MEMORY DEVICE
    1.
    发明公开
    MEMORY DEVICE 审中-公开

    公开(公告)号:US20240324242A1

    公开(公告)日:2024-09-26

    申请号:US18605999

    申请日:2024-03-15

    CPC classification number: H10B61/10 H10N50/10 H10N50/80

    Abstract: According to one embodiment, a memory device includes a first wiring line extending along a first direction, a second wiring line provided on an upper layer side of the first wiring line and extending along a second direction intersecting the first direction, and a memory cell provided between the first wiring line and the second wiring line, and including a magnetoresistance effect element, a switching element, a middle electrode provided between the magnetoresistance effect element and the switching element, and a resistive layer provided between the magnetoresistance effect element and the second wiring line. A resistance of the resistive layer is higher than a resistance of the middle electrode.

    MAGNETIC MEMORY DEVICE
    5.
    发明公开

    公开(公告)号:US20230380183A1

    公开(公告)日:2023-11-23

    申请号:US18229133

    申请日:2023-08-01

    CPC classification number: H10B61/10 H10N50/01 H10N50/80

    Abstract: A magnetic memory device including a first memory cell which includes a first stacked structure including a magnetic layer and a second memory cell which is provided on the first memory cell and includes a second stacked structure including a magnetic layer. Each of the first stacked structure and the second stacked structure includes a first magnetic layer having a variable magnetization direction, a second magnetic layer having a fixed magnetization direction, and a nonmagnetic layer provided between the first magnetic layer and the second magnetic layer. A concentration of iron (Fe) contained in the first magnetic layer included in the first stacked structure and a concentration of iron (Fe) contained in the first magnetic layer included in the second stacked structure are different from each other.

    VARIABLE RESISTANCE ELEMENT
    6.
    发明申请

    公开(公告)号:US20210083007A1

    公开(公告)日:2021-03-18

    申请号:US16803933

    申请日:2020-02-27

    Abstract: According to one embodiment, a variable resistance element includes a first electrode, a second electrode, and a variable resistance layer and a tellurium-containing compound layer disposed between the first electrode and the second electrode. The tellurium-containing compound layer contains tellurium, oxygen, and at least one element selected from tin, copper, and bismuth. In some examples, the tellurium-containing compound layer can function as a switching layer in a memory cell structure.

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