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10 条记录 (耗时 0.039 秒)

    Piezo-actuated CMP carrier
    1.
    发明授权
    Piezo-actuated CMP carrier 失效
    压电式CMP载体

    公开(公告)号：US06325696B1

    公开(公告)日：2001-12-04

    申请号：US09395393

    申请日：1999-09-13

    申请人： Karl E. Boggs ,  Kenneth M. Davis ,  William F. Landers ,  Michael F. Lofaro ,  Adam D. Ticknor ,  Ronald D. Fiege

    发明人： Karl E. Boggs ,  Kenneth M. Davis ,  William F. Landers ,  Michael F. Lofaro ,  Adam D. Ticknor ,  Ronald D. Fiege

    IPC分类号： B24B4900

    CPC分类号： B24B37/30 ,  B24B37/32 ,  B24B49/12 ,  B24B49/16

    摘要： A chemical-mechanical polishing (CMP) control system controls distribution of pressure across the backside of a semiconductor wafer being polished. The system includes a CMP apparatus having a carrier for supporting a semiconductor wafer. The carrier includes a plurality of dual function piezoelectric actuators. The actuators sense pressure variations across the semiconductor wafer and are individually controllable. A control is connected to the actuators for monitoring sensed pressure variations and controlling the actuators to provide a controlled pressure distribution across the semiconductor wafer.

    摘要翻译： 化学机械抛光（CMP）控制系统控制正在抛光的半导体晶片背面的压力分布。 该系统包括具有用于支撑半导体晶片的载体的CMP装置。 载体包括多个双功能压电致动器。 致动器感测半导体晶片上的压力变化，并且可以单独控制。 控制器连接到致动器，用于监测感测的压力变化并控制致动器以提供横跨半导体晶片的受控压力分布。

    Regeneration of chemical mechanical polishing pads in-situ
    2.
    发明授权
    Regeneration of chemical mechanical polishing pads in-situ 失效
    化学机械抛光垫原位再生

    公开(公告)号：US06296717B1

    公开(公告)日：2001-10-02

    申请号：US09330657

    申请日：1999-06-11

    申请人： Adam D. Ticknor ,  Karl E. Boggs ,  Kenneth M. Davis ,  William F. Landers ,  Michael L. Passow

    发明人： Adam D. Ticknor ,  Karl E. Boggs ,  Kenneth M. Davis ,  William F. Landers ,  Michael L. Passow

    IPC分类号： C23G136

    CPC分类号： B24B37/042 ,  H01L21/30625

    摘要： An in-situ method for regenerating a chemical-mechanical polishing pad which includes the steps of: forming the polishing pad by dispensing liquid moldable material, such as wax, polymers or water, on a polishing surface and solidifying the liquid material by reducing the temperature, allowing the moldable material to harden; distributing slurry material on the polishing pad; polishing the surface of a semiconductor wafer with a combination of the slurry material and the polishing pad; and regenerating in-situ the polishing pad. This method quickly, easily and repeatably, resurfaces and refreshes the surface on which the a semiconductor wafer is polished. The polishing pad may also include abrasives embedded therein to enhance its polishing capabilities.

    摘要翻译： 一种用于再生化学机械抛光垫的原位方法，其包括以下步骤：通过在抛光表面上分配液体可模制材料（例如蜡，聚合物或水）形成抛光垫，并通过降低温度来固化液体材料 ，使可模塑材料硬化; 在抛光垫上分配浆料; 用浆料和抛光垫的组合抛光半导体晶片的表面; 并原位再生抛光垫。 该方法快速，容易和重复地重现和刷新其上抛光半导体晶片的表面。 抛光垫还可以包括嵌入其中的磨料以增强其抛光能力。

    Grooved polishing pads and methods of use
    6.
    发明授权
    Grooved polishing pads and methods of use 有权
    凹槽抛光垫和使用方法

    公开(公告)号：US06685548B2

    公开(公告)日：2004-02-03

    申请号：US10424840

    申请日：2003-04-29

    申请人： Shyng-Tsong Chen ,  Kenneth M. Davis ,  Kenneth P. Rodbell

    发明人： Shyng-Tsong Chen ,  Kenneth M. Davis ,  Kenneth P. Rodbell

    IPC分类号： B24B722

    CPC分类号： B24B37/26 ,  B24D18/00

    摘要： Grooves are formed in a CMP pad by positioning the pad on a supporting surface with a working surface of the pad in spaced relation opposite to a router bit and at least one projecting stop member adjacent to the router bit, an outer end portion of the bit projecting beyond the stop. When the bit is rotated, relative axial movement between the bit and the pad causes the outer end portion of the bit to cut an initial recess in the pad. Relative lateral movement between the rotating bit and the pad then forms a groove which extends laterally away from the recess and has a depth substantially the same as that of the recess. The depths of the initial recess and the groove are limited by applying a vacuum to the working surface of the pad to keep it in contact with the stop member(s). Different lateral movements between the bit and the pad are used to form a variety of groove patterns, the depths of which are precisely controlled by the stop member(s). The grooves may be formed in the polishing surface and/or the rear opposite surface of the pad and passages may be provided for interconnecting the rear grooves with the polishing surface or the front grooves.

    摘要翻译： 通过将衬垫定位在支撑表面上，使衬垫的工作表面与路由器刀片相对的间隔开的关系形成凹槽，并且至少一个与路由器刀头相邻的突出止动件，钻头的外端部分 突出超出停止。 当钻头旋转时，钻头和钻头之间的相对轴向运动使钻头的外端部分切割焊盘中的初始凹陷。 旋转钻头和垫之间的相对横向运动形成一个横向延伸离开凹槽并具有与凹槽基本相同的深度的凹槽。 通过将真空施加到垫的工作表面以使其与止动构件接触来限制初始凹部和凹槽的深度。 钻头和垫之间的不同横向运动用于形成各种凹槽图案，其深度由止动件精确地控制。 凹槽可以形成在抛光表面中和/或垫的后相对表面，并且可以设置通道用于将后槽与抛光表面或前槽相互连接。

    Optical device and formation of optical waveguide using light-induced effect on refractive index
    7.
    发明授权
    Optical device and formation of optical waveguide using light-induced effect on refractive index 失效
    光学器件和光波导的形成使用光诱导对折射率的影响

    公开(公告)号：US5978538A

    公开(公告)日：1999-11-02

    申请号：US819521

    申请日：1997-03-17

    申请人： Kiyotaka Miura ,  Kenneth M. Davis ,  Kazuyuki Hirao

    发明人： Kiyotaka Miura ,  Kenneth M. Davis ,  Kazuyuki Hirao

    IPC分类号： G02B6/12 ,  G02B6/13 ,  G02B6/18

    CPC分类号： G02B6/13 ,  G02B2006/12038 ,  G02B2006/12119

    摘要： A glass is irradiated with a focused pulsed laser beam having a peak power density of 10.sup.5 W/cm.sup.2 or more and a repetition rate of 10 KHz or more. The glass irradiated with the laser beam changes its refractive index at the focal point. During the laser beam irradiation, the glass is continuously moved with respect to the focal point of the pulsed laser beam or continuously scanned with the focused laser beam, so as to form the refractive index changed region (i.e. an optical waveguide) with a predetermined pattern. The glass in which the optical waveguide is formed may be any kind of glass having high transparency.

    摘要翻译： 用峰值功率密度为105W / cm 2以上且重复率为10KHz以上的聚焦脉冲激光束照射玻璃。 用激光束照射的玻璃在焦点处改变其折射率。 在激光束照射期间，玻璃相对于脉冲激光束的焦点连续移动，或者用聚焦激光束连续扫描，以形成具有预定图案的折射率变化区域（即光波导） 。 形成光波导的玻璃可以是具有高透明度的任何种类的玻璃。

    Optical device and formation of optical waveguide using light-induced effect on refractive index
    8.
    发明授权
    Optical device and formation of optical waveguide using light-induced effect on refractive index 有权
    光学器件和光波导的形成使用光诱导对折射率的影响

    公开(公告)号：US6154593A

    公开(公告)日：2000-11-28

    申请号：US333109

    申请日：1999-06-15

    申请人： Kiyotaka Miura ,  Kenneth M. Davis ,  Kazuyuki Hirao

    发明人： Kiyotaka Miura ,  Kenneth M. Davis ,  Kazuyuki Hirao

    IPC分类号： G02B6/12 ,  G02B6/13 ,  G02B6/10

    CPC分类号： G02B6/13 ,  G02B2006/12038 ,  G02B2006/12119

    摘要： A glass 1 is irradiated with a focused pulsed laser beam 2 having a peak power density of 10.sup.5 W/cm.sup.2 or more and a repetition rate of 10 KHz or more. The glass 1 irradiated with the laser beam 2 changes its refractive index at the focal point 4. During the laser beam irradiation, the glass 1 is continuously moved with respect to the focal point of the pulsed laser beam 2 or continuously scanned with the focused laser beam 2, so as to form the refractive index changed region (i.e. an optical waveguide 5) with a predetermined pattern. The glass 1 in which the optical waveguide 5 will be formed may be any kind of glass having high transparency.

    摘要翻译： 用峰值功率密度为105W / cm 2以上且重复率为10KHz以上的聚焦脉冲激光束2照射玻璃1。 用激光束2照射的玻璃1在焦点4处改变其折射率。在激光束照射期间，玻璃1相对于脉冲激光束2的焦点连续移动或者用聚焦激光器连续扫描 光束2，以形成具有预定图案的折射率变化区域（即，光波导5）。 其中将形成光波导5的玻璃1可以是具有高透明度的任何种类的玻璃。

    Grooved polishing pads and methods of use
    9.
    发明授权
    Grooved polishing pads and methods of use 有权
    凹槽抛光垫和使用方法

    公开(公告)号：US06656019B1

    公开(公告)日：2003-12-02

    申请号：US09668142

    申请日：2000-09-25

    申请人： Shyng-Tsong Chen ,  Kenneth M. Davis ,  Kenneth P. Rodbell

    发明人： Shyng-Tsong Chen ,  Kenneth M. Davis ,  Kenneth P. Rodbell

    IPC分类号： B24B100

    CPC分类号： B24B37/26 ,  B24D18/00

    摘要： Grooves are formed in a CMP pad by positioning the pad on a supporting surface with a working surface of the pad in spaced relation opposite to a router bit and at least one projecting stop member adjacent to the router bit, an outer end portion of the bit projecting beyond the stop. When the bit is rotated, relative axial movement between the bit and the pad causes the outer end portion of the bit to cut an initial recess in the pad. Relative lateral movement between the rotating bit and the pad then forms a groove which extends laterally away from the recess and has a depth substantially the same as that of the recess. Different lateral movements between the bit and the pad are used to form a variety of groove patterns, the depths of which are precisely controlled by the stop member(s). The grooves may be formed in the polishing surface and/or the rear opposite surface of the pad and passages may be provided for interconnecting the rear grooves with the polishing surface or the front grooves. Grooves in the polishing surface may be provided with outlets through which a polishing slurry may flow while the polishing surface is in contact with a workpiece surface.

    摘要翻译： 通过将衬垫定位在支撑表面上，使衬垫的工作表面与路由器刀片相对的间隔开的关系形成凹槽，并且至少一个与路由器刀头相邻的突出止动件，钻头的外端部分 突出超出停止。 当钻头旋转时，钻头和钻头之间的相对轴向运动使钻头的外端部分切割焊盘中的初始凹陷。 旋转钻头和垫之间的相对横向运动形成一个横向延伸离开凹槽并具有与凹槽基本相同的深度的凹槽。 钻头和垫之间的不同横向运动用于形成各种凹槽图案，其深度由止动件精确地控制。 凹槽可以形成在抛光表面中和/或垫的后相对表面，并且可以设置通道用于将后槽与抛光表面或前槽相互连接。 抛光表面中的凹槽可以设置有抛光浆料可以在抛光表面与工件表面接触的同时流过的出口。

    Polishing pad grooving method and apparatus
    10.
    发明授权
    Polishing pad grooving method and apparatus 失效
    抛光槽切槽方法及装置

    公开(公告)号：US06340325B1

    公开(公告)日：2002-01-22

    申请号：US09605869

    申请日：2000-06-29

    申请人： Shyng-Tsong Chen ,  Alex Siu Keung Chung ,  Kenneth M. Davis ,  Oscar Kai Chi Hsu ,  Kenneth P. Rodbell

    发明人： Shyng-Tsong Chen ,  Alex Siu Keung Chung ,  Kenneth M. Davis ,  Oscar Kai Chi Hsu ,  Kenneth P. Rodbell

    IPC分类号： B24B100

    CPC分类号： B24B37/26 ,  Y10T409/303808 ,  Y10T409/306608 ,  Y10T409/308624

    摘要： Grooves are formed in a COD pad by positioning the pad on a supporting surface with a working surface of the pad in spaced relation opposite to a router bit and at least one projecting stop member adjacent to the router bit, an outer end portion of the bit projecting beyond the stop. When the bit is rotated, relative axial movement between the bit and the pad causes the outer end portion of the bit to cut an initial recess in the pad. Relative lateral movement between the rotating bit and the pad then forms a groove which extends laterally away from the recess and has a depth substantially the same as that of the recess. The depths of the initial recess and the groove are limited by applying a vacuum to the working surface of the pad to keep it in contact with the stop member(s). Different lateral movements between the bit and the pad are used to form a variety of groove patterns, the depths of which are precisely controlled by the stop member(s).

    摘要翻译： 通过将焊盘定位在支撑表面上，通过将焊盘的工作表面与路由器钻头相对隔开的关系形成凹槽并形成至少一个与路由器钻头相邻的突出挡块，钻头的外端部分 突出超出停止。 当钻头旋转时，钻头和钻头之间的相对轴向运动使钻头的外端部分切割焊盘中的初始凹陷。 旋转钻头和垫之间的相对横向运动形成一个横向延伸离开凹槽并具有与凹槽基本相同的深度的凹槽。 通过将真空施加到垫的工作表面以使其与止动构件接触来限制初始凹部和凹槽的深度。 钻头和垫之间的不同横向运动用于形成各种凹槽图案，其深度由止动件精确地控制。