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公开(公告)号：US20110101544A1
公开(公告)日：2011-05-05
申请号：US12913332
申请日：2010-10-27
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L23/49575 , H01L21/56 , H01L23/3107 , H01L23/4952 , H01L23/49541 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05647 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48647 , H01L2224/48847 , H01L2224/4903 , H01L2224/49051 , H01L2224/49113 , H01L2224/49171 , H01L2224/49179 , H01L2224/73265 , H01L2224/78301 , H01L2224/85148 , H01L2224/85181 , H01L2224/85345 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/20752 , H01L2924/20753 , H01L2924/00 , H01L2924/00012 , H01L2224/43
摘要： A semiconductor device permitting the reduction of cost is disclosed. In a semiconductor package wherein electrode pads of a semiconductor chip and corresponding inner leads are electrically coupled with each other through a plurality of bonding wires, sensing wires (second and fourth bonding wires) are made thinner than other bonding wires (first and third bonding wires) coupled to inner leads same as those with the sensing wires coupled thereto, thereby reducing the cost of gold wires to attain the reduction in cost of the semiconductor package.
摘要翻译： 公开了允许降低成本的半导体器件。 在半导体封装中，半导体芯片的电极焊盘和对应的内部引线通过多根接合线彼此电耦合，使感测线（第二和第四接合线）比其它接合线（第一和第三接合线 ）耦合到与将感测线耦合到其上的内引线相同的内引线，从而降低金线的成本以实现半导体封装的成本降低。
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公开(公告)号：US08384229B2
公开(公告)日：2013-02-26
申请号：US12913332
申请日：2010-10-27
CPC分类号： H01L23/49575 , H01L21/56 , H01L23/3107 , H01L23/4952 , H01L23/49541 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05647 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48647 , H01L2224/48847 , H01L2224/4903 , H01L2224/49051 , H01L2224/49113 , H01L2224/49171 , H01L2224/49179 , H01L2224/73265 , H01L2224/78301 , H01L2224/85148 , H01L2224/85181 , H01L2224/85345 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/20752 , H01L2924/20753 , H01L2924/00 , H01L2924/00012 , H01L2224/43
摘要： A semiconductor device permitting the reduction of cost is disclosed. In a semiconductor package wherein electrode pads of a semiconductor chip and corresponding inner leads are electrically coupled with each other through a plurality of bonding wires, sensing wires (second and fourth bonding wires) are made thinner than other bonding wires (first and third bonding wires) coupled to inner leads same as those with the sensing wires coupled thereto, thereby reducing the cost of gold wires to attain the reduction in cost of the semiconductor package.
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公开(公告)号：US5987737A
公开(公告)日：1999-11-23
申请号：US568425
申请日：1995-12-06
申请人： Hiroki Mieda , Junzi Sakakibara , Takehiko Ikegami
发明人： Hiroki Mieda , Junzi Sakakibara , Takehiko Ikegami
CPC分类号： B29C37/02 , B29C45/382 , B29L2031/3406 , Y10T225/329 , Y10T225/371 , Y10T225/379 , Y10T29/49121 , Y10T29/49799
摘要： A device and method for positioning a resin-sealed lead frame that includes semiconductor devices and resin for sealing the semiconductor devices on the lead frame. A break unit is provided for moving the resin-sealed lead frame to a break table. The break unit includes a vacuum suction portion to hold the resin-sealed lead frame during movement and to release it when the resin-sealed lead frame is brought into a receiving opening associated with the break table. The receiving opening is defined by a plurality of guides with the outer tip portions of the guides providing the receiving opening as a space larger than that occupied by the outer configuration of the resin-sealed lead frame. The guides have a slope to position the resin-sealed lead frame onto the break table after it is released in the receiving opening. The break unit further includes push down pins for pushing down and breaking off unwanted extra portions of resin from beneath the resin-sealed lead frame. The break table is further provided with notches which have shapes corresponding to the shapes of unwanted extra portions of resin of the resin-sealed lead frame.
摘要翻译： 一种用于定位树脂密封引线框架的装置和方法，该引线框架包括半导体器件和用于将引线框上的半导体器件密封的树脂。 提供了用于将树脂密封的引线框架移动到断裂台的断路单元。 断路单元包括真空抽吸部分，以在移动期间保持树脂密封的引线框架并且当树脂密封的引线框架进入与断裂台相关联的接收开口时将其释放。 接收开口由多个引导件限定，引导件的外部末端部将接收开口设置为比树脂密封引线框架的外部构造所占据的空间大的空间。 引导件具有斜面，用于将树脂密封的引线框架在接收开口中释放后将其定位在断裂台上。 断路单元还包括用于从树脂密封引线框架下方推下并分解树脂的不需要的额外部分的推下销。 断裂台还设置有具有与树脂密封引线框架的树脂的不需要的额外部分的形状对应的形状的凹口。
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公开(公告)号：US06830446B2
公开(公告)日：2004-12-14
申请号：US10264354
申请日：2002-10-04
申请人： Hiroyoshi Harada , Itaru Matsuo , Takehiko Ikegami , Hiromichi Yamada , Jyunji Sakakibara , Hiroaki Tanoue
发明人： Hiroyoshi Harada , Itaru Matsuo , Takehiko Ikegami , Hiromichi Yamada , Jyunji Sakakibara , Hiroaki Tanoue
IPC分类号： B29C4566
CPC分类号： B29C45/661
摘要： A clamping apparatus includes upper and lower platens; one or more tiebars connecting the platens; and an intermediate platen between the upper and lower platens for movement relative to and along the tiebars. Upper and lower mold halves are provided on the upper and intermediate platens, respectively. A linkage connects the lower and intermediate platens. The linkage includes upper and lower links connected with each other for rotation on an intermediate shaft. The upper and lower links are pivotably supported on first and second shafts fixed to the intermediate and lower platens, repectively. The intermediate shaft is operatively connected with a drive mechanism so that the drive mechanism transmits a driving force to the linkage, and the lower platen is moved relative to the intermediate platen. A set of a radical needle bearing and a thrust bearing is used for at least one of the intermediate, first, and second shafts.
摘要翻译： 夹紧装置包括上压板和下压板; 连接压板的一个或多个连杆; 以及在上压板和下压板之间的中间压板，用于相对于并沿着拉杆运动。 上半模和下半模分别设置在上压板和中压板上。 连杆连接下部和中间压板。 联动装置包括彼此连接以在中间轴上旋转的上部和下部连杆。 上连杆和下连杆分别可枢转地支撑在固定到中间和下压板上的第一和第二轴上。 中间轴与驱动机构可操作地连接，使得驱动机构向联动装置传递驱动力，下压板相对于中间压板移动。 一组自由基滚针轴承和推力轴承用于中间轴，第一轴和第二轴中的至少一个轴。
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