Intraluminal ultrasound scanner with reduced diameter

    公开(公告)号:US11957508B2

    公开(公告)日:2024-04-16

    申请号:US16768849

    申请日:2018-12-10

    Abstract: Devices, systems, and methods relating to intraluminal imaging are disclosed. In an embodiment, an intraluminal imaging device is disclosed. One embodiment of the intraluminal imaging device comprises a flexible elongate member configured to be inserted into a body lumen of a patient, the flexible elongate member comprising a proximal portion and a distal portion. The intraluminal imaging device further comprises an ultrasound imaging assembly disposed at the distal portion of the flexible elongate member. The imaging assembly comprises a support member, a flexible substrate positioned around the support member, a plurality of ultrasound transducer elements integrated in the flexible substrate, and a plurality of control circuits disposed on the flexible substrate at a position proximal to the plurality of transducer elements. The plurality of control circuits has an outer profile that does not extend beyond an outer profile of the plurality of transducer elements.

    Multi-state clip-on fixation method for pulse oximeter

    公开(公告)号:US10441219B2

    公开(公告)日:2019-10-15

    申请号:US15551720

    申请日:2016-02-23

    Abstract: A device (10, 10′, 10″) includes a light source (12) and a light detector (14) spaced from, and in communication with, the light source (12). An electronic processor (18) is programmed to compute pulse oximetry data from output of the light detector (14). A clamping member (26) is included, on or in which the light source (12) and the light detector (14) are disposed. The clamping member (26) is configured for attachment to a human body part with the body part disposed between the light source (12) and the light detector (14) such that light from the light source (12) passes through the body part to reach the light detector (14). The clamping member (26) is configured to attach to the body part by transitioning from a first stable state to a second stable state via a compression force applied to the clamping member (26).

    LED PACKAGE WITH CAPACITIVE COUPLINGS
    4.
    发明申请
    LED PACKAGE WITH CAPACITIVE COUPLINGS 有权
    LED封装与电容耦合

    公开(公告)号:US20150289326A1

    公开(公告)日:2015-10-08

    申请号:US14434775

    申请日:2013-10-11

    Abstract: A light emitting diode, LED, package (2) arranged to emit light when connected to an AC power supply (30), comprising a first and a second LED package terminal (24, 26), at least one pair of diodes (20, 22) connected in anti-parallel between the LED package terminals (24, 26), wherein at least one of the diodes is a light emitting diode. The first LED package terminal (24) is detachably connectable to a first power supply terminal (34), and adapted to form a first capacitive coupling (14) together with the first power supply terminal (34), and the second LED package terminal (26) is detachably connectable to a second power supply terminal (36),and adapted to form a second capacitive coupling (16) together with the second power supply terminal (36). By providing electrical connections which are less sensitive to temperature dependent degradation, the life time of the LED package (2) may be increased.

    Abstract translation: 一种发光二极管,LED,封装(2),被布置成当连接到AC电源(30)时发光,包括第一和第二LED封装端子(24,26),至少一对二极管 22),其中所述LED封装端子(24,26)中的反并联连接,其中所述二极管中的至少一个是发光二极管。 第一LED封装端子(24)可拆卸地连接到第一电源端子(34),并且适于与第一电源端子(34)和第二LED封装端子(34)一起形成第一电容耦合器(14) 26)可拆卸地连接到第二电源端子(36),并且适于与第二电源端子(36)一起形成第二电容耦合器(16)。 通过提供对温度依赖性劣化不太敏感的电连接,可以增加LED封装(2)的使用寿命。

    LED package with capacitive couplings
    7.
    发明授权
    LED package with capacitive couplings 有权
    LED封装带电容耦合

    公开(公告)号:US09386640B2

    公开(公告)日:2016-07-05

    申请号:US14434775

    申请日:2013-10-11

    Abstract: A light emitting diode, LED, package (2) arranged to emit light when connected to an AC power supply (30), comprising a first and a second LED package terminal (24, 26), at least one pair of diodes (20, 22) connected in anti-parallel between the LED package terminals (24, 26), wherein at least one of the diodes is a light emitting diode. The first LED package terminal (24) is detachably connectable to a first power supply terminal (34), and adapted to form a first capacitive coupling (14) together with the first power supply terminal (34), and the second LED package terminal (26) is detachably connectable to a second power supply terminal (36), and adapted to form a second capacitive coupling (16) together with the second power supply terminal (36). By providing electrical connections which are less sensitive to temperature dependent degradation, the life time of the LED package (2) may be increased.

    Abstract translation: 一种发光二极管,LED,封装(2),被布置成当连接到AC电源(30)时发光,包括第一和第二LED封装端子(24,26),至少一对二极管 22),其中所述LED封装端子(24,26)中的反并联连接,其中所述二极管中的至少一个是发光二极管。 第一LED封装端子(24)可拆卸地连接到第一电源端子(34),并且适于与第一电源端子(34)和第二LED封装端子(34)一起形成第一电容耦合器(14) 26)可拆卸地连接到第二电源端子(36),并且适于与第二电源端子(36)一起形成第二电容耦合器(16)。 通过提供对温度依赖性劣化不太敏感的电连接,可以增加LED封装(2)的使用寿命。

    Simple LED package suitable for capacitive driving
    10.
    发明授权
    Simple LED package suitable for capacitive driving 有权
    简单的LED封装适用于电容驱动

    公开(公告)号:US09281299B2

    公开(公告)日:2016-03-08

    申请号:US14769832

    申请日:2014-02-14

    Abstract: The invention relates to a LED package (10) suitable for capacitive driving, comprising at least one pair of anti-parallel oriented LEDs (20, 30). These LEDs are provided with electrical terminals (21, 22, 31, 32) at opposing surfaces of the LEDs. The LEDs are sandwiched between two substantially parallel oriented substrates (40, 50) of a dielectric material, which substrates are provided on their facing surfaces (41, 51) with a film (42, 52) of electrically conductive material, so that electrical contacts (61, 62) are available between the electrical terminals and the films of electrically conductive material. The LED package is cheap, technically simple, reliable and small-dimensioned, and can be applied in a LED assembly. A method for manufacturing such LED packages is claimed as well.

    Abstract translation: 本发明涉及一种适用于电容驱动的LED封装(10),包括至少一对反平行取向的LED(20,30)。 这些LED在LED的相对表面处设置有电端子(21,22,31,32)。 LED夹在电介质材料的两个基本上平行的取向基板(40,50)之间,该基板在其相对的表面(41,51)上设置有导电材料的薄膜(42,52),使得电触点 (61,62)在电端子和导电材料膜之间可用。 LED封装价格便宜,技术简单,可靠,尺寸小,可应用在LED组件中。 也要求制造这种LED封装的方法。

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