公开(公告)号：US20110147942A1

公开(公告)日：2011-06-23

申请号：US12838960

申请日：2010-07-19

申请人： Katsunori YAHASHI ,  Takuji Kuniya ,  Takaya Matsushita ,  Murato Kawai ,  Shuichi Taniguchi

发明人： Katsunori YAHASHI ,  Takuji Kuniya ,  Takaya Matsushita ,  Murato Kawai ,  Shuichi Taniguchi

IPC分类号： H01L23/52 ,  H01L21/768

CPC分类号： H01L27/0688 ,  H01L27/2409 ,  H01L27/2418 ,  H01L27/2481 ,  H01L45/085 ,  H01L45/1233 ,  H01L45/147 ,  H01L45/1675

摘要： A method of manufacturing a semiconductor memory device of an embodiment includes: after forming a first interconnection layer and a memory cell layer above a semiconductor substrate, forming first lines by forming first grooves extending in first direction; forming a thin film on the side walls of the first grooves; forming a stack structure by filling an interlayer insulating film in the first grooves; forming a second interconnection layer above the stack structure; forming second lines by forming second grooves extending in second direction; removing the thin film exposed at bottom of the second grooves; and forming columnar memory cells by removing the memory cell layer exposed at bottom of the second grooves. The thin film has higher etching rate than the interlayer insulating film, and is removed prior to portions of the memory cell layer adjoining the thin film.

摘要翻译： 制造实施例的半导体存储器件的方法包括：在半导体衬底之上形成第一互连层和存储单元层之后，通过形成沿第一方向延伸的第一沟槽来形成第一线; 在第一槽的侧壁上形成薄膜; 通过在第一槽中填充层间绝缘膜形成堆叠结构; 在所述堆叠结构之上形成第二互连层; 通过形成沿第二方向延伸的第二凹槽形成第二线; 去除在第二凹槽的底部暴露的薄膜; 以及通过去除在第二凹槽的底部暴露的存储单元层来形成柱状存储单元。 薄膜具有比层间绝缘膜更高的蚀刻速率，并且在与薄膜邻接的存储单元层的部分之前被去除。

公开(公告)号：US08216942B2

公开(公告)日：2012-07-10

申请号：US12274076

申请日：2008-11-19

申请人： Makoto Hasegawa ,  Katsunori Yahashi ,  Shuichi Taniguchi

发明人： Makoto Hasegawa ,  Katsunori Yahashi ,  Shuichi Taniguchi

IPC分类号： H01L21/311

CPC分类号： H01L21/0337 ,  H01L21/0338 ,  H01L21/31144 ,  H01L21/32139

摘要： A method for manufacturing a semiconductor device, comprises forming a first film above a pattern forming material, patterning the first film to form a core material pattern, forming a second film above the pattern forming material so as to cover a side surface and an upper surface of the core material pattern, forming a third film above the second film as a protective material for the second film, etching the second and third films so that side wall sections including the second film and the third film are formed on both sides of the core material pattern and the second film and the third film of an area other than the side wall sections are removed, removing the core material pattern between the side wall sections, and transferring patterns corresponding to the side wall sections on the pattern forming material by using the side wall sections as a mask.

摘要翻译： 一种制造半导体器件的方法，包括在图案形成材料上形成第一膜，图案化第一膜以形成芯材图案，在图案形成材料上形成第二膜以覆盖侧表面和上表面 的芯材图案，在第二膜上形成第三膜作为第二膜的保护材料，蚀刻第二和第三膜，使得包括第二膜和第三膜的侧壁部分形成在芯的两侧 去除除了侧壁部分之外的区域的第二膜和第二膜，除去侧壁部分之间的芯材图案，并且通过使用图案形成材料将对应于侧壁部分的图案转移到图案形成材料上 侧壁部分作为掩模。

公开(公告)号：US20090130851A1

公开(公告)日：2009-05-21

申请号：US12274076

申请日：2008-11-19

申请人： Makoto Hasegawa ,  Katsunori Yahashi ,  Shuichi Taniguchi

发明人： Makoto Hasegawa ,  Katsunori Yahashi ,  Shuichi Taniguchi

IPC分类号： H01L21/311

CPC分类号： H01L21/0337 ,  H01L21/0338 ,  H01L21/31144 ,  H01L21/32139

摘要： A method for manufacturing a semiconductor device, comprises forming a first film above a pattern forming material, patterning the first film to form a core material pattern, forming a second film above the pattern forming material so as to cover a side surface and an upper surface of the core material pattern, forming a third film above the second film as a protective material for the second film, etching the second and third films so that side wall sections including the second film and the third film are formed on both sides of the core material pattern and the second film and the third film of an area other than the side wall sections are removed, removing the core material pattern between the side wall sections, and transferring patterns corresponding to the side wall sections on the pattern forming material by using the side wall sections as a mask.

摘要翻译： 一种制造半导体器件的方法，包括在图案形成材料上形成第一膜，图案化第一膜以形成芯材图案，在图案形成材料上形成第二膜以覆盖侧表面和上表面 的芯材图案，在第二膜上形成第三膜作为第二膜的保护材料，蚀刻第二和第三膜，使得包括第二膜和第三膜的侧壁部分形成在芯的两侧 去除除了侧壁部分之外的区域的第二膜和第二膜，除去侧壁部分之间的芯材图案，并且通过使用图案形成材料将对应于侧壁部分的图案转移到图案形成材料上 侧壁部分作为掩模。

公开(公告)号：US4484756A

公开(公告)日：1984-11-27

申请号：US438494

申请日：1982-11-02

申请人： Kikuzo Takamiya ,  Hiroshi Todoroki ,  Shuichi Taniguchi

发明人： Kikuzo Takamiya ,  Hiroshi Todoroki ,  Shuichi Taniguchi

IPC分类号： B21D26/02 ,  B21D26/037 ,  B21D53/86 ,  B62K19/00 ,  B62K3/02

CPC分类号： B21D26/037 ,  B21D35/006 ,  B21D53/86 ,  B62K19/00 ,  Y10T29/49805

摘要： A blank tube constituting a main frame for a two-wheeled vehicle, comprises a main tubular portion having thicker walls in the proximity of its ends subjected to the largest forces and tubular expanded portions extending from the ends of the tube for receiving a head tube and a seat tube without using separate parts such as lugs. The blank tube further comprises a gradually enlarged diameter portion adjacent to the tubular expanded portions to more improve the strength of the tube.The thicker walls, tubular expanded portions and gradually enlarged diameter portion are formed simultaneously in dies by bulging. Moreover, the dies are formed with recesses, so that the blank tube is formed with protrusions. The protrusions are formed with apertures for passing brake wires or electric wires through the tube. The main tubular portion of the blank tube is formed in a particular cross-section effectively increasing its strength by pressing by means of the dies including corresponding sectional cavities.

摘要翻译： 构成用于两轮车辆的主框架的空白管包括：主管状部分，其在受其施加最大力的端部附近具有较厚的壁，并且从管的端部延伸用于容纳头管， 座管，而不使用单独的部件，例如凸耳。 坯管还包括与管状膨胀部分相邻的逐渐扩大的直径部分，以更好地提高管的强度。 较厚的壁，管状膨胀部分和逐渐扩大的直径部分通过凸出同时形成在模具中。 此外，模具形成有凹部，使得坯管形成有突起。 突起形成有用于使制动线或电线穿过管的孔。 坯管的主管状部分以特定的横截面形成，通过借助于包括相应的截面空腔的模具进行压制而有效地增加其强度。

公开(公告)号：US06889403B2

公开(公告)日：2005-05-10

申请号：US10054267

申请日：2002-01-22

申请人： Mineyuki Inoue ,  Takeshi Yamada ,  Shuichi Taniguchi ,  Toshiaki Ogawa

发明人： Mineyuki Inoue ,  Takeshi Yamada ,  Shuichi Taniguchi ,  Toshiaki Ogawa

IPC分类号： A47L5/22 ,  A47L9/12 ,  A47L9/16

CPC分类号： A47L9/165 ,  A47L9/1666 ,  Y10S55/03

摘要： A cyclonic vacuum cleaner which suppresses the flow of dust-laden airflow to the outside of a dust collection container, even if fine or comparatively light dust particles ascend together with a vortex flow. Fine dust particles mixed in the vortex flow are captured by a filter 23 of a first vent hole 21 provided at a lower end of a base 19 of a vortex flow generating member 18. If the filter 23 is clogged with such particles to some extent, yet the airflow inside a dust collection container 15 is allowed to pass through a second vent hole 22 formed on the side surface of the base 19 of the vortex flow generating member 18 into an intake hole 12. As a result, a constant amount of airflow is insured. Further, owing to a skirt portion 25 provided around the first vent hole 21, the travel of the dust particles toward the second vent hole 22 can be prevented even though the dust particles captured by the filter 23 are carried on the vortex flow toward the second vent hole 22.

摘要翻译： 一种气旋式真空吸尘器，即使细小的或较轻的灰尘颗粒与涡流一起上升，也可以抑制灰尘气流向集尘容器的外部流动。 通过设置在涡流产生部件18的基部19的下端的第一通气孔21的过滤器23捕获混合在涡流中的细粉尘颗粒。如果过滤器23在某种程度上被这种颗粒堵塞， 而使集尘容器15内的气流通过形成在涡流产生部件18的基部19的侧面上的第二通气孔22进入吸入孔12.结果，恒定的气流量 被保险人 此外，由于设置在第一通气孔21周围的裙部25，即使由过滤器23捕获的灰尘颗粒被携带在朝向第二通气孔22的涡流上，也可以防止灰尘颗粒朝向第二通气孔22的行进。 通气孔22。

公开(公告)号：US06501637B2

公开(公告)日：2002-12-31

申请号：US09746715

申请日：2000-12-22

申请人： Masanori Oshima ,  Shuichi Taniguchi ,  Hiroyuki Watanabe

发明人： Masanori Oshima ,  Shuichi Taniguchi ,  Hiroyuki Watanabe

IPC分类号： H01G506

CPC分类号： H01G5/06

摘要： A trimmer capacitor includes anchor portions that are arranged to be stepped down from the surface of a fixed electrode and are embedded in a stator near the upper surface of the stator at the tip portions of the fixed electrode. Because the tip portion of the fixed electrode has a section that is exactly perpendicular or nearly perpendicular to the surface of the fixed electrode in the region from the surface of the fixed electrode to the anchor portions, even if the upper surface of the stator is polished in the process for forming the stator, neither the area of the fixed electrode nor the capacitance changes.

摘要翻译： 微调电容器包括从固定电极的表面向下逐渐下降的锚固部分，并且在固定电极的顶端处嵌入在定子的上表面附近的定子中。 由于固定电极的前端部在从固定电极的表面到固定部的区域中具有与固定电极的表面完全垂直或几乎垂直的部分，所以即使定子的上表面被抛光 在形成定子的过程中，固定电极的面积和电容都不变。

公开(公告)号：US06375339B2

公开(公告)日：2002-04-23

申请号：US09678360

申请日：2000-10-03

申请人： Kaname Maruyama ,  Takashi Honda ,  Shuichi Taniguchi ,  Masahiko Hori

发明人： Kaname Maruyama ,  Takashi Honda ,  Shuichi Taniguchi ,  Masahiko Hori

IPC分类号： F21V2108

CPC分类号： F21S6/003 ,  F21V17/02 ,  F21V17/164 ,  F21Y2103/00

摘要： A lighting apparatus which enables a shade to be easily attached, detached and rotated with a simple structure and an enhanced degree of freedom in design. Grooves 9,10 defining arc-shaped portions 15,16, respectively, are formed around an axis of a head 4, to which is mounted a fluorescent light bulb 7. A shade 8 which is formed with protrusions 17, 18 opposite to the grooves 9, 10 is mounted to the head 4 so as to cover the fluorescent light bulb 7. By pressing the protrusions 17, 18 of the shade 8 into the grooves 9, 10 of the head 4, the shade 8 can be very easily mounted to the head 4. By lifting up the shade 8 from the head 4, the shade 8 can be very easily removed from the head 4. In addition, the shade 8 can be rotated by allowing the protrusions 17, 18 formed on the shade 8 to slide along the arc-shaped portions 15, 16. As such shade 8 allows a simple integral structure, degree of freedom in designing a lighting apparatus can be enhanced.

摘要翻译： 一种照明装置，其能够以简单的结构和增强的设计自由度容易地安装，拆卸和旋转阴影。 围绕头部4的轴线形成分别形成弧形部分15,16的凹槽9,10，安装有荧光灯泡7.遮光罩8形成有与凹槽相对的突起17,18 将9,10安装到头部4以覆盖荧光灯泡7.通过将灯罩8的突起17,18压入头部4的槽9,10中，可以非常容易地将灯罩8安装到 头部4.通过从头部4提升遮光罩8，可以非常容易地从头部4去除灯罩8.另外，通过使形成在灯罩8上的突起17,18能够旋转，可以使灯罩8旋转 沿着弧形部分15,16滑动。由于这种荫罩8允许简单的整体结构，可以提高设计照明装置的自由度。

公开(公告)号：US07235490B2

公开(公告)日：2007-06-26

申请号：US10788216

申请日：2004-02-27

申请人： Yasuhiko Sato ,  Seiji Nakagawa ,  Jun Idebuchi ,  Motoya Kishida ,  Shuichi Taniguchi ,  Tsuyoshi Shibata

发明人： Yasuhiko Sato ,  Seiji Nakagawa ,  Jun Idebuchi ,  Motoya Kishida ,  Shuichi Taniguchi ,  Tsuyoshi Shibata

IPC分类号： H01L21/311

CPC分类号： H01L21/31144 ,  G03F7/09 ,  H01L21/0332

摘要： A method of manufacturing a semiconductor device comprises preparing a working film to be processed, forming an adhesion improving region on the working film for increasing an adhesion between the working film and a mask material containing carbon, forming the mask material on the working film, forming a resist pattern on the mask material, the mask material having a higher etching resistance for the working film than the resist pattern, transferring the pattern of the resist pattern onto the mask material, and etching the working film by using the mask material as a mask.

摘要翻译： 一种制造半导体器件的方法包括：制备待加工的工作薄膜，在工作薄膜上形成粘合改善区域，以增加工作薄膜和含有碳的掩模材料之间的粘附力，在工作薄膜上形成掩模材料，形成 在掩模材料上的抗蚀剂图案，掩模材料对抗蚀剂图案具有比工作膜更高的耐蚀刻性，将抗蚀剂图案的图案转印到掩模材料上，并且通过使用掩模材料作为掩模来蚀刻工作膜 。

公开(公告)号：US06528749B2

公开(公告)日：2003-03-04

申请号：US09934500

申请日：2001-08-22

申请人： Masahiko Hori ,  Shuichi Taniguchi

发明人： Masahiko Hori ,  Shuichi Taniguchi

IPC分类号： H01H900

CPC分类号： F21V23/04

摘要： A switch attachment structure for an electric appliance which is simple but is able to provide good assembling efficiency. A first outer shell (2a) which constructs a part of a main body or pillar (2) of the electric appliance is provided in a bottom with an attachment frame (8). The attachment frame (8) includes a through-hole (7) for attaching a tip-over switch (3) thereto and a cutout (9) formed in a part of the attachment frame (8). The cutout (9) has a width at least as large as the thickness of a lead wire (10), thus providing the communication of the through-hole (7) with the outside of the attachment frame (8). When combining the first outer shell (2a) and a second outer shell (2b) together, the cutout (9) is filled by the second outer shell (2b). Thus, it is possible to insert the lead wire (10) from the cutout (9) into the through-hole (7) with the switch (3), the lead wire (10) and the electrical element (11) being connected together beforehand, and then to insert the switch (3) into the through-hole (7) to thereby easily and efficiently attach the switch (3) to the attachment frame (8).

摘要翻译： 用于电器的开关附接结构，其简单但能够提供良好的组装效率。 构成电器的主体或支柱（2）的一部分的第一外壳（2a）在底部设置有附接框架（8）。 安装框架（8）包括用于将翻转开关（3）附接到其上的通孔（7）和形成在附接框架（8）的一部分中的切口（9）。 切口（9）具有至少与引线（10）的厚度一样大的宽度，从而使通孔（7）与附接框架（8）的外部连通。 当将第一外壳（2a）和第二外壳（2b）组合在一起时，切口（9）由第二外壳（2b）填充。 因此，可以通过开关（3）将导线（10）从切口（9）插入到通孔（7）中，引线（10）和电气元件（11）连接在一起 然后将开关（3）插入到通孔（7）中，从而容易且有效地将开关（3）安装到安装框架（8）上。