Semiconductor device, manufacturing method of the same and electronic device
    8.
    发明申请
    Semiconductor device, manufacturing method of the same and electronic device 审中-公开
    半导体器件及其制造方法及电子器件

    公开(公告)号:US20060138459A1

    公开(公告)日:2006-06-29

    申请号:US11316989

    申请日:2005-12-27

    IPC分类号: H01L31/109

    摘要: Provided is a semiconductor device equipped with HBTs capable of satisfying both thermal stability and reliability and having improved electrostatic breakdown voltage. The HBT according to the present invention is obtained by successively forming, over the main surface of a substrate made of a compound semiconductor, a sub-collector layer, a collector layer, a base layer, an emitter layer, a collector electrode electrically connected to the collector layer, a base electrode electrically connected to the base layer, an emitter mesa layer formed over the emitter layer and electrically connected to the emitter layer, and an emitter electrode electrically connected to the emitter mesa layer. The emitter mesa layer has a semiconductor layer made of an n type GaAs layer, a high concentration semiconductor layer made of an n+ type GaAs layer over the semiconductor layer and a ballast resistor layer made of an n type InGaAs layer over the high concentration semiconductor layer.

    摘要翻译: 提供了配备能够满足热稳定性和可靠性并具有改善的静电击穿电压的HBT的半导体器件。 根据本发明的HBT是通过在由化合物半导体制成的衬底的主表面上连续形成子集电极层,集电极层,基极层,发射极层,集电极,电连接到 集电极层,电连接到基极层的基极,在发射极层上形成并电连接到发射极层的发射极台面层和电连接到发射极台面层的发射极。 发射极台面层具有由n型GaAs层构成的半导体层,在半导体层上形成由n + +型GaAs层构成的高浓度半导体层和由n型GaAs层制成的镇流电阻层 InGaAs层在高浓度半导体层上。