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    Through hole forming method
    7.
    发明授权
    Through hole forming method 失效
    通孔成型方法

    公开(公告)号：US07665208B2

    公开(公告)日：2010-02-23

    申请号：US11766129

    申请日：2007-06-21

    申请人： Kanji Nishida ,  Naoyuki Matsuo ,  Masakatsu Urairi

    发明人： Kanji Nishida ,  Naoyuki Matsuo ,  Masakatsu Urairi

    IPC分类号： H01K3/10 ,  B05D5/12

    CPC分类号： H05K3/0038 ,  H05K3/0055 ,  H05K3/386 ,  H05K3/427 ,  H05K2203/107 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

    摘要： A first through hole is formed in a laminate by trepanning machining using laser light, for example. The trepanning machining refers to a process for irradiating laser light along such a trajectory that the laser light is first irradiated onto a substantially central area of a first through hole to be formed, the laser light is irradiated along a circumference corresponding to the bore diameter of the first through hole to be formed, and the laser light is finally irradiated onto the substantially central area of the first through hole to be formed again. A second through hole being substantially concentric with and having a larger bore diameter than the first through hole is formed by irradiating the laser light, similarly to the first through hole.

    摘要翻译： 例如，通过使用激光进行加工来形成层叠体中的第一贯通孔。 扫描加工是指沿着激光首先照射到要形成的第一通孔的大致中心区域的轨迹照射激光的处理，激光沿着对应于要形成的第一通孔的圆周照射 要形成的第一通孔，并且最终将激光照射到要再次形成的第一通孔的大致中心区域上。 与第一通孔类似地，通过照射激光来形成与第一通孔大致同心并且具有比第一通孔更大的第二通孔。

    Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure-sensitive adhesive tape or sheet, and wiring circuit board
    8.
    发明申请
    Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure-sensitive adhesive tape or sheet, and wiring circuit board 审中-公开
    热固性粘合剂和压敏粘合剂组合物，热固性粘合剂和压敏胶带或片材和布线电路板

    公开(公告)号：US20070036953A1

    公开(公告)日：2007-02-15

    申请号：US11502376

    申请日：2006-08-11

    申请人： Takahiro Nonaka ,  Miyoko Ikishima ,  Kanji Nishida ,  Masahiro Ooura

    发明人： Takahiro Nonaka ,  Miyoko Ikishima ,  Kanji Nishida ,  Masahiro Ooura

    IPC分类号： B32B3/00

    CPC分类号： H05K3/386 ,  C08L61/06 ,  C08L2666/02 ,  C09J133/08 ,  C09J2201/606 ,  H05K3/0032 ,  H05K3/0058 ,  H05K3/281 ,  H05K2201/0112 ,  H05K2201/0355 ,  Y10T428/24917

    摘要： A thermosetting adhesive and pressure-sensitive adhesive composition containing 100 parts by weight of an acrylic polymer (X) containing, as monomer components, a (meth)acrylic acid alkyl ester (a) where the alkyl group has 2 to 14 carbon atoms in an amount of 60 to 75% by weight relative to the total amount of monomer components, a cyano group-containing monomer (b) in an amount of 20 to 35% by weight relative to the total amount of monomer components, and a carboxyl group-containing monomer (c) in an amount of 0.5 to 10% by weight relative to the total amount of monomer components and 1 to 20 parts by weight of a carbolic acid-based resorcinol-type phenol resin (Y) represented by the following formula (1), and further containing an ultraviolet absorbent (Z). wherein R1 represents —CH2— or —CH2—O—CH2—, n is a positive integer, and m is an integer of 1 to 4.

    摘要翻译： 含有100重量份丙烯酸类聚合物（X）的热固性粘合剂和压敏粘合剂组合物，其含有（甲基）丙烯酸烷基酯（a）作为单体组分，其中烷基具有2至14个碳原子 相对于单体成分的总量为60〜75重量％的含氰基单体（b），相对于单体成分的总量为20〜35重量％ 含有单体（c）的量相对于单体成分的总量为0.5〜10重量％，和1〜20重量份由下式表示的碳酸间苯二酚型酚醛树脂（Y） 1），并且还含有紫外线吸收剂（Z）。 其中R 1表示-CH 2 - 或-CH 2 -O-CH 2 - ，n是 正整数，m为1〜4的整数。