element via an insulative connection member. The light-receiving element is positioned between the first switching element and the light-emitting element. The light-receiving element includes first and second bonding pads; the first bonding pad is electrically connected to the control pad of the switching element via a first conductive member; and the second bonding pad is electrically connected to the front-side electrode of the switching element via a second conductive member.

    OPTICAL COUPLING DEVICE
    6.
    发明申请
    OPTICAL COUPLING DEVICE 审中-公开
    光耦合器件

    公开(公告)号：US20150262986A1

    公开(公告)日：2015-09-17

    申请号：US14474298

    申请日：2014-09-01

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Naoya TAKAI ,  Yoshio NOGUCHI ,  Mami YAMAMOTO

    IPC: H01L25/16 ,  H01L31/02 ,  H01L31/0216 ,  H01L31/167

    CPC classification number: H01L25/167 ,  H01L31/167 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: An optical coupling device includes a mounting member, a light receiving element, a first resin layer, a light emitting element, and a second resin layer. The mounting member includes an insulating layer having a recess in an upper surface thereof, input terminals, and output terminals insulated from the input terminals. The light receiving element is provided on a bottom surface of the recess. The first resin layer is provided in the recess and covers the light receiving element. The light emitting element is adhered to an upper surface of the first resin layer such that a lower surface of the light emitting element has a light emitting surface facing the light receiving surface, and is connected to the input terminals. The second resin layer covers the light emitting element, an upper surface of the insulating layer, the first resin layer, and the input terminals.

    Abstract translation: 光耦合装置包括安装构件，受光元件，第一树脂层，发光元件和第二树脂层。 安装构件包括在其上表面具有凹部的绝缘层，输入端子和与输入端子绝缘的输出端子。 光接收元件设置在凹部的底表面上。 第一树脂层设置在凹部中并覆盖光接收元件。 发光元件粘附到第一树脂层的上表面，使得发光元件的下表面具有面向光接收表面的发光表面，并且连接到输入端子。 第二树脂层覆盖发光元件，绝缘层的上表面，第一树脂层和输入端子。

    SEMICONDUCTOR RELAY DEVICE
    7.
    发明公开
    SEMICONDUCTOR RELAY DEVICE 审中-公开

    公开(公告)号：US20240154613A1

    公开(公告)日：2024-05-09

    申请号：US18413737

    申请日：2024-01-16

    Applicant: Kabushiki Kaisha Toshiba ,  Toshiba Electronic Devices & Storage Corporation

    Inventor： Naoya TAKAI ,  Yukihiro TAKIFUJI ,  Keita SAITO ,  Kazuki TANAKA

    IPC: H03K17/687 ,  H03K17/081 ,  H03K17/73

    CPC classification number: H03K17/6874 ,  H03K17/08108 ,  H03K17/73

    Abstract: A semiconductor relay device includes a conversion circuit configured to receive an input signal from outside and pass a first current to a first node based on the input signal. A zener diode has an anode coupled to a second node and a cathode coupled to the first node. A resistor is coupled between the second node and a third node. A number n of diodes are serially coupled. A thyristor has an anode coupled to the first node, a cathode coupled to the second node, and a control terminal coupled to the third node. A transistor has a gate coupled to the first node. An anode of a diode at a first end of the n diodes is coupled to the first node, and a cathode of a diode at a second end of the n diodes is coupled to a third node.

    SEMICONDUCTOR RELAY DEVICE
    8.
    发明申请
    SEMICONDUCTOR RELAY DEVICE 有权

    公开(公告)号：US20220416787A1

    公开(公告)日：2022-12-29

    申请号：US17902737

    申请日：2022-09-02

    Applicant: KABUSHIKI KAISHA TOSHIBA ,  TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION

    Inventor： Naoya TAKAI ,  Yukihiro TAKIFUJI ,  Keita SAITO ,  Kazuki TANAKA

    IPC: H03K17/687 ,  H03K17/081 ,  H03K17/73

    Abstract: A semiconductor relay device includes a conversion circuit configured to receive an input signal from outside and pass a first current to a first node based on the input signal. A zener diode has an anode coupled to a second node and a cathode coupled to the first node. A resistor is coupled between the second node and a third node. A number n of diodes are serially coupled. A thyristor has an anode coupled to the first node, a cathode coupled to the second node, and a control terminal coupled to the third node. A transistor has a gate coupled to the first node. An anode of a diode at a first end of the n diodes is coupled to the first node, and a cathode of a diode at a second end of the n diodes is coupled to a third node.

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