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45 条记录 (耗时 0.022 秒)

    Accelerometer
    1.
    发明申请
    Accelerometer 审中-公开

    公开(公告)号：US20170336433A1

    公开(公告)日：2017-11-23

    申请号：US15416700

    申请日：2017-01-26

    申请人： Kai Wang ,  Hu Chen ,  Guojun Liu

    发明人： Kai Wang ,  Hu Chen ,  Guojun Liu

    IPC分类号： G01P15/08

    CPC分类号： G01P15/0802 ,  G01P2015/0865

    摘要： An accelerometer is disclosed. The accelerometer includes an encapsulation structure provided with an accommodation space; a MEMS chip for detecting acceleration signal accommodated in the accommodation space; an ASIC chip received in the accommodation space. The ASIC chip includes a signal processing module connected to MEMS chip for processing the acceleration signal detected by the MEMS chip and outputting the processed acceleration signal. The accelerometer further includes a temperature detection module for detecting temperature signal and outputting the temperature signal.

    Pressure Transducer
    4.
    发明申请
    Pressure Transducer 审中-公开

    公开(公告)号：US20170336275A1

    公开(公告)日：2017-11-23

    申请号：US15416721

    申请日：2017-01-26

    申请人： Kai Wang ,  Hu Chen ,  Guojun Liu

    发明人： Kai Wang ,  Hu Chen ,  Guojun Liu

    IPC分类号： G01L1/26 ,  G01K13/00

    CPC分类号： G01L1/26 ,  G01K13/00 ,  G01L19/0092

    摘要： A pressure transducer is disclosed. The pressure transducer includes an encapsulation structure provided with an accommodation space; a MEMS chip for detecting pressure signal accommodated in the accommodation space; an ASIC chip received in the accommodation space. The ASIC chip includes a signal processing module connected to MEMS chip for processing the pressure signal detected by the MEMS chip and outputting the processed pressure signal. The pressure transducer further includes a temperature detection module for detecting temperature signal and outputting the temperature signal.

    MEMS Microphone
    6.
    发明申请
    MEMS Microphone 有权
    MEMS麦克风

    公开(公告)号：US20160381466A1

    公开(公告)日：2016-12-29

    申请号：US15006407

    申请日：2016-01-26

    申请人： Hu Chen ,  Kai Wang

    发明人： Hu Chen ,  Kai Wang

    IPC分类号： H04R19/04 ,  H04R19/00 ,  B81B7/02

    CPC分类号： H04R19/04 ,  B81B7/02 ,  B81B2201/0257 ,  B81B2203/0315 ,  B81B2207/015 ,  B81B2207/07 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H04R19/005 ,  H04R2201/003 ,  H01L2924/00014

    摘要： A MEMS microphone is disclosed in the present disclosure. The MEMS microphone includes a first circuit board; a second circuit board keeping a distance from the first circuit board; a frame located between the first circuit board and the second circuit board for forming a cavity cooperatively with the first circuit board and the second circuit board, the frame including a plated-through-hole; an ASIC chip located in the cavity; and an MEMS chip having a back cavity. The first circuit board is electrically connected with the second circuit board by the plated-through-hole. The frame includes a conductive layer and an insulating layer, and the conductive layer is located between an inner surface of the frame and the insulating layer.

    摘要翻译： 在本公开中公开了一种MEMS麦克风。 MEMS麦克风包括第一电路板; 与第一电路板保持距离的第二电路板; 所述框架位于所述第一电路板和所述第二电路板之间，用于与所述第一电路板和所述第二电路板协作地形成空腔，所述框架包括电镀通孔; 位于空腔中的ASIC芯片; 以及具有背腔的MEMS芯片。 第一电路板通过电镀通孔与第二电路板电连接。 该框架包括导电层和绝缘层，并且导电层位于框架的内表面和绝缘层之间。

    MEMS microphone
    7.
    发明授权
    MEMS microphone 有权

    公开(公告)号：US09992563B2

    公开(公告)日：2018-06-05

    申请号：US15417207

    申请日：2017-01-26

    申请人： Jinyu Zhang ,  Hu Chen

    发明人： Jinyu Zhang ,  Hu Chen

    IPC分类号： H04R19/04 ,  H04R1/02 ,  H04R19/00 ,  H04R1/08

    CPC分类号： H04R1/023 ,  B81B2201/0257 ,  H04R1/086 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H04R2499/11

    摘要： An MEMS microphone is provided in the present disclosure. The MEMS microphone includes a protective structure comprising a housing and a PCB substrate covering the housing to form a receiving space, the housing is provided with a sound hole, an MEMS chip with a back cavity, received in the receiving space and fixed on the PCB substrate, the back cavity is communicated with the sound hole, and the MEMS chip comprises a first surface away from the PCB substrate and a second surface opposite to the first surface; and a waterproof part, bonded to the first surface of the MEMS chip.

    Sharing virtual memory-based multi-version data between the heterogenous processors of a computer platform
    9.
    发明授权
    Sharing virtual memory-based multi-version data between the heterogenous processors of a computer platform 有权
    在计算机平台的异构处理器之间共享基于虚拟内存的多版本数据

    公开(公告)号：US08868848B2

    公开(公告)日：2014-10-21

    申请号：US12643803

    申请日：2009-12-21

    申请人： Ying Gao ,  Hu Chen ,  Shoumeng Yan ,  Xiaocheng Zhou ,  Sai Luo ,  Bratin Saha

    发明人： Ying Gao ,  Hu Chen ,  Shoumeng Yan ,  Xiaocheng Zhou ,  Sai Luo ,  Bratin Saha

    IPC分类号： G06F12/02

    CPC分类号： G06F12/109 ,  G06F9/466 ,  G06F9/544 ,  G06F15/167 ,  G06F2212/656 ,  G06F2212/657 ,  G06T1/20

    摘要： A computer system may comprise a computer platform and input-output devices. The computer platform may include a plurality of heterogeneous processors comprising a central processing unit (CPU) and a graphics processing unit (GPU) and a shared virtual memory supported by a physical private memory space of at least one heterogeneous processor or a physical shared memory shared by the heterogeneous processor. The CPU (producer) may create shared multi-version data and store such shared multi-version data in the physical private memory space or the physical shared memory. The GPU (consumer) may acquire or access the shared multi-version data.

    摘要翻译： 计算机系统可以包括计算机平台和输入 - 输出设备。 计算机平台可以包括多个异构处理器，包括中央处理单元（CPU）和图形处理单元（GPU）以及由至少一个异构处理器或物理共享存储器共享的物理专用存储器空间支持的共享虚拟存储器 由异构处理器。 CPU（生产者）可以创建共享的多版本数据，并将这种共享的多版本数据存储在物理专用存储空间或物理共享存储器中。 GPU（消费者）可以获取或访问共享的多版本数据。