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    Nonvolatile memory device and semiconductor device
    1.
    发明授权
    Nonvolatile memory device and semiconductor device 有权
    非易失性存储器件和半导体器件

    公开(公告)号：US07529126B2

    公开(公告)日：2009-05-05

    申请号：US11472993

    申请日：2006-06-23

    申请人： Toshihiro Tanaka ,  Takashi Yamaki ,  Yutaka Shinagawa ,  Daisuke Okada ,  Digh Hisamoto ,  Kan Yasui ,  Tetsuya Ishimaru

    发明人： Toshihiro Tanaka ,  Takashi Yamaki ,  Yutaka Shinagawa ,  Daisuke Okada ,  Digh Hisamoto ,  Kan Yasui ,  Tetsuya Ishimaru

    IPC分类号： G11C11/34 ,  G11C16/04

    CPC分类号： G11C16/10 ,  G11C16/0433

    摘要： Disclosed here is a method for speeding up data writing and reducing power consumption by reducing the variation of the threshold voltage of each of non-volatile memory cells at data writing. When writing data in a memory cell, a voltage of about 8V is applied to the memory gate line, a voltage of about 5V is applied to the source line, a voltage of about 1.5V is applied to the selected gate line respectively. At that time, in the writing circuit, the writing pulse is 0, the writing latch output a High signal, and a NAND-circuit outputs a Low signal. And, a constant current of about 1iA flows in a constant current source transistor and the bit line is discharged by a constant current of about 1iA to flow a current in the memory cell.

    摘要翻译： 这里公开了一种通过在数据写入时减小每个非易失性存储单元的阈值电压的变化来加速数据写入并降低功耗的方法。 当在存储单元中写入数据时，约8V的电压被施加到存储器栅极线，大约5V的电压被施加到源极线，大约1.5V的电压分别施加到所选择的栅极线。 此时，在写入电路中，写入脉冲为0，写入锁存器输出高电平信号，NAND电路输出低电平信号。 并且，在恒定电流源晶体管中流动约1iA的恒定电流，并且通过约1iA的恒定电流放电位线以使存储单元中的电流流动。

    Nonvolatile memory device and semiconductor device
    2.
    发明授权
    Nonvolatile memory device and semiconductor device 有权
    非易失性存储器件和半导体器件

    公开(公告)号：US07085157B2

    公开(公告)日：2006-08-01

    申请号：US10805365

    申请日：2004-03-22

    申请人： Toshihiro Tanaka ,  Takashi Yamaki ,  Yutaka Shinagawa ,  Daisuke Okada ,  Digh Hisamoto ,  Kan Yasui ,  Tetsuya Ishimaru

    发明人： Toshihiro Tanaka ,  Takashi Yamaki ,  Yutaka Shinagawa ,  Daisuke Okada ,  Digh Hisamoto ,  Kan Yasui ,  Tetsuya Ishimaru

    IPC分类号： G11C11/34 ,  G11C16/04

    CPC分类号： G11C16/10 ,  G11C16/0433

    摘要： A method for speeding up data writing and reducing power consumption by reducing the variation of the threshold voltage of each of non-volatile memory cells at data writing. When writing data in a memory cell, a voltage of about 8V is applied to the memory gate line, a voltage of about 5V is applied to the source line, a voltage of about 1.5V is applied to the selected gate line respectively. At that time, in the writing circuit, the writing pulse is 0, the writing latch output a High signal, and a NAND-circuit outputs a Low signal. And, a constant current of about 1 ìA flows in a constant current source transistor and the bit line is discharged by a constant current of about 1 ìA to flow a current in the memory cell.

    摘要翻译： 一种用于通过在数据写入时减小每个非易失性存储单元的阈值电压的变化来加速数据写入和降低功耗的方法。 当在存储单元中写入数据时，约8V的电压被施加到存储器栅极线，大约5V的电压被施加到源极线，大约1.5V的电压分别施加到所选择的栅极线。 此时，在写入电路中，写入脉冲为0，写入锁存器输出高电平信号，NAND电路输出低电平信号。 并且，在恒定电流源晶体管中流动约1AA的恒定电流，并且通过约1μA的恒定电流放电位线以使存储器单元中的电流流动。

    Non-volatile semiconductor memory device and writing method thereof
    3.
    发明授权
    Non-volatile semiconductor memory device and writing method thereof 有权
    非挥发性半导体存储器件及其写入方法

    公开(公告)号：US07339827B2

    公开(公告)日：2008-03-04

    申请号：US11147243

    申请日：2005-06-08

    申请人： Kan Yasui ,  Digh Hisamoto ,  Toshihiro Tanaka ,  Takashi Yamaki

    发明人： Kan Yasui ,  Digh Hisamoto ,  Toshihiro Tanaka ,  Takashi Yamaki

    IPC分类号： G11C16/06 ,  G11C16/32 ,  G11C5/06 ,  G11C16/08 ,  G11C16/24

    CPC分类号： G11C16/3418 ,  G11C16/0466 ,  G11C16/3427 ,  H01L27/115 ,  H01L29/4232 ,  H01L29/792

    摘要： In connection with rise and fall of a word line bias, the present invention adopts a procedure such that a diffusion region voltage Vs on a memory transistor side is changed, and after the voltage Vs passes a certain intermediate value Vsx, a gate voltage Vmg of the memory transistor is changed. Alternatively, there is adopted a procedure such that the gate voltage Vmg of the memory transistor is changed, and after the voltage Vmg passes a certain intermediate value Vmgx, the diffusion layer voltage Vs on the memory transistor side is changed. The values of Vsx and Vmgx are determined from the magnitude of the electric field in a gate insulating film not causing FN tunneling electron injection that causes a change in threshold voltage and the magnitude of a potential barrier against holes not causing BTBT hot hole injection.

    摘要翻译： 关于字线偏差的上升和下降，本发明采用使存储晶体管侧的扩散区电压Vs变化的过程，在电压Vs经过一定的中间值Vsx之后，栅极电压Vmg为 存储晶体管被改变。 或者，采用使存储晶体管的栅极电压Vmg改变的过程，并且在电压Vmg经过一定的中间值Vmgx之后，存储晶体管侧的扩散层电压Vs被改变。 Vsx和Vmgx的值由栅极绝缘膜中不引起FN隧穿电子注入的电场的大小确定，导致阈值电压的变化以及针对未引起BTBT热空穴注入的孔的势垒的大小。

    Nonvolatile memory device and semiconductor device
    4.
    发明申请
    Nonvolatile memory device and semiconductor device 有权
    非易失性存储器件和半导体器件

    公开(公告)号：US20060239072A1

    公开(公告)日：2006-10-26

    申请号：US11472993

    申请日：2006-06-23

    申请人： Toshihiro Tanaka ,  Takashi Yamaki ,  Yutaka Shinagawa ,  Daisuke Okada ,  Digh Hisamoto ,  Kan Yasui ,  Tetsuya Ishimaru

    发明人： Toshihiro Tanaka ,  Takashi Yamaki ,  Yutaka Shinagawa ,  Daisuke Okada ,  Digh Hisamoto ,  Kan Yasui ,  Tetsuya Ishimaru

    IPC分类号： G11C16/04 ,  G11C11/34

    CPC分类号： G11C16/10 ,  G11C16/0433

    摘要： Disclosed here is a method for speeding up data writing and reducing power consumption by reducing the variation of the threshold voltage of each of non-volatile memory cells at data writing. When writing data in a memory cell, a voltage of about 8V is applied to the memory gate line, a voltage of about 5V is applied to the source line, a voltage of about 1.5V is applied to the selected gate line respectively. At that time, in the writing circuit, the writing pulse is 0, the writing latch output a High signal, and a NAND-circuit outputs a Low signal. And, a constant current of about 1 iA flows in a constant current source transistor and the bit line is discharged by a constant current of about 1 iA to flow a current in the memory cell.

    摘要翻译： 这里公开了一种通过在数据写入时减小每个非易失性存储单元的阈值电压的变化来加速数据写入并降低功耗的方法。 当在存储单元中写入数据时，约8V的电压被施加到存储器栅极线，大约5V的电压被施加到源极线，大约1.5V的电压分别施加到所选择的栅极线。 此时，在写入电路中，写入脉冲为0，写入锁存器输出高电平信号，NAND电路输出低电平信号。 并且，在恒定电流源晶体管中流动约1IA的恒定电流，并且通过约1iA的恒定电流放电位线以使存储单元中的电流流动。

    Non-volatil semiconductor memory device and writing method thereof
    5.
    发明申请
    Non-volatil semiconductor memory device and writing method thereof 有权
    非挥发性半导体存储器件及其写入方法

    公开(公告)号：US20050285181A1

    公开(公告)日：2005-12-29

    申请号：US11147243

    申请日：2005-06-08

    申请人： Kan Yasui ,  Digh Hisamoto ,  Toshihiro Tanaka ,  Takashi Yamaki

    发明人： Kan Yasui ,  Digh Hisamoto ,  Toshihiro Tanaka ,  Takashi Yamaki

    IPC分类号： G11C16/02 ,  G11C16/04 ,  G11C16/34 ,  H01L21/8247 ,  H01L27/10 ,  H01L27/115 ,  H01L29/423 ,  H01L29/788 ,  H01L29/792

    CPC分类号： G11C16/3418 ,  G11C16/0466 ,  G11C16/3427 ,  H01L27/115 ,  H01L29/4232 ,  H01L29/792

    摘要： In a non-volatile semiconductor memory device using a charge storage film, it is intended to prevent a sequence disturb such as an erroneous write or erase of another memory cell on one and same word line which occurs depending on a bias transition path in stand-by state and write state. In connection with rise and fall of a word line bias, the present invention adopts a procedure such that a diffusion region voltage Vs on a memory transistor side is changed, and after the voltage Vs passes a certain intermediate value Vsx, a gate voltage Vmg of the memory transistor is changed. Alternatively, there is adopted a procedure such that the gate voltage Vmg of the memory transistor is changed, and after the voltage Vmg passes a certain intermediate value Vmgx, the diffusion layer voltage Vs on the memory transistor side is changed. The values of Vsx and Vmgx are determined from the magnitude of the electric field in a gate insulating film not causing FN tunneling electron injection that causes a change in threshold voltage and the magnitude of a potential barrier against holes not causing BTBT hot hole injection.

    摘要翻译： 在使用电荷存储膜的非易失性半导体存储器件中，旨在防止在根据独立的偏置过渡路径发生的同一字线上的另一个存储单元的错误写入或擦除的序列干扰， 按状态和写状态。 关于字线偏差的上升和下降，本发明采用使存储晶体管侧的扩散区电压Vs变化的过程，在电压Vs经过一定的中间值Vsx之后，栅极电压Vmg为 存储晶体管被改变。 或者，采用使存储晶体管的栅极电压Vmg改变的过程，并且在电压Vmg经过一定的中间值Vmgx之后，存储晶体管侧的扩散层电压Vs被改变。 Vsx和Vmgx的值由栅极绝缘膜中不引起FN隧穿电子注入的电场的大小确定，导致阈值电压的变化以及针对未引起BTBT热空穴注入的孔的势垒的大小。

    Semiconductor device
    7.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US07245531B2

    公开(公告)日：2007-07-17

    申请号：US11198191

    申请日：2005-08-08

    申请人： Tsutomu Okazaki ,  Daisuke Okada ,  Kyoya Nitta ,  Toshihiro Tanaka ,  Akira Kato ,  Toshikazu Matsui ,  Yasushi Ishii ,  Digh Hisamoto ,  Kan Yasui

    发明人： Tsutomu Okazaki ,  Daisuke Okada ,  Kyoya Nitta ,  Toshihiro Tanaka ,  Akira Kato ,  Toshikazu Matsui ,  Yasushi Ishii ,  Digh Hisamoto ,  Kan Yasui

    IPC分类号： G11C11/34

    CPC分类号： H01L27/1157 ,  G11C16/0425 ,  H01L21/28282 ,  H01L27/0207 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11568 ,  H01L29/0649 ,  H01L29/4234 ,  H01L29/42344 ,  H01L29/518 ,  H01L29/66833 ,  H01L29/792

    摘要： Memory cells are disposed in plural array form. Select gate electrodes of the memory cells arranged in an X direction are connected to one another by select gate lines respectively. Memory gate electrodes are connected by memory gate lines respectively. The memory gate lines respectively connected to the memory gate electrodes of the memory cells adjacent to one another through source regions interposed therebetween are not electrically connected to one another. Each of the select gate lines has a first portion that extends in the X direction, and a second portion 9b of which one end is connected to the first portion and extends in a Y direction. The memory gate line is formed on its corresponding sidewall of the select gate line with an insulating film interposed therebetween. The memory gate line has a contact section that extends in the X direction from over a second portion of the select gate line to over an element isolation region, and is connected to its corresponding wiring through a plug that buries a contact hole formed over the contact section.

    摘要翻译： 存储单元以多个阵列形式布置。 选择沿X方向布置的存储单元的选择栅电极分别通过选择栅极线彼此连接。 存储器栅极电极分别由存储器栅极线连接。 分别连接到彼此相邻的存储单元的存储器栅极的存储栅极线通过其间的源极区域彼此不电连接。 每个选择栅极线具有在X方向上延伸的第一部分和其一端连接到第一部分并沿Y方向延伸的第二部分9b。 存储栅极线在其选择栅线的相应侧壁上形成有介于其间的绝缘膜。 存储栅极线具有接触部分，该接触部分在选择栅极线的第二部分上方在X方向上延伸到元件隔离区域上方，并且通过塞子连接到其对应的布线，所述插头埋设形成在触点上的接触孔 部分。

    Semiconductor device
    8.
    发明申请
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US20060028868A1

    公开(公告)日：2006-02-09

    申请号：US11198191

    申请日：2005-08-08

    申请人： Tsutomu Okazaki ,  Daisuke Okada ,  Kyoya Nitta ,  Toshihiro Tanaka ,  Akira Kato ,  Toshikazu Matsui ,  Yasushi Ishii ,  Digh Hisamoto ,  Kan Yasui

    发明人： Tsutomu Okazaki ,  Daisuke Okada ,  Kyoya Nitta ,  Toshihiro Tanaka ,  Akira Kato ,  Toshikazu Matsui ,  Yasushi Ishii ,  Digh Hisamoto ,  Kan Yasui

    IPC分类号： G11C11/34 ,  G11C5/06

    CPC分类号： H01L27/1157 ,  G11C16/0425 ,  H01L21/28282 ,  H01L27/0207 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11568 ,  H01L29/0649 ,  H01L29/4234 ,  H01L29/42344 ,  H01L29/518 ,  H01L29/66833 ,  H01L29/792

    摘要： Memory cells are disposed in plural array form. Select gate electrodes of the memory cells arranged in an X direction are connected to one another by select gate lines respectively. Memory gate electrodes are connected by memory gate lines respectively. The memory gate lines respectively connected to the memory gate electrodes of the memory cells adjacent to one another through source regions interposed therebetween are not electrically connected to one another. Each of the select gate lines has a first portion that extends in the X direction, and a second portion 9b of which one end is connected to the first portion and extends in a Y direction. The memory gate line is formed on its corresponding sidewall of the select gate line with an insulating film interposed therebetween. The memory gate line has a contact section that extends in the X direction from over a second portion of the select gate line to over an element isolation region, and is connected to its corresponding wiring through a plug that buries a contact hole formed over the contact section.

    摘要翻译： 存储单元以多个阵列形式布置。 选择沿X方向布置的存储单元的选择栅电极分别通过选择栅极线彼此连接。 存储器栅极电极分别由存储器栅极线连接。 分别连接到彼此相邻的存储单元的存储器栅极的存储栅极线通过其间的源极区域彼此不电连接。 每个选择栅极线具有在X方向上延伸的第一部分和其一端连接到第一部分并沿Y方向延伸的第二部分9b。 存储栅极线在其选择栅线的相应侧壁上形成有介于其间的绝缘膜。 存储栅极线具有接触部分，该接触部分在选择栅极线的第二部分上方在X方向上延伸到元件隔离区域上方，并且通过塞子连接到其对应的布线，所述插头埋设形成在触点上的接触孔 部分。