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公开(公告)号:US20230295416A1
公开(公告)日:2023-09-21
申请号:US18202649
申请日:2023-05-26
Applicant: KANEKA CORPORATION
Inventor: Toshihiko Okamoto
IPC: C08L63/00 , C09J163/00 , C09J11/06 , C09J11/08 , C08L51/08
CPC classification number: C08L63/00 , C09J163/00 , C09J11/06 , C09J11/08 , C08L51/08 , C08L2207/53
Abstract: A one-part curable resin composition contains 100 parts by weight of an epoxy resin (A), 1 to 100 parts by weight of core-shell-structured polymer particles and/or blocked urethane as a component (B), a compound (C) having one to three phenolic hydroxy groups per molecule, the compound (C) not being a compound having an amino group; and dicyandiamide (D). The ratio of the number of moles of the phenolic hydroxy groups of the compound (C) to the number of moles of CN groups derived from the dicyandiamide (D) is from 0.01 to 0.39 when the compound (C) has one phenolic hydroxy group per molecule and from 0.01 to 1.5 when the compound (C) has two or three phenolic hydroxy groups per molecule.
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公开(公告)号:US20210047546A1
公开(公告)日:2021-02-18
申请号:US17080422
申请日:2020-10-26
Applicant: KANEKA CORPORATION
Inventor: Toshihiko Okamoto
IPC: C09J163/00 , C09J11/08 , C09J5/06
Abstract: One or more embodiments of the present invention provide an adhesion method that provides excellent workability by using a curable resin composition whose viscosity has low temperature dependence. The method of adhesion includes a step of applying a curable resin composition, a step of spreading the curable resin composition, and a step of curing the curable resin composition. The curable resin composition contains specific amounts of an epoxy resin, fine polymer particles whose shell layers have a cyano group in a specific amount, and blocked urethane.
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公开(公告)号:US20190040290A1
公开(公告)日:2019-02-07
申请号:US16157255
申请日:2018-10-11
Applicant: Kaneka Corporation
Inventor: Toshihiko Okamoto
IPC: C09J163/10 , C09J133/14 , C09J133/12 , C09J11/08 , B32B7/12 , B32B15/04 , B32B27/06
Abstract: A curable composition includes 100 parts by mass of a flexible epoxy resin (A), 1 to 150 parts by mass of polymer fine particles (B), and 1 to 200 parts by mass of an epoxy curing agent (C). The flexible epoxy resin (A) has an epoxy equivalent of 350 to 4000 g/eq. The polymer fine particles (B) have a core-shell structure and comprise a core layer and a shell layer. The core layer has a glass transition temperature (Tg) of more than 0° C. as calculated by the formula: 1/Tg=Σ(Mi/Tgi), where Mi represents a mass fraction of a monomer unit i and Tgi represents a glass transition temperature (K) of a homopolymer composed of the monomer unit i. A cured product obtained by curing the curable composition has a type A durometer hardness of 5 to 95 at 23 CC as measured by the method of JIS K6253-3.
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公开(公告)号:US20180094176A1
公开(公告)日:2018-04-05
申请号:US15564890
申请日:2016-04-08
Applicant: Kaneka Corporation
Inventor: Toshihiko Okamoto , Shohei Nishimori
IPC: C09J163/00 , C09J11/08 , C09J175/08 , C08L63/00 , C08L51/04 , C08G59/62 , C08G18/80 , C08G18/58
CPC classification number: C09J163/00 , C08G18/58 , C08G18/80 , C08G59/62 , C08L51/04 , C08L63/00 , C08L75/04 , C09J11/08 , C09J175/04 , C09J175/08
Abstract: The present invention relates to a curable resin composition containing 100 parts by mass of an epoxy resin (A), 1 to 100 parts by mass of polymer fine particles (B), and 1 to 100 parts by mass of a blocked urethane (C), wherein the polymer fine particles have a core-shell structure of a core layer and a shell layer, the core layer contains diene rubber, the shell layer contains at least a hydroxyl group, and the content of the hydroxyl group of the polymer fine particles (B) is 0.01 to 0.8 mmol/g.
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公开(公告)号:US11781047B2
公开(公告)日:2023-10-10
申请号:US17831690
申请日:2022-06-03
Applicant: KANEKA CORPORATION
Inventor: Toshihiko Okamoto
IPC: C09J163/00 , C09J5/06 , C09J11/08
CPC classification number: C09J163/00 , C09J5/06 , C09J11/08
Abstract: A method of adhesion provides excellent workability by using a curable resin composition whose viscosity has low temperature dependence. The method of adhesion includes a step of heating a curable resin composition and applying a curable resin composition, a step of spreading the curable resin composition, and a step of curing the curable resin composition. The curable resin composition contains specific amounts of an epoxy resin, fine polymer particles that have a core-shell structure including a core layer and a shell layer, and blocked urethane having a latent NCO % of 0.1% to 2.9%.
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公开(公告)号:US20220290018A1
公开(公告)日:2022-09-15
申请号:US17831690
申请日:2022-06-03
Applicant: KANEKA CORPORATION
Inventor: Toshihiko Okamoto
IPC: C09J163/00 , C09J5/06 , C09J11/08
Abstract: A method of adhesion provides excellent workability by using a curable resin composition whose viscosity has low temperature dependence. The method of adhesion includes a step of heating a curable resin composition and applying a curable resin composition, a step of spreading the curable resin composition, and a step of curing the curable resin composition. The curable resin composition contains specific amounts of an epoxy resin, fine polymer particles that have a core-shell structure including a core layer and a shell layer, and blocked urethane having a latent NCO % of 0.1% to 2.9%.
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公开(公告)号:US20210214549A1
公开(公告)日:2021-07-15
申请号:US17213936
申请日:2021-03-26
Applicant: KANEKA CORPORATION
Inventor: Ayumi Teragaki , Toshihiko Okamoto
IPC: C08L63/00 , C09J163/00 , B32B7/12
Abstract: The present disclosure relates to a curable epoxy resin composition comprising an epoxy resin (A), a toughening agent (B), and a carboxyl group-containing non-cross-linked acrylic resin (C). A ratio between initial lap shear strength (F1) measured in accordance with JIS K 6850 before the curable epoxy resin composition is left to stand in an environment of saturated water vapor at 40° C. and lap shear strength after moisture absorption test (F2) measured in accordance with JIS K 6850 after the curable epoxy resin composition is left to stand for 3 days in the environment of saturated water vapor at 40° C. is 0.5 or more. Also, the present disclosure relates to a laminate in which a plurality of substrates are joined via a cured product of the curable epoxy resin composition.
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公开(公告)号:US10100195B2
公开(公告)日:2018-10-16
申请号:US14896295
申请日:2014-06-05
Applicant: KANEKA CORPORATION
Inventor: Toshihiko Okamoto , Shohei Nishimori
IPC: C08L75/04 , C08J5/24 , C09D175/04 , C09J175/04 , C08G18/75 , C08J9/00 , C08J9/02 , C08J5/04 , C09J11/08 , C08G18/48 , C08G18/76 , C08G18/24 , C08G18/42 , C09D7/65 , C08G101/00
Abstract: The present invention relates to a curable resin composition comprising a polyol (A) having an average hydroxyl value of 200 to 1500 mg KOH/g, a polyisocyanate (B), and polymer fine particles (C), and a curable resin composition comprising a polyol (A), a polyisocyanate (B), and polymer fine particles (C), wherein the polyol (A) comprises a polyester polyol (a2) as an essential component, and the amount of the polyester polyol (a2) is not less than 20 parts by mass per 100 parts by mass of the polyol (A).
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9.
公开(公告)号:US09976027B2
公开(公告)日:2018-05-22
申请号:US15033248
申请日:2014-10-28
Applicant: KANEKA CORPORATION
Inventor: Toshihiko Okamoto
CPC classification number: C08L63/00 , C08G59/063 , C08G59/14 , C08G59/1477 , C08K3/36 , C08L51/04 , C09J11/04 , C09J11/08 , C09J163/00
Abstract: A curable resin composition of the present invention contains 1 to 100 parts by mass of a polymer fine particle (B) relative to 100 parts by mass of an epoxy resin (A), wherein the polymer fine particle has a core-shell structure, the core layer of the polymer fine particle is diene rubber, the content of the epoxy group of the polymer fine particle (B) is 0.01 to 0.2 mmol/g. A curable resin composition (I) of the first embodiment contains 0.5 to 30 parts by mass of fumed silica as an inorganic filler (C). In addition, a curable resin composition (II) of the second embodiment contains bisphenol A epoxy resin and rubber-modified epoxy resin and/or urethane-modified epoxy resin as the epoxy resin (A).
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公开(公告)号:US20150266271A1
公开(公告)日:2015-09-24
申请号:US14432105
申请日:2013-09-12
Applicant: KANEKA CORPORATION
Inventor: Toshihiko Okamoto
CPC classification number: B32B17/064 , B32B17/10055 , B32B27/06 , B32B27/283 , B32B27/308 , B32B2250/02 , B32B2305/72 , B32B2307/412 , C03C17/324 , C03C27/10 , C09K3/1006 , C09K2200/0625 , Y10T428/31511 , Y10T428/31612 , Y10T428/31663
Abstract: A structure including a light-transmitting member, a joint formed by the member, and a cured product of a curable composition filling the joint, the curable composition containing: (A) a (meth)acrylate polymer having a number-average molecular weight of at least 8000 but not more than 50000 and containing per molecule on average 1.0-3.5 silyl groups capable of crosslinking through formation of a siloxane bond; (B) a (meth)acrylate polymer having a number-average molecular weight of at least 1000 but less than 8000 and containing per molecule on average 0.5-1.5 silyl groups capable of forming a siloxane bond; (D) a silanol condensation catalyst; (E) a silane coupling agent; and (F) an inorganic filler, a ratio of a sum of a weight “a” of the component (A) and a weight “b” of the component (B) to a total weight “x” of the curable composition excluding the component (F), (a+b)/x, being 60-99% by weight.
Abstract translation: 一种包括透光部件,由该部件形成的接头和填充接头的固化性组合物的固化物的结构,所述固化性组合物含有:(A)数均分子量为 至少8000,但不超过50000,并且每分子平均含有能够通过形成硅氧烷键交联的1.0-3.5个甲硅烷基; (B)数均分子量至少为1000但小于8000的(甲基)丙烯酸酯聚合物,并且平均每分子含有能形成硅氧烷键的0.5-1.5个甲硅烷基; (D)硅烷醇缩合催化剂; (E)硅烷偶联剂; 和(F)无机填料,组分(A)的重量“a”和组分(B)的重量“b”之和与除了组分(B)之外的可固化组合物的总重量“x” 组分(F),(a + b)/ x,为60-99重量%。
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