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    ONE-PART CURABLE RESIN COMPOSITION AND ADHESIVE
    1.
    发明公开
    ONE-PART CURABLE RESIN COMPOSITION AND ADHESIVE 审中-公开

    公开(公告)号：US20230295416A1

    公开(公告)日：2023-09-21

    申请号：US18202649

    申请日：2023-05-26

    Applicant: KANEKA CORPORATION

    Inventor： Toshihiko Okamoto

    IPC: C08L63/00 ,  C09J163/00 ,  C09J11/06 ,  C09J11/08 ,  C08L51/08

    CPC classification number: C08L63/00 ,  C09J163/00 ,  C09J11/06 ,  C09J11/08 ,  C08L51/08 ,  C08L2207/53

    Abstract: A one-part curable resin composition contains 100 parts by weight of an epoxy resin (A), 1 to 100 parts by weight of core-shell-structured polymer particles and/or blocked urethane as a component (B), a compound (C) having one to three phenolic hydroxy groups per molecule, the compound (C) not being a compound having an amino group; and dicyandiamide (D). The ratio of the number of moles of the phenolic hydroxy groups of the compound (C) to the number of moles of CN groups derived from the dicyandiamide (D) is from 0.01 to 0.39 when the compound (C) has one phenolic hydroxy group per molecule and from 0.01 to 1.5 when the compound (C) has two or three phenolic hydroxy groups per molecule.

    CURABLE COMPOSITION AND ADHESIVE
    3.
    发明申请
    CURABLE COMPOSITION AND ADHESIVE 审中-公开

    公开(公告)号：US20190040290A1

    公开(公告)日：2019-02-07

    申请号：US16157255

    申请日：2018-10-11

    Applicant: Kaneka Corporation

    Inventor： Toshihiko Okamoto

    IPC: C09J163/10 ,  C09J133/14 ,  C09J133/12 ,  C09J11/08 ,  B32B7/12 ,  B32B15/04 ,  B32B27/06

    Abstract: A curable composition includes 100 parts by mass of a flexible epoxy resin (A), 1 to 150 parts by mass of polymer fine particles (B), and 1 to 200 parts by mass of an epoxy curing agent (C). The flexible epoxy resin (A) has an epoxy equivalent of 350 to 4000 g/eq. The polymer fine particles (B) have a core-shell structure and comprise a core layer and a shell layer. The core layer has a glass transition temperature (Tg) of more than 0° C. as calculated by the formula: 1/Tg=Σ(Mi/Tgi), where Mi represents a mass fraction of a monomer unit i and Tgi represents a glass transition temperature (K) of a homopolymer composed of the monomer unit i. A cured product obtained by curing the curable composition has a type A durometer hardness of 5 to 95 at 23 CC as measured by the method of JIS K6253-3.

    CURABLE EPOXY RESIN COMPOSITION AND LAMINATE USING THE SAME
    7.
    发明申请
    CURABLE EPOXY RESIN COMPOSITION AND LAMINATE USING THE SAME 有权

    公开(公告)号：US20210214549A1

    公开(公告)日：2021-07-15

    申请号：US17213936

    申请日：2021-03-26

    Applicant: KANEKA CORPORATION

    Inventor： Ayumi Teragaki ,  Toshihiko Okamoto

    IPC: C08L63/00 ,  C09J163/00 ,  B32B7/12

    Abstract: The present disclosure relates to a curable epoxy resin composition comprising an epoxy resin (A), a toughening agent (B), and a carboxyl group-containing non-cross-linked acrylic resin (C). A ratio between initial lap shear strength (F1) measured in accordance with JIS K 6850 before the curable epoxy resin composition is left to stand in an environment of saturated water vapor at 40° C. and lap shear strength after moisture absorption test (F2) measured in accordance with JIS K 6850 after the curable epoxy resin composition is left to stand for 3 days in the environment of saturated water vapor at 40° C. is 0.5 or more. Also, the present disclosure relates to a laminate in which a plurality of substrates are joined via a cured product of the curable epoxy resin composition.

    STRUCTURAL BODY
    10.
    发明申请
    STRUCTURAL BODY 审中-公开
    结构体

    公开(公告)号：US20150266271A1

    公开(公告)日：2015-09-24

    申请号：US14432105

    申请日：2013-09-12

    Applicant: KANEKA CORPORATION

    Inventor： Toshihiko Okamoto

    IPC: B32B17/06 ,  B32B27/30 ,  B32B27/28 ,  B32B27/06

    CPC classification number: B32B17/064 ,  B32B17/10055 ,  B32B27/06 ,  B32B27/283 ,  B32B27/308 ,  B32B2250/02 ,  B32B2305/72 ,  B32B2307/412 ,  C03C17/324 ,  C03C27/10 ,  C09K3/1006 ,  C09K2200/0625 ,  Y10T428/31511 ,  Y10T428/31612 ,  Y10T428/31663

    Abstract: A structure including a light-transmitting member, a joint formed by the member, and a cured product of a curable composition filling the joint, the curable composition containing: (A) a (meth)acrylate polymer having a number-average molecular weight of at least 8000 but not more than 50000 and containing per molecule on average 1.0-3.5 silyl groups capable of crosslinking through formation of a siloxane bond; (B) a (meth)acrylate polymer having a number-average molecular weight of at least 1000 but less than 8000 and containing per molecule on average 0.5-1.5 silyl groups capable of forming a siloxane bond; (D) a silanol condensation catalyst; (E) a silane coupling agent; and (F) an inorganic filler, a ratio of a sum of a weight “a” of the component (A) and a weight “b” of the component (B) to a total weight “x” of the curable composition excluding the component (F), (a+b)/x, being 60-99% by weight.

    Abstract translation: 一种包括透光部件，由该部件形成的接头和填充接头的固化性组合物的固化物的结构，所述固化性组合物含有：（A）数均分子量为 至少8000，但不超过50000，并且每分子平均含有能够通过形成硅氧烷键交联的1.0-3.5个甲硅烷基; （B）数均分子量至少为1000但小于8000的（甲基）丙烯酸酯聚合物，并且平均每分子含有能形成硅氧烷键的0.5-1.5个甲硅烷基; （D）硅烷醇缩合催化剂; （E）硅烷偶联剂; 和（F）无机填料，组分（A）的重量“a”和组分（B）的重量“b”之和与除了组分（B）之外的可固化组合物的总重量“x” 组分（F），（a + b）/ x，为60-99重量％。

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