公开(公告)号：US08846197B2

公开(公告)日：2014-09-30

申请号：US11833002

申请日：2007-08-02

申请人： Tomonori Noguchi ,  Atsushi Hino ,  Kanji Nishida ,  Kazuo Kitada ,  Takaichi Amano

发明人： Tomonori Noguchi ,  Atsushi Hino ,  Kanji Nishida ,  Kazuo Kitada ,  Takaichi Amano

IPC分类号： B32B7/12 ,  B05D5/10 ,  C09J7/02 ,  C09J9/00

CPC分类号： C09J9/00 ,  B23K26/38 ,  B32B7/12 ,  C09J7/20 ,  Y10T428/14 ,  Y10T428/28

摘要： An impact-absorbing pressure-sensitive adhesive sheet according to an embodiment of the present invention includes an impact-absorbing pressure-sensitive adhesive layer including an impact-absorbing layer. A side surface of the impact-absorbing pressure-sensitive adhesive layer includes a tapered surface; and the tapered surface has a taper angle of 65° or more.

摘要翻译： 根据本发明实施方案的冲击吸收压敏粘合片包括包含冲击吸收层的冲击吸收压敏粘合剂层。 冲击吸收型压敏粘合剂层的侧表面包括锥形表面; 并且锥形表面具有65°或更大的锥角。

公开(公告)号：US08624156B2

公开(公告)日：2014-01-07

申请号：US11331674

申请日：2006-01-13

申请人： Naoyuki Matsuo ,  Masakatsu Urairi ,  Atsushi Hino

发明人： Naoyuki Matsuo ,  Masakatsu Urairi ,  Atsushi Hino

IPC分类号： B23K26/00

CPC分类号： H05K3/0026 ,  B23K26/38 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/05 ,  B23K2103/08 ,  B23K2103/172 ,  B23K2103/26 ,  B23K2103/30 ,  B23K2103/34 ,  B23K2103/38 ,  B23K2103/40 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54 ,  B23K2103/56 ,  H05K2201/0112 ,  H05K2203/1383

摘要： Providing a method of manufacturing a laser processed part by using a protective sheet for laser processing capable of effectively suppressing contamination of surface of workpiece by decomposition product, and processing at high precision, when processing the workpiece by optical absorption ablation of laser beam. It is also an object to present a protective sheet for laser processing for use in the manufacturing method of laser processed part.

摘要翻译： 提供一种通过使用激光加工用保护片，通过激光束的光吸收烧蚀对工件进行加工时，能够有效地抑制由分解物产生的工件的表面的污染，以及高精度的加工来制造激光加工部件的方法。 本发明的目的还在于提供一种用于激光加工部件的制造方法的激光加工用保护片。

公开(公告)号：US06642478B2

公开(公告)日：2003-11-04

申请号：US10251820

申请日：2002-09-23

申请人： Kanji Nishida ,  Hitoshi Ishizaka ,  Atsushi Hino

发明人： Kanji Nishida ,  Hitoshi Ishizaka ,  Atsushi Hino

IPC分类号： B23K2638

CPC分类号： B23K26/0626 ,  B23K26/06 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/35 ,  B23K2101/40 ,  B23K2103/05 ,  B23K2103/08 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/26 ,  B23K2103/42 ,  B23K2103/50 ,  H05K1/0393 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/427 ,  H05K2203/108

摘要： An ultraviolet beam with high energy density is applied for forming an opening in an electric conductor layer 1 in a flexible wiring board whereas an ultraviolet beam with low energy density is applied for forming an opening in an electrically insulating layer 2 in the flexible wiring board. As a result, excessive heat energy applied for forming a via hole can be reduced, so that the problems can be reduced. In this manner, high quality of the via hole and delicate and accurate processability due to use of the ultraviolet laser beam can be combined to achieve formation of fine patterns densely in the flexible wiring board.

公开(公告)号：US6157084A

公开(公告)日：2000-12-05

申请号：US913571

申请日：1997-09-17

申请人： Atsushi Hino ,  Toshiki Naito ,  Masakazu Sugimoto

发明人： Atsushi Hino ,  Toshiki Naito ,  Masakazu Sugimoto

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H05K3/40 ,  H05K3/42 ,  H01L23/48 ,  H01L23/40 ,  H01L23/52

CPC分类号： H01L23/564 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/31 ,  H05K3/4007 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83951 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/10378 ,  H05K2203/1572 ,  H05K3/423

摘要： A semiconductor device capable of meeting the demand for fine-pitched wiring of semiconductor element and highly dense mounting thereof, as well as the demand for a thin structure thereof, which device being superior in the adhesion property of an insulating resin to be used for sealing a semiconductor element and a film carrier, and thus highly reliable. In FIG. 1, a conductive circuit (5) is embedded so that it will not be exposed at the both surfaces (6a, 6b) of an insulator layer (6), and conductive paths (7, 8) are formed in a pair from the both surfaces (5a, 5b) of the conductive circuit (5), the conductive paths slipping relative to each other in the direction of the surface of the conductive circuit (5). The conductive paths (7, 8) are respectively connected to bumps (9, 10), and the conductive circuit (5) and bumps (9, 10) are conducted via conductive paths (7, 8). The bump (9) formed on one end of the one conductive path (7) of the film carrier (2) contacts an electrode (12) of the semiconductor element (3) and is electrically connected, whereby the semiconductor element (3) is mounted on the film carrier (2). An insulating resin layer (4) is formed on one surface (6a) of the insulator layer (6) to cover the semiconductor element (3).

摘要翻译： PCT No.PCT / JP95 / 00493 Sec。 371日期1997年9月17日 102（e）日期1997年9月17日PCT 1995年3月17日提交的能够满足对半导体元件的精细布线的需求和高密度安装的半导体器件，以及对其薄型结构的需求， 器件在用于密封半导体元件和薄膜载体的绝缘树脂的粘合性方面优异，因此高度可靠。 在图 如图1所示，嵌入导电电路（5），使其不会在绝缘体层（6）的两个表面（6a，6b）处露出，并且导电路径（7,8）从两者形成成对 导电电路（5）的表面（5a，5b），导电路径在导电电路（5）的表面方向上相对于彼此滑动。 导电路径（7,8）分别连接到凸块（9,10），并且导电电路（5）和凸块（9,10）通过导电路径（7,8）传导。 形成在薄膜载体（2）的一个导电路径（7）的一端上的凹凸（9）与半导体元件（3）的电极（12）接触并被电连接，由此半导体元件 安装在胶片载体（2）上。 绝缘树脂层（4）形成在绝缘体层（6）的一个表面（6a）上以覆盖半导体元件（3）。

公开(公告)号：US5848465A

公开(公告)日：1998-12-15

申请号：US740385

申请日：1996-10-29

申请人： Atsushi Hino ,  Shoji Morita ,  Masakazu Sugimoto

发明人： Atsushi Hino ,  Shoji Morita ,  Masakazu Sugimoto

IPC分类号： G01R1/06 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H05K3/06

CPC分类号： G01R3/00 ,  G01R1/07314 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49865 ,  Y10T29/49867

摘要： A method for fabrication of a probe includes the steps of: (1) forming a structure wherein a contact part formed on one side of an insulating flexible substrate and a conductor formed on either side or the inside of the flexible substrate are electrically continued, and (2) joining the flexible substrate and a rigid frame substrate capable of supporting the tension in the planar direction of the flexible substrate at the outer periphery thereof, by bonding them by lamination pressing after heating, or by heating after lamination pressing, thereby applying a planar tension to the flexible substrate enclosed by the rigid substrate.

摘要翻译： 一种用于制造探针的方法包括以下步骤：（1）形成其中形成在绝缘柔性基板的一侧上的接触部分和形成在柔性基板的任一侧或内侧上的导体电连续的结构，以及 （2）将柔性基板和能够在其外周面支撑柔性基板的平面方向的张力的刚性框架基板接合，通过在加热后通过层叠压接，或者在层叠压制之后进行加热， 由柔性基板包围的柔性基板的平面张力。

公开(公告)号：US5136359A

公开(公告)日：1992-08-04

申请号：US629897

申请日：1990-12-19

申请人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

发明人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

IPC分类号： H01B5/16 ,  H01L23/48 ,  H01L29/40 ,  H01L49/00 ,  H01R9/00

CPC分类号： H01R12/714

摘要： An anisotropic conductive film is disclosed, comprising an insulating film having fine through-holes independently piercing the film in the thickness direction, each of the through-holes being filled with a metallic substance in such a manner that at least one end of each through-hole has a bump-like projection of said metallic substance having a bottom area larger than the opening of the through-hole. The metallic substance serving as a conducting path is prevented from falling off, and sufficient conductivity can be thus assured.

公开(公告)号：US4916009A

公开(公告)日：1990-04-10

申请号：US224612

申请日：1988-07-27

申请人： Atsushi Hino ,  Yuzuru Noda

发明人： Atsushi Hino ,  Yuzuru Noda

IPC分类号： B32B15/088 ,  B32B15/08 ,  C08G73/10 ,  H01L23/495 ,  H05K1/00 ,  H05K1/03 ,  H05K3/38

CPC分类号： C08G73/1042 ,  B32B15/08 ,  H01L23/49586 ,  H05K1/0346 ,  H01L2924/0002 ,  H05K1/0393 ,  Y10T428/266 ,  Y10T428/269 ,  Y10T428/31681 ,  Y10T428/31721

摘要： A flexible printing base comprising a metal foil having formed thereon a polyimide layer is disclosed, wherein said metal foil has a centerline average roughness of not more than 0.7 .mu.m, and said polyimide mainly comprises a repeating unit represented by formula (I): ##STR1## and a repeating unit represented by formula (II): ##STR2## wherein l:m=x:y, wherein x represents a number not less than 45 and less than 70; y represents a number more than 30 and not more than 55; and x+y=100, said polyimide layer is formed by applying a solution of a polyamic acid mainly comprising a repeating unit represented by formula (III): ##STR3## and a repeating unit represented by formula (IV): ##STR4## wherein l and m are as defined above, in N,N'-dimethylformamide and/or N,N'-dimethylacetamide on a metal foil, followed by imidation. The flexible printing base is quite free from curling either in the state of a composite laminate but also in the state where the metal foil has been removed by etching.

摘要翻译： 公开了一种柔性印刷基底，其包括在其上形成有聚酰亚胺层的金属箔，其中所述金属箔的中心线平均粗糙度不大于0.7μm，所述聚酰亚胺主要包含由式（I）表示的重复单元： （I）和式（II）表示的重复单元：其中l：m = x：y，其中x表示不小于45且小于70的数; y表示多于30且不超过55的数字; 并且x + y = 100，所述聚酰亚胺层通过施加主要包含由式（III）表示的重复单元的聚酰胺酸的溶液形成：（III）和由式（IV）表示的重复单元： （IV）其中l和m如上定义，在金属箔上的N，N'-二甲基甲酰胺和/或N，N'-二甲基乙酰胺中，随后进行酰亚胺化。 柔性印刷基材在复合层压板的状态下也是完全没有卷曲，而且在通过蚀刻去除金属箔的状态下也是如此。

公开(公告)号：US07858543B2

公开(公告)日：2010-12-28

申请号：US11834353

申请日：2007-08-06

申请人： Naoyuki Matsuo ,  Atsushi Hino ,  Masayuki Kaneto

发明人： Naoyuki Matsuo ,  Atsushi Hino ,  Masayuki Kaneto

IPC分类号： B32B5/26

CPC分类号： B29C66/1122 ,  B29C65/1616 ,  B29C65/1635 ,  B29C65/1638 ,  B29C65/1654 ,  B29C65/8207 ,  B29C65/8253 ,  B29C66/342 ,  B29C66/43 ,  B29C66/65 ,  B29C66/71 ,  B29C66/723 ,  B29C66/72328 ,  B29C66/7292 ,  B29C66/73921 ,  B29C66/8122 ,  B29C66/81267 ,  B29C66/8322 ,  B29C66/9161 ,  B29C66/919 ,  B29C66/934 ,  B29C66/939 ,  B29C2035/0822 ,  B29K2105/0854 ,  B29K2277/10 ,  B29K2711/12 ,  B29K2909/08 ,  B29K2995/0027 ,  B29L2009/00 ,  B32B7/12 ,  B32B27/02 ,  B32B27/08 ,  B32B27/12 ,  B32B27/34 ,  B32B27/36 ,  Y10T428/31504 ,  Y10T428/31728 ,  Y10T442/659 ,  B29K2077/10

摘要： In a resin joined body including at least one member made of a resin material that forms a first resin layer and a second resin layer, the at least one of the first and second resin layers having the rear side from which the laser beam has been irradiated has an absorption constant of 50 to 5000 m−1 for the wavelength of the laser beam, and the fuse bonded portion is formed to have a relationship of X>Y, wherein a light transmittance of light passing from the first resin layer to the second resin layer via the fused portion is designated as X(%), and a light transmittance of light passing continuously from the first resin layer to the second resin layer via a portion other than the fused portion is designated as Y(%).

摘要翻译： 在包括由形成第一树脂层和第二树脂层的树脂材料制成的至少一个构件的树脂接合体中，所述第一树脂层和第二树脂层中的至少一个具有从其被照射的激光束的后侧 对于激光束的波长具有50至5000m-1的吸收常数，并且熔丝接合部分形成为具有X> Y的关系，其中从第一树脂层到第二树脂层的光的透光率 通过熔融部分的树脂层被指定为X（％），并且经由熔融部分以外的部分从第一树脂层连续地通过第二树脂层的光的透光率被指定为Y（％）。

公开(公告)号：US20100028606A1

公开(公告)日：2010-02-04

申请号：US12442219

申请日：2007-09-11

申请人： Kanji Nishida ,  Atsushi Hino ,  Takaichi Amano ,  Kazuo Kitada

发明人： Kanji Nishida ,  Atsushi Hino ,  Takaichi Amano ,  Kazuo Kitada

IPC分类号： B32B3/00 ,  B29D11/00

CPC分类号： B23K26/0732 ,  B23K26/38 ,  B23K26/40 ,  B23K2103/172 ,  G02B5/3033 ,  Y10T428/24479

摘要： This invention relates to an optical film cutting method, which includes: a laser beam generation step of performing a waveform shaping of a laser beam to generate a laser beam having a rectangular waveform, and a cutting step of irradiating an optical film with the laser beam obtained by the laser beam generation step and having a rectangular waveform to thereby cut the optical film; as well as to an optical film that is cut by the cutting method and having a size of a raised part generated on a cutting surface thereof of 30 μm or less. According to the optical film cutting method of this invention, it is possible to provide an optical film cutting method for cutting an optical film such as a polarizing film by not using a gaussian beam but using a laser beam of which a waveform is shaped into a rectangular waveform, which is capable of maintaining a raised part size as small as possible in a cutting surface of the optical film and preventing generation of bonding defect and optical defect when the optical film is incorporated into various optical panels.

摘要翻译： 本发明涉及一种光学膜切割方法，该方法包括：激光束产生步骤，执行激光束的波形整形以产生具有矩形波形的激光束;以及切割步骤，用激光束照射光学膜 通过激光束产生步骤获得并具有矩形波形从而切割光学膜; 以及通过切割方法切割并且具有在其切割表面上产生的凸起部分的尺寸为30μm或更小的光学膜。 根据本发明的光学膜切割方法，可以提供一种用于通过不使用高斯光束来切割诸如偏振膜的光学膜的光学膜切割方法，但是使用其波形被形成为 矩形波形，其能够在光学膜的切割表面中保持尽可能小的凸起部分尺寸，并且当将光学膜结合到各种光学面板中时防止粘合缺陷和光学缺陷的产生。

公开(公告)号：US20090199950A1

公开(公告)日：2009-08-13

申请号：US12422907

申请日：2009-04-13

申请人： Kazuo KITADA ,  Yoshihiro KAMEDA ,  Kanji NISHIDA ,  Tomokazu YURA ,  Takaichi AMANO ,  Hiromichi OHASHI ,  Atsushi HINO ,  Naoyuki MATSUO

发明人： Kazuo KITADA ,  Yoshihiro KAMEDA ,  Kanji NISHIDA ,  Tomokazu YURA ,  Takaichi AMANO ,  Hiromichi OHASHI ,  Atsushi HINO ,  Naoyuki MATSUO

IPC分类号： B32B38/10 ,  B32B41/00

CPC分类号： G02F1/133305 ,  B23K26/0846 ,  B23K26/40 ,  B23K2101/16 ,  B23K2103/172 ,  B29D11/0073 ,  B32B37/182 ,  B32B38/0004 ,  B32B38/10 ,  B32B41/00 ,  B32B2041/04 ,  B32B2305/55 ,  B32B2307/40 ,  B32B2307/42 ,  B32B2310/0843 ,  B32B2457/202 ,  G01N21/8422 ,  G02B5/3016 ,  G02F1/1303 ,  G02F1/133528 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T156/12

摘要： [Objects] To make it possible to carry out automatically and accurately a laminating operation of an optical element to a sheet-shaped body.[Means for Accomplishing the Objects] A strip-shaped polarizing film has a protective film strip conformably adhered to one surface thereof and a releasable liner conformably adhered to the other surface thereof and delivered from a film delivering station 1. After an appearance inspection, a lamination of the protective film strip and the polarizing film strip F is half-cut using a laser unit 11 to form an array of laminations each consisting of a protective film and a polarizing film F, with the releasable liner being left intact. Then, the polarizing films F are fed to a peeling mechanism 4. The peeling mechanism 4 feeds a forwardmost one the polarizing films F to a laminating mechanism 5 while peeling off the releasable liner therefrom by a knife-edged member. The forwardmost polarizing film F is laminated to a liquid-crystal panel W conveyed to the laminating mechanism by a panel transport apparatus 18 in synchronization of the feeding of the forwardmost polarizing film F.

摘要翻译： [物体]为了能够自动且准确地执行光学元件到片状体的层压操作。 [实现对象的手段]条状偏振膜具有与其一个表面一致地粘合的保护膜条带和与其另一表面一致地粘合并从胶片输送台1输送的可剥离衬垫。在外观检查之后， 使用激光单元11对保护膜条和偏光膜条F的层压进行半切割，以形成各自由保护膜和偏振膜F组成的叠片阵列，其中可剥离衬垫保持不变。 然后，将偏光膜F供给到剥离机构4.剥离机构4将偏光膜F的最前面的一个将切割薄膜F的层叠机构5向刀片边缘部件剥离。 最前面的偏振片F与最前方的偏振片F的馈送同步地层叠到通过面板传送装置18输送到层叠机构的液晶面板W.