公开(公告)号：US09666452B2

公开(公告)日：2017-05-30

申请号：US13480513

申请日：2012-05-25

申请人： Karl Adolf Dieter Mayer ,  Guenter Tutsch ,  Horst Theuss ,  Manfred Engelhardt ,  Joachim Mahler

发明人： Karl Adolf Dieter Mayer ,  Guenter Tutsch ,  Horst Theuss ,  Manfred Engelhardt ,  Joachim Mahler

IPC分类号： H01L21/44 ,  H01L21/00 ,  H01L21/56 ,  H01L23/00 ,  H01L21/78

CPC分类号： H01L21/561 ,  H01L21/78 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/94 ,  H01L2224/03002 ,  H01L2224/05009 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/05664 ,  H01L2224/05684 ,  H01L2224/06181 ,  H01L2224/49175 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/12032 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/03

摘要： A method for manufacturing a chip package is provided. The method including: holding a carrier including a plurality of dies; forming a separation between the plurality of dies by removing from the carrier one or more portions of the carrier between the plurality of dies; forming an encapsulation material in the removed one or more portions between the plurality of dies; separating the dies through the encapsulation material.

公开(公告)号：US08569109B2

公开(公告)日：2013-10-29

申请号：US13172989

申请日：2011-06-30

申请人： Manfred Mengel ,  Joachim Mahler ,  Khalil Hosseini ,  Horst Theuss

发明人： Manfred Mengel ,  Joachim Mahler ,  Khalil Hosseini ,  Horst Theuss

IPC分类号： H01L21/50 ,  H01L23/48

CPC分类号： C23C24/04 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/03416 ,  H01L2224/03505 ,  H01L2224/04026 ,  H01L2224/05551 ,  H01L2224/27332 ,  H01L2224/27505 ,  H01L2224/29198 ,  H01L2224/3201 ,  H01L2224/32225 ,  H01L2224/32503 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83205 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2924/01327 ,  H01L2924/351 ,  Y10T29/49886 ,  Y10T428/249994 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for attaching a metal surface to a carrier is provided, the method including: depositing a porous layer over at least one of a metal surface and a side of a carrier; and attaching the at least one of a metal surface and a side of a carrier to the porous layer by bringing a material into pores of the porous layer, resulting in the material forming an interconnection between the metal surface and the carrier.

摘要翻译： 提供了将金属表面附着到载体上的方法，所述方法包括：在载体的金属表面和侧面中的至少一个上沉积多孔层; 以及通过将材料引入所述多孔层的孔中，将所述载体的金属表面和所述载体的所述至少一个附着到所述多孔层上，导致所述材料在所述金属表面和所述载体之间形成互连。

公开(公告)号：US20130001803A1

公开(公告)日：2013-01-03

申请号：US13172989

申请日：2011-06-30

申请人： Manfred Mengel ,  Joachim Mahler ,  Khalil Hosseini ,  Horst Theuss

发明人： Manfred Mengel ,  Joachim Mahler ,  Khalil Hosseini ,  Horst Theuss

IPC分类号： H01L23/48 ,  B23P25/00 ,  B32B3/26 ,  H01L21/50

CPC分类号： C23C24/04 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/03416 ,  H01L2224/03505 ,  H01L2224/04026 ,  H01L2224/05551 ,  H01L2224/27332 ,  H01L2224/27505 ,  H01L2224/29198 ,  H01L2224/3201 ,  H01L2224/32225 ,  H01L2224/32503 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83205 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2924/01327 ,  H01L2924/351 ,  Y10T29/49886 ,  Y10T428/249994 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for attaching a metal surface to a carrier is provided, the method including: depositing a porous layer over at least one of a metal surface and a side of a carrier; and attaching the at least one of a metal surface and a side of a carrier to the porous layer by bringing a material into pores of the porous layer, resulting in the material forming an interconnection between the metal surface and the carrier.

摘要翻译： 提供了将金属表面附着到载体上的方法，所述方法包括：在载体的金属表面和侧面中的至少一个上沉积多孔层; 以及通过将材料引入所述多孔层的孔中，将所述载体的金属表面和所述载体的所述至少一个附着到所述多孔层上，导致所述材料在所述金属表面和所述载体之间形成互连。

公开(公告)号：US07781876B2

公开(公告)日：2010-08-24

申请号：US11741324

申请日：2007-04-27

申请人： Horst Theuss ,  Manfred Mengel ,  Joachim Mahler

发明人： Horst Theuss ,  Manfred Mengel ,  Joachim Mahler

IPC分类号： H01L23/02

CPC分类号： H01L23/295 ,  H01F1/26 ,  H01L21/563 ,  H01L23/291 ,  H01L23/3171 ,  H01L23/49513 ,  H01L23/49582 ,  H01L23/5256 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29487 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/293 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A semiconductor product including a substrate, a semiconductor chip fitted to the substrate, and a layer, which contains coated particles, located adjacent to the semiconductor chip, wherein the coated particles have a ferromagnetic, ferrimagnetic or paramagnetic core and a coating.

摘要翻译： 包括基板，安装在基板上的半导体芯片和位于半导体芯片附近的包含涂覆颗粒的层的半导体产品，其中涂覆的颗粒具有铁磁性，亚铁磁性或顺磁性核和涂层。

公开(公告)号：US20080251904A1

公开(公告)日：2008-10-16

申请号：US11741324

申请日：2007-04-27

申请人： Horst Theuss ,  Manfred Mengel ,  Joachim Mahler

发明人： Horst Theuss ,  Manfred Mengel ,  Joachim Mahler

IPC分类号： H01L23/29 ,  H01L21/56

CPC分类号： H01L23/295 ,  H01F1/26 ,  H01L21/563 ,  H01L23/291 ,  H01L23/3171 ,  H01L23/49513 ,  H01L23/49582 ,  H01L23/5256 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29487 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/293 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A semiconductor product including a substrate, a semiconductor chip fitted to the substrate, and a layer, which contains coated particles, located adjacent to the semiconductor chip, wherein the coated particles have a ferromagnetic, ferrimagnetic or paramagnetic core and a coating.

摘要翻译： 包括基板，安装在基板上的半导体芯片和位于半导体芯片附近的包含涂覆颗粒的层的半导体产品，其中涂覆的颗粒具有铁磁性，亚铁磁性或顺磁性核和涂层。

公开(公告)号：US09021887B2

公开(公告)日：2015-05-05

申请号：US13329618

申请日：2011-12-19

申请人： Franz-Peter Kalz ,  Horst Theuss ,  Bernhard Winkler ,  Khalil Hosseini ,  Joachim Mahler ,  Manfred Mengel

发明人： Franz-Peter Kalz ,  Horst Theuss ,  Bernhard Winkler ,  Khalil Hosseini ,  Joachim Mahler ,  Manfred Mengel

IPC分类号： G01B7/16 ,  B81B7/02 ,  G01L9/00 ,  G01L19/00

CPC分类号： B81B7/02 ,  B81B3/0021 ,  B81B3/0072 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81C2203/0154 ,  G01L1/18 ,  G01L9/0072 ,  G01L19/0092 ,  G01L19/02

摘要： Micromechanical semiconductor sensing device comprises a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, said piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.

摘要翻译： 微机械半导体感测装置包括被配置为产生电感测信号的微机械感测结构和设置在微机械感测结构中的压阻感测装置，所述压阻感测装置被布置成感测扰动电感测信号的机械应力，并被配置为 基于感测到的电感测信号的机械应力产生电干扰信号。

公开(公告)号：US20130152696A1

公开(公告)日：2013-06-20

申请号：US13329618

申请日：2011-12-19

申请人： Franz-Peter Kalz ,  Horst Theuss ,  Bernhard Winkler ,  Khalil Hosseini ,  Joachim Mahler ,  Manfred Mengel

发明人： Franz-Peter Kalz ,  Horst Theuss ,  Bernhard Winkler ,  Khalil Hosseini ,  Joachim Mahler ,  Manfred Mengel

IPC分类号： G01B7/16

CPC分类号： B81B7/02 ,  B81B3/0021 ,  B81B3/0072 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81C2203/0154 ,  G01L1/18 ,  G01L9/0072 ,  G01L19/0092 ,  G01L19/02

摘要： Micromechanical semiconductor sensing device comprises a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, said piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.

摘要翻译： 微机械半导体感测装置包括被配置为产生电感测信号的微机械感测结构和设置在微机械感测结构中的压阻感测装置，所述压阻感测装置被布置成感测扰动电感测信号的机械应力，并被配置为 基于感测到的电感测信号的机械应力产生电干扰信号。

公开(公告)号：US09953952B2

公开(公告)日：2018-04-24

申请号：US12195200

申请日：2008-08-20

申请人： Joachim Mahler ,  Michael Juerss ,  Stefan Landau

发明人： Joachim Mahler ,  Michael Juerss ,  Stefan Landau

IPC分类号： H01L23/34 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L24/85 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/564 ,  H01L24/16 ,  H01L24/19 ,  H01L24/24 ,  H01L24/28 ,  H01L24/29 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24246 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/4554 ,  H01L2224/45669 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/73204 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/8592 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/06 ,  H01L2924/00012 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/37099 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor device includes a carrier, a chip attached to the carrier, a sealant vapor deposited over the chip and the carrier, and encapsulation material deposited over the sealed chip and the sealed carrier.

公开(公告)号：US09313898B2

公开(公告)日：2016-04-12

申请号：US12275458

申请日：2008-11-21

申请人： Manfred Mengel ,  Joachim Mahler

发明人： Manfred Mengel ,  Joachim Mahler

IPC分类号： C09K19/00 ,  H05K3/28 ,  C08G73/10 ,  C09D179/08

CPC分类号： H05K3/285 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1064 ,  C08G73/1071 ,  C09D179/08 ,  H05K2201/0154 ,  H05K2203/013 ,  Y10T428/1005 ,  Y10T428/1023

摘要： An electrical component that includes a substrate and a polymeric layer oriented in working relation with the substrate, the polymeric layer including a low molecular mass polyimide.

摘要翻译： 一种电气部件，其包括基材和与所述基材工作的取向的聚合物层，所述聚合物层包括低分子量聚酰亚胺。

公开(公告)号：US09313897B2

公开(公告)日：2016-04-12

申请号：US13620202

申请日：2012-09-14

申请人： Joachim Mahler ,  Manfred Mengel ,  Khalil Hosseini ,  Franz-Peter Kalz

发明人： Joachim Mahler ,  Manfred Mengel ,  Khalil Hosseini ,  Franz-Peter Kalz

IPC分类号： H05K3/30 ,  H05K3/28 ,  H01L23/495 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/293 ,  C25D13/06 ,  C25D13/12 ,  H01L21/4825 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/49582 ,  H01L23/49586 ,  H01L23/573 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/84 ,  H01L24/85 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/8492 ,  H01L2224/8592 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/01322 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/284 ,  H05K2203/135 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

摘要： A packaged component and a method for making a packaged component are disclosed. In an embodiment the packaged component includes a component carrier having a component carrier contact and a component disposed on the component carrier, the component having a component contact. The packaged component further includes a conductive connection element connecting the component carrier contact with the component contact, an insulating film disposed directly at least on one of a top surface of the component or the conductive connection element, and an encapsulant encapsulating the component carrier, the component and the enclosed conductive connection elements.

摘要翻译： 公开了封装组件和制造封装组件的方法。 在一个实施例中，封装部件包括具有部件载体接触件和设置在部件载体上的部件的部件载体，该部件具有部件接触。 封装部件还包括将部件载体接触件与部件接触件连接的导电连接元件，直接设置在部件或导电连接元件的顶表面中的至少一个上的绝缘膜，以及封装部件载体的密封剂， 组件和封闭的导电连接元件。