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    METHOD FOR DETERMINING RELATIVE POSITION BETWEEN ARRAYS OF FLEXIBLE ARRAY DEVICE
    1.
    发明申请
    METHOD FOR DETERMINING RELATIVE POSITION BETWEEN ARRAYS OF FLEXIBLE ARRAY DEVICE 有权

    公开(公告)号：US20230086770A1

    公开(公告)日：2023-03-23

    申请号：US17273308

    申请日：2021-02-01

    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

    Inventor： Byung Chul LEE ,  Dong-Hyun KANG ,  Shinyong SHIM

    IPC: A61B8/00 ,  A61B8/08

    Abstract: The present disclosure relates to a method for determining a relative position between arrays of a flexible array device. The flexible array device according to an embodiment includes a plurality of arrays arranged at a predetermined interval in a deformable substrate, and the method includes measuring the first capacitance between adjacent arrays, measuring the second capacitance between the adjacent arrays after deformation of the substrate, and determining a relative position between the adjacent arrays based on the first capacitance measurement value and the second capacitance measurement value. According to an embodiment, the relative position between the arrays may be determined by measuring the capacitance between the adjacent arrays of the plurality of arrays arranged in the deformable substrate and measuring a change in capacitance caused by the deformation (contraction, relaxation, bending) of the substrate.

    CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER AND METHOD OF FABRICATING THE SAME
    2.
    发明申请
    CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER AND METHOD OF FABRICATING THE SAME 审中-公开

    公开(公告)号：US20200298275A1

    公开(公告)日：2020-09-24

    申请号：US16822018

    申请日：2020-03-18

    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

    Inventor： Byung Chul LEE ,  DONG-HYUN KANG ,  Jin soo PARK ,  Tae Song KIM

    IPC: B06B1/02 ,  B81B3/00 ,  B81C1/00

    Abstract: A method of fabricating a capacitive micromachined ultrasonic transducer (CMUT) according to one aspect of the present invention may include forming, on a semiconductor substrate, a first region implanted with impurity ions at a first average concentration and a second region implanted with no impurity ions or implanted with the impurity ions at a second average concentration lower than the first average concentration, forming an insulating layer by oxidizing the semiconductor substrate wherein the insulating layer includes a first oxide layer having a first thickness on at least a part of the first region and a second oxide layer having a second thickness smaller than the first thickness on at least a part of the second region, and forming a membrane layer on the insulating layer such that a gap is defined between the second oxide layer and the membrane layer.

    DIAGNOSIS SYSTEM USING ATTACHABLE PATCH TYPE ULTRASONIC TRANSDUCER
    5.
    发明公开
    DIAGNOSIS SYSTEM USING ATTACHABLE PATCH TYPE ULTRASONIC TRANSDUCER 审中-公开

    公开(公告)号：US20230210495A1

    公开(公告)日：2023-07-06

    申请号：US18070799

    申请日：2022-11-29

    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY ,  KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION

    Inventor： Byung Chul LEE ,  Kyung-Hee CHO

    IPC: A61B8/00 ,  A61B8/08

    CPC classification number: A61B8/4236 ,  A61B8/4488 ,  A61B8/0883 ,  A61M2205/18

    Abstract: An ultrasonic diagnosis system according to an embodiment of the present disclosure includes a plurality of ultrasonic output patches configured to be attachable to different body parts, a data receiving unit configured to receive data transmitted from the plurality of ultrasonic output patches, a processing unit configured to acquire an imaging result related to the body part by processing the data, and an output unit configured to output the imaging result related to the body part, in which the ultrasonic output patch includes a multichannel ultrasonic transducer array configured to output imaging ultrasonic waves toward the body part and receive the reflected ultrasonic waves, a signal processing module configured to process a signal transmitted to or received from the multichannel ultrasonic transducer array, and a communication module configured to transmit a signal processing result, which is acquired by the signal processing module, to the data receiving unit.

    APPARATUS AND METHOD FOR PRECISE MECHANICAL TISSUE ABLATION USING PRESSURE MODULATED FOCUSED ULTRASOUND
    7.
    发明申请
    APPARATUS AND METHOD FOR PRECISE MECHANICAL TISSUE ABLATION USING PRESSURE MODULATED FOCUSED ULTRASOUND 有权

    公开(公告)号：US20210169515A1

    公开(公告)日：2021-06-10

    申请号：US16857956

    申请日：2020-04-24

    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

    Inventor： Ki Joo PAHK ,  Hyung Min KIM ,  Byung Chul LEE ,  Inchan YOUN

    IPC: A61B17/32

    Abstract: An apparatus for tissue ablation according to an embodiment of the present disclosure includes an ultrasound output unit to output focused ultrasound, and a control unit to control an intensity of the focused ultrasound, wherein the control unit may be configured to control the intensity of the focused ultrasound below a setting value, when a first condition in which a vapor bubble is formed in a tissue or a second condition in which a temperature of the tissue reaches a threshold is accomplished during the output of the focused ultrasound to the tissue. According to this embodiment, it is possible to precisely control vapor bubble dynamics without generating the shockwave scattering effect by instantaneously controlling the acoustic pressure and the intensity of the focused ultrasound, and prevent damage to a tissue other than a lesion to be removed.

    HIGH-DENSITY NEURAL PROBES HAVING VARIOUS FORMS AND METHODS FOR MANUFACTURING THE SAME
    8.
    发明申请
    HIGH-DENSITY NEURAL PROBES HAVING VARIOUS FORMS AND METHODS FOR MANUFACTURING THE SAME 有权

    公开(公告)号：US20210240076A1

    公开(公告)日：2021-08-05

    申请号：US16923965

    申请日：2020-07-08

    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

    Inventor： MaeSoon IM ,  Byung Chul LEE ,  Young Jun YOON ,  Jin Soo PARK ,  Seung Min KWAK

    IPC: G03F7/004 ,  A61B5/04 ,  A61N1/05

    Abstract: Disclosed are a method for manufacturing a high-density neural probe including needles having various forms and a neural probe manufactured thereby. The method, in which only a photolithography process and an etching process are used, simplifies a manufacturing process of the neural probe, minimizes changes in the characteristics of the neural probe depending on process equipment or conditions, and may thus ensure a high yield, thereby being advantageous in terms of commercialization. In addition, various forms of needles may be manufactured depending on the shape of patterns included in a mask, the height of the needles may be controlled by adjusting the size of the patterns and the gap between the patterns, and thereby, a neural probe having a plurality of needles having different heights may be manufactured.

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