专利检索 ap:("Karl Adolf Dieter Mayer" OR "Guenter Tutsch" OR "Horst Theuss" OR "Manfred Engelhardt" OR "Joachim Mahler") AND inv:"Guenter Tutsch" 第 1 页

1.

发明授权
Chip packages and methods for manufacturing a chip package 有权

公开(公告)号：US09666452B2

公开(公告)日：2017-05-30

申请号：US13480513

申请日：2012-05-25

申请人： Karl Adolf Dieter Mayer , Guenter Tutsch , Horst Theuss , Manfred Engelhardt , Joachim Mahler

发明人： Karl Adolf Dieter Mayer , Guenter Tutsch , Horst Theuss , Manfred Engelhardt , Joachim Mahler

IPC分类号： H01L21/44 , H01L21/00 , H01L21/56 , H01L23/00 , H01L21/78

CPC分类号： H01L21/561 , H01L21/78 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/94 , H01L2224/03002 , H01L2224/05009 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0566 , H01L2224/05664 , H01L2224/05684 , H01L2224/06181 , H01L2224/49175 , H01L2224/92247 , H01L2224/94 , H01L2924/12032 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2224/03

摘要： A method for manufacturing a chip package is provided. The method including: holding a carrier including a plurality of dies; forming a separation between the plurality of dies by removing from the carrier one or more portions of the carrier between the plurality of dies; forming an encapsulation material in the removed one or more portions between the plurality of dies; separating the dies through the encapsulation material.