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31 条记录 (耗时 0.036 秒)

    Conductive film, corrosion-resistant conduction film, corrosion-resistant conduction material and process for producing the same
    3.
    发明授权
    Conductive film, corrosion-resistant conduction film, corrosion-resistant conduction material and process for producing the same 有权
    导电膜，耐腐蚀导电膜，耐腐蚀导电材料及其制造方法

    公开(公告)号：US08613807B2

    公开(公告)日：2013-12-24

    申请号：US12656459

    申请日：2010-01-29

    申请人： Toshio Horie ,  Gaku Kitahara ,  Nobuaki Suzuki ,  Fumio Shimizu ,  Takao Kobayashi ,  Ken-ichi Suzuki ,  Shigeki Oshima

    发明人： Toshio Horie ,  Gaku Kitahara ,  Nobuaki Suzuki ,  Fumio Shimizu ,  Takao Kobayashi ,  Ken-ichi Suzuki ,  Shigeki Oshima

    IPC分类号： C23C8/00 ,  B32B9/00 ,  H01B1/02

    CPC分类号： H01B1/02 ,  C23C18/165 ,  C23C18/1689 ,  C23C18/1696 ,  C23C18/36 ,  C23C30/00

    摘要： A conductive film comprises a phosphide particle coated film formed by attaching raw material particles including phosphide particles comprising a compound of Ti and/or Fe, and P to a surface of a substrate material. This conductive film exhibits good corrosion resistant conductivity, and can be easily formed at low costs because of comprising the phosphide particle coated film. A corrosion-resistant conduction film comprises an iron-containing titanium phosphide layer containing Ti, Fe and P as essential basic elements. A corrosion-resistant conduction material having this corrosion-resistant conduction film on a surface of a substrate exhibits good corrosion resistance or conductivity. This corrosion-resistant conduction material can be obtained, for example, by a process comprising a plating step of forming an Ni plating layer on a surface of a Ti-based material substrate and a nitriding step of applying nitriding treatment to the Ti-based material substrate after the plating step at not more than 880 deg. C.

    摘要翻译： 导电膜包括通过将包含Ti和/或Fe化合物的磷化物颗粒和P的原料颗粒附着到基材的表面而形成的磷化物颗粒涂布膜。 该导电膜表现出良好的耐腐蚀性导电性，并且由于包含磷化物粒子涂布膜，可以以低成本容易地形成。 耐腐蚀导电膜包括含有Ti，Fe和P作为必需碱性元素的含铁磷化钛层。 在基板表面具有这种耐腐蚀导电膜的耐腐蚀导电材料表现出良好的耐腐蚀性或导电性。 该耐腐蚀导电材料可以通过例如在Ti基材料基板的表面上形成Ni镀层的镀覆工序和对Ti系材料进行氮化处理的氮化工序 电镀步骤后的基板不大于880度。 C。

    Paper feeder
    6.
    发明授权
    Paper feeder 失效
    送纸器

    公开(公告)号：US4189138A

    公开(公告)日：1980-02-19

    申请号：US873810

    申请日：1978-01-31

    申请人： Kiyoshi Kaneko ,  Shigeru Ikeda ,  Ken-ichi Suzuki

    发明人： Kiyoshi Kaneko ,  Shigeru Ikeda ,  Ken-ichi Suzuki

    IPC分类号： B65H3/06 ,  B65H3/60 ,  G03B27/14 ,  G03G15/00

    CPC分类号： B65H3/0669 ,  B65H3/60

    摘要： A paper feeding apparatus adapted to feed paper sheets one by one by the rotational force of feed rollers acting on the uppermost surface of stacked paper sheets, including a linkage arrangement for moving the feed rollers transverse to the direction of paper sheet feed.

    摘要翻译： 一种供纸装置，其适于通过作用在堆叠纸张的最上表面上的进给辊的旋转力逐个进给纸张，包括用于使进给辊横向于纸张进给方向移动的连杆装置。

    Metal separator for fuel cell and method for producing the same
    7.
    发明授权
    Metal separator for fuel cell and method for producing the same 有权
    燃料电池用金属隔板及其制造方法

    公开(公告)号：US08241530B2

    公开(公告)日：2012-08-14

    申请号：US12299491

    申请日：2007-05-18

    申请人： Toshio Horie ,  Gaku Kitahara ,  Nobuaki Suzuki ,  Hiroyuki Mori ,  Ken-ichi Suzuki ,  Isamu Ueda ,  Kazuaki Nishino

    发明人： Toshio Horie ,  Gaku Kitahara ,  Nobuaki Suzuki ,  Hiroyuki Mori ,  Ken-ichi Suzuki ,  Isamu Ueda ,  Kazuaki Nishino

    IPC分类号： H01B1/04 ,  C23C8/72 ,  B05D5/12

    CPC分类号： H01M8/0215 ,  C22C14/00 ,  C23C4/10 ,  C23C4/18 ,  C23C8/42 ,  C23C8/80 ,  H01M8/0206 ,  H01M8/0228 ,  Y02P70/56

    摘要： There is provided an electron conductive and corrosion-resistant material 3 containing titanium (Ti), boron (B) and nitrogen (N) in an atomic ratio satisfying 0.05≦[Ti]≦0.40, 0.20≦[B]≦0.40, and 0.35≦[N]≦0.55 (provided that [Ti]+[B]+[N]=1). Further, there is provided a method of manufacturing an electron conductive and corrosion-resistant material 3, wherein boron nitride powder adheres to the surface of a substrate 2 of which at least the surface is made of titanium or a titanium alloy, and is then heated. Furthermore, there is provided a method of manufacturing an electron conductive and corrosion-resistant material 3, wherein the surface of a substrate 2 of which at least the surface is made of titanium or a titanium alloy is borided and then heated. In addition, there is provided a method of manufacturing an electron conductive and corrosion-resistant material 3, wherein a TiB2 layer formed of TiB2 particles is formed by spraying TiB2 powder onto a metal substrate 2 and then nitriding the TiB2 layer.

    摘要翻译： 提供了含有钛（Ti），硼（B）和氮（N）的电子导电和耐腐蚀材料3，原子比满足0.05＆nlE; [Ti]＆nlE; 0.40,0.20＆lt; 1; [B]＆nlE; 0.40和0.35＆nlE; [N]＆nlE; 0.55（条件是[Ti] + [B] + [N] = 1）。 此外，提供了一种制造电子传导和耐腐蚀材料3的方法，其中氮化硼粉末粘附到至少表面由钛或钛合金制成的基底2的表面，然后被加热 。 此外，提供一种制造电子传导和耐腐蚀材料3的方法，其中至少将表面由钛或钛合金制成的基板2的表面被硼化然后被加热。 此外，提供了一种制造电子传导和耐腐蚀材料3的方法，其中由TiB 2颗粒形成的TiB 2层通过将TiB 2粉末喷涂到金属基底2上然后氮化TiB 2层而形成。

    Device isolation by etching trench in dielectric on substrate and epitaxially filling the trench
    10.
    发明授权
    Device isolation by etching trench in dielectric on substrate and epitaxially filling the trench 失效
    通过在衬底上的电介质中蚀刻沟槽并外延地填充沟槽来进行器件隔离

    公开(公告)号：US4886763A

    公开(公告)日：1989-12-12

    申请号：US233580

    申请日：1988-08-18

    申请人： Ken-ichi Suzuki

    发明人： Ken-ichi Suzuki

    IPC分类号： H01L21/205 ,  H01L21/76 ,  H01L21/762

    CPC分类号： H01L21/76294

    摘要： A method of forming dielectric isolation regions includes the steps of forming a first dielectric layer having a groove on a semiconductor substrate, forming a second dielectric film on the entire surface including the groove, and forming dielectric isolation regions by utilizing the second dielectric film formed on side walls of the grooves as an isolation region.

    摘要翻译： 形成电介质隔离区域的方法包括以下步骤：在半导体衬底上形成具有凹槽的第一电介质层，在包括沟槽的整个表面上形成第二电介质膜，并且通过利用形成在第 沟槽的侧壁作为隔离区域。