摘要:
The diving mask is capable of suitably restraining abnormal image vision and which can be precisely produced at low cost. The diving mask of the present invention comprises a viewfield lens, which is constituted by a flat front section and side sections extended from the front section. The side sections are formed like toric faces, and the side sections respectively have Fresnel lens parts capable of correcting negative refracting power under water.
摘要:
An electrical connecting member is provided with a holding member made of an electric insulating material and a plurality of conductive members held by the holding member in a state of being insulated with each other. One end of each of the conductive members is exposed on one surface of the holding member and the other end of each of the conductive members is exposed on the other surface of the holding member. The conductive members have portions exposed from the holding member, the length of which is longer than the thickness of the holding member. These exposed portions are easily deformed by the pressure force exerted at the time of connecting electric circuit components to reduce the coupling load even when there is irregularity in the heights thereof or unevenness in the junctions of the objects connection, hence enabling high density connections between the electric circuit components. The exposed portions can also be formed to have empty holes 1B, to be porous or, in the alternative, annealed to soften the exposed portions.
摘要:
In a semiconductor device which has through holes in an end face, in which a semiconductor element is fixedly mounted on a face of a substrate which has a wiring pattern, which is conductive to the wiring portion formed in the through hole, in at least one face, in which electrodes of the semiconductor element are electrically connected to the wiring pattern, and in which the face of the substrate which has the semiconductor element is coated with a resin, the through hole has a through hole land with a width of 0.02 mm or more, which is conductive to the wiring portion, in a substrate face, and the wiring portion and the through hole land are exposed.
摘要:
A watertight suit is capable of properly discharging air within the suit and safely maintaining a diver's position in the water. The suit includes an air outlet valve provided in an end section of a leg part, the air outlet valve functioning to discharge air from the inside of the leg part. Another air outlet valve can also be provided in an upper body part of the suit. An air inlet introduces air into the watertight suit as necessary to equalize external pressure. Where an automatic air outlet valve is provided, air in excess of external pressure is vented through the outlet valves automatically as warranted by the diving conditions, keeping an even balance of pressure even when air is excessively supplied form the air source through the inlet valve.
摘要:
An electrical circuit member comprises an electrical connecting member, said electrical connecting member having a holding member comprising an electrically insulating material and a plurality of electroconductive members embedded at predetermined intervals within said holding member, each of said plurality of electroconductive members being insulated with said electrically insulating material and also having the ends of said electroconductive member exposed on both surfaces of said holding member; and an electrical circuit part, said electrical circuit part having connecting portions to be connected to said electroconductive member or said wiring pattern exposed on both surfaces of said holding member, and being connected to at least one surface of said holding member.
摘要:
A process for preparing an electrical connecting member having a holding member with an electrically insulating material, and a plurality of electroconductive members. The electroconductive members are mutually insulated from each other and one end of each of the electroconductive members is exposed at one surface of the holding member and the other end is exposed at another surface of the holding member. A holding member is formed by forming a layer on a base member with the holding member having a photosensitive resin on the uppermost surface of the layer. The holding member is exposed and developed by forming a plurality of holes through the holding member, thereby exposing the uppermost surface of the layer. A part of the exposed layer is etched away and the holes on the holding member are filled with an electroconductive member. The remaining layer and base member are then removed.
摘要:
In a semiconductor device which has through holes in an end face, in which a semiconductor element is fixedly mounted on a face of a substrate which has a wiring pattern, which is conductive to the wiring portion formed in the through hole, in at least one face, in which electrodes of the semiconductor element are electrically connected to the wiring pattern, and in which the face of the substrate which has the semiconductor element is coated with a resin, the through hole has a through hole land with a width of 0.02 mm or more, which is conductive to the wiring portion, in a substrate face, and the wiring portion and the through hole land are exposed.
摘要:
A first terminal portion constructed by a plurality of contact pins of a first circuit board and a second terminal portion constructed by a plurality of contact pins of a second circuit board are joined in a housing of a connector. The connector has a presser for applying a pressing force to a joint portion. The presser applies the pressing force, thereby joining the plurality of contact pins of the first terminal and the plurality of contact pins of the second terminal through soft metal projections. Thus, a joint area of the contact terminal portion can be increased and the reliability of the joining can be improved. Since the circuit boards are positioned, the terminal portions of the circuit boards can be accurately joined.
摘要:
A method of producing an electrical connection member includes the steps of applying a carrier containing a light-sensitive resin onto a substrate member, forming holes in portions of the carrier to form a pattern and expose the substrate member in the holes, filling each hole in the carrier with an electrically conductive member, and removing the substrate member from the carrier. With this method, it is possible to easily produce electrical connection members in which high density electrical connecting portions can be provided and in which the reliability and security of electrical connections can be improved.