摘要:
A water-containing solid fuel drying apparatus that can efficiently dry with low energy consumption by effectively utilizing sensible heat and latent heat of a heating medium for drying, etc. is provided. A drying apparatus (10) that dries water-containing solid fuel includes a dryer (20) that injects scavenging gas into the interior of a drying vessel (21) in which a heat transfer pipe (22) is disposed; a dust collector (13) that removes microparticles from microparticle-containing mixed gaseous fluid that has flowed out of the drying vessel (21); a compressor (30) that compresses vapor-containing mixed gaseous fluid; a vapor heat exchanger (31) that preheats low-pressure mixed gaseous fluid with high-pressure mixed gaseous fluid compressed at the compressor (30); and a gas-liquid separator (14), in which the high-pressure mixed gaseous fluid is employed as drying gas that radiates heat by passing through the heat transfer pipe (22), that performs gas-liquid separation of water-containing scavenging gas that has flowed out of the heat transfer pipe (22) while containing condensed water of vapor generated due to heat radiation, wherein the water-containing solid fuel is dried by heating the water-containing solid fuel in the drying vessel (21) utilizing latent heat and sensible heat of the mixed gaseous fluid.
摘要:
A water-containing solid fuel drying apparatus that can efficiently dry with low energy consumption by effectively utilizing sensible heat and latent heat of a heating medium for drying, etc. is provided. A drying apparatus (10) that dries water-containing solid fuel includes a dryer (20) that injects scavenging gas into the interior of a drying vessel (21) in which a heat transfer pipe (22) is disposed; a dust collector (13) that removes microparticles from microparticle-containing mixed gaseous fluid that has flowed out of the drying vessel (21); a compressor (30) that compresses vapor-containing mixed gaseous fluid; a vapor heat exchanger (31) that preheats low-pressure mixed gaseous fluid with high-pressure mixed gaseous fluid compressed at the compressor (30); and a gas-liquid separator (14), in which the high-pressure mixed gaseous fluid is employed as drying gas that radiates heat by passing through the heat transfer pipe (22), that performs gas-liquid separation of water-containing scavenging gas that has flowed out of the heat transfer pipe (22) while containing condensed water of vapor generated due to heat radiation, wherein the water-containing solid fuel is dried by heating the water-containing solid fuel in the drying vessel (21) utilizing latent heat and sensible heat of the mixed gaseous fluid.
摘要:
A semiconductor device capable of overcoming a drawback due to the shape of a concave portion present in the zinc blende type compound semiconductor substrate in which the area of the bottom is larger than the surface in the cross sectional shape, as well as a manufacturing method thereof. A hole or step present in the semiconductor substrate constituting the semiconductor device is formed into a normal mesa shape irrespective of the orientation of the crystals on the surface of the semiconductor substrate. A wet etching solution having an etching rate for a portion below the etching mask higher than that in the direction of the depth of the semiconductor substrate is used.
摘要:
The most important task in realizing a downsized and low cost THz band spectroscopic and fluoroscopic instrument is to achieve downsizing and cost reduction of oscillators used in the instrument. A metal base transistor is used for an active element of the oscillator. In order to improve the maximum oscillation frequency of the transistor to several THZ, InN having a high electron saturation velocity or a material mainly composed of InN is used for a collector layer. In order to obtain characteristics with excellent reproducibility, it is useful to insert InGaN into an interface between the collector layer and the base layer. Using the metal base transistor of the present invention makes it possible to constitute an oscillator allowing a THz band oscillation. Further, the present invention provides a spectroscopic instrument applying this oscillator to at least one of a signal source and a local oscillator.
摘要:
A bipolar transistor device with a large current capacity is formed by connecting a plurality of transistor elements to each other in parallel, each transistor element having a collector layer, a base layer, and an emitter layer formed respectively in a semiconductor substrate. In the bipolar transistor device, the base layers of a plurality of the transistor elements are extended in parallel to each other and those base layers are separated from each other. In each separated base layer, a first base electrode is formed on a part of the base layer which is separated from an emitter junction with the emitter layer, and a second base electrode is formed on another portion of the base layer closer to the emitter junction than the first base electrode. To dispose the base electrodes of a plurality of the transistor elements in parallel to each other, a base wiring is connected to the first base electrodes of those elements electrically. Consequently, a ballast resistor that causes no variation in the resistance value can be connected to each of a plurality of the transistor elements.
摘要:
A bipolar transistor device with a large current capacity is formed by connecting a plurality of transistor elements to each other in parallel, each transistor element having a collector layer, a base layer, and an emitter layer formed respectively in a semiconductor substrate. In the bipolar transistor device, the base layers of a plurality of the transistor elements are extended in parallel to each other and those base layers are separated from each other. In each separated base layer, a first base electrode is formed on a part of the base layer which is separated from an emitter junction with the emitter layer, and a second base electrode is formed on another portion of the base layer closer to the emitter junction than the first base electrode. To dispose the base electrodes of a plurality of the transistor elements in parallel to each other, a base wiring is connected to the first base electrodes of those elements electrically. Consequently, a ballast resistor that causes no variation in the resistance value can be connected to each of a plurality of the transistor elements.
摘要:
In a Schottky electrode formation region on a nitride semiconductor, the total length of junctions of Schottky electrodes and a surface of a nitride semiconductor layer is longer than the perimeter of the Schottky electrode formation region. The total length is preferably 10 times longer than the perimeter. For example, the Schottky electrodes are formed concentrically and circularly.
摘要:
The present invention provides a semiconductor device which comprises active components, passive components, wiring lines and electrodes and are satisfactory in terms of mechanical strength, miniaturization and thermal stability. In the semiconductor device, openings are formed just below active components. These openings are filled with conductor layers. Conductor layers are also formed where openings are not formed.
摘要:
In a semiconductor device using an emitter top heterojunction bipolar transistor having a planar shape in a ring-like shape, a structure is provided in which a base electrode is present only on an inner side of a ring-like emitter-base junction region. This allows reduction of base/collector junction capacitance per unit emitter area, whereby a semiconductor device having high power adding efficiency and high power gain suitable for a power amplifier can be realized. Further, in a multistage power amplifier including first and second amplifier circuits each having one or more of bipolar transistors, a bipolar transistor in the first amplifier circuit uses an emitter having a planar shape in a rectangular shape, and a bipolar transistor in the second amplifier circuit uses an emitter having a ring-like shape and a base electrode only on the inner side of the emitter.
摘要:
The present invention provides a method of manufacturing semiconductor devices, by which InGaAs-base C-top HBTs are manufactured at low cost. Helium ions with a smaller radius are implanted into a p-type InGaAs layer (in external base regions) not covered with a lamination consisting of an undoped InGaAs spacer layer, n-type InP collector layer, n-type InGaAs cap layer, and collector electrode from a direction vertical to the surface of the external base layer or within an angle of 3 degrees off the vertical. In consequence, the p-type InGaAs in the external base regions remains p-type conductive and low resistive and the n-type InAlAs layer in the external emitter regions can be made highly resistive. By this method, InGaAs-base C-top HBTs can be fabricated on a smaller chip at low cost without increase of the number of processes.