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    OPTICAL FILM CUTTING METHOD AND OPTICAL FILM
    4.
    发明申请
    OPTICAL FILM CUTTING METHOD AND OPTICAL FILM 审中-公开
    光学薄膜切割方法和光学薄膜

    公开(公告)号：US20100116800A1

    公开(公告)日：2010-05-13

    申请号：US12438234

    申请日：2007-08-20

    申请人： Kanji NISHIDA ,  Atsushi HINO ,  Takaichi AMANO ,  Kazuo KITADA

    发明人： Kanji NISHIDA ,  Atsushi HINO ,  Takaichi AMANO ,  Kazuo KITADA

    IPC分类号： B23K26/38

    CPC分类号： B23K26/38 ,  B23K26/40 ,  B23K2101/18 ,  B23K2103/16 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50

    摘要： This invention relates to an optical film cutting method which includes cutting an optical film by irradiating the optical film with a laser beam under conditions that an energy per unit length is 0.12 to 0.167 J/mm and that a continuous irradiation time is 0.1 msec or less; as well as to an optical film that is cut by the cutting method and has a size of a raised part generated on a cutting surface thereof of 30 μm or less. According to the optical film cutting method of this invention, it is possible to maintain the raised part size on the optical film cutting surface as small as possible even in the case where the laser beam has characteristics of a gaussian beam, thereby enabling prevention of bonding defect and optical defect when the optical film is incorporated into various optical panels.

    摘要翻译： 本发明涉及一种光学膜切割方法，其包括：在每单位长度的能量为0.12〜0.167J / mm，连续照射时间为0.1msec以下的条件下，用激光照射光学膜切断光学膜 ; 以及通过切割方法切割并且在其切割表面上产生的凸起部分的尺寸为30μm以下的光学膜。 根据本发明的光学膜切割方法，即使在激光束具有高斯光束的特性的情况下，也可以将光学膜切割面上的隆起部分尺寸保持在尽可能小的位置，从而能够防止接合 当光学膜被并入各种光学面板时的缺陷和光学缺陷。

    THROUGH HOLE FORMING METHOD AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD
    5.
    发明申请
    THROUGH HOLE FORMING METHOD AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD 失效
    通孔形成方法和印刷电路板制造方法

    公开(公告)号：US20080005898A1

    公开(公告)日：2008-01-10

    申请号：US11766129

    申请日：2007-06-21

    申请人： Kanji NISHIDA ,  Naoyuki MATSUO ,  Masakatsu URAIRI

    发明人： Kanji NISHIDA ,  Naoyuki MATSUO ,  Masakatsu URAIRI

    IPC分类号： H05K3/00 ,  H05K3/02

    CPC分类号： H05K3/0038 ,  H05K3/0055 ,  H05K3/386 ,  H05K3/427 ,  H05K2203/107 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

    摘要： A first through hole is formed in a laminate by trepanning machining using laser light, for example. The trepanning machining refers to a process for irradiating laser light along such a trajectory that the laser light is first irradiated onto a substantially central area of a first through hole to be formed, the laser light is irradiated along a circumference corresponding to the bore diameter of the first through hole to be formed, and the laser light is finally irradiated onto the substantially central area of the first through hole to be formed again. A second through hole being substantially concentric with and having a larger bore diameter than the first through hole is formed by irradiating the laser light, similarly to the first through hole.

    摘要翻译： 例如，通过使用激光进行加工来形成层叠体中的第一贯通孔。 扫描加工是指沿着激光首先照射到要形成的第一通孔的大致中心区域的轨迹照射激光的处理，激光沿着对应于要形成的第一通孔的圆周照射 要形成的第一通孔，并且最终将激光照射到要再次形成的第一通孔的大致中心区域上。 与第一通孔类似地，通过照射激光来形成与第一通孔大致同心并且具有比第一通孔更大的第二通孔。