TIN-CONTAINING POLYURETHANE RESIN
    9.
    发明申请
    TIN-CONTAINING POLYURETHANE RESIN 有权
    含TIN的聚氨酯树脂

    公开(公告)号:US20130004672A1

    公开(公告)日:2013-01-03

    申请号:US13635053

    申请日:2011-05-05

    申请人: Carmen Flosbach

    发明人: Carmen Flosbach

    IPC分类号: C08G18/83 B05D3/10 C09D175/04

    摘要: A tin-containing polyurethane resin having a melting temperature of 40 to 180° C., measured by DSC at a heating rate of 10 K/min and prepared by carrying out a condensation reaction between a diorganotin compound and carboxyl groups of a carboxyl-functional polyurethane resin, wherein the molar ratio between the tin and the carboxyl groups is 1:2-20; and liquid coating compositions containing solid particles of the tin-containing polyurethane resin.

    摘要翻译: 熔融温度为40〜180℃的含锡聚氨酯树脂,通过DSC以10K /分钟的加热速度测定,通过二有机锡化合物和羧基官能团的羧基之间的缩合反应制备 聚氨酯树脂,其中锡和羧基之间的摩尔比为1:2〜20; 和含有含锡聚氨酯树脂的固体颗粒的液体涂料组合物。

    Heat-Curable Urethane Resin Composition
    10.
    发明申请
    Heat-Curable Urethane Resin Composition 有权
    热固性聚氨酯树脂组合物

    公开(公告)号:US20070293636A1

    公开(公告)日:2007-12-20

    申请号:US11663192

    申请日:2005-09-20

    IPC分类号: C08F283/04 C08G18/00

    摘要: The invention provides a heat-curable resin composition comprising (A) a polyurethane having two or more carboxyl groups in one molecule, in particular a polyurethane having one or more carboxyl groups at a molecular terminal and (B) a heat-curable component, a cured product thereof, a solder resist and a protective film consisting of the cured product and a printed wiring board coated with the cured product. The polyurethane(A), preferably has a number average molecular weight of 500 to 100,000 and an acid value of 5 to 150 mgKOH/g. The heat-curable component (B) is preferably an epoxy resin. The heat-curable resin composition of the invention is excellent in adhesion with a substrate, low-warpage property, flexibility, resistance to moisture and heat, soldering heat resistance and resistance to tin plating.

    摘要翻译: 本发明提供一种热固性树脂组合物,其包含(A)在一个分子中具有两个或更多个羧基的聚氨酯,特别是在分子末端具有一个或多个羧基的聚氨酯和(B)可热固化组分, 其固化产物,阻焊剂和由固化产物组成的保护膜和涂覆有固化产物的印刷线路板。 聚氨酯(A)的数均分子量优选为500〜100,000,酸值为5〜150mgKOH / g。 可热固化成分(B)优选为环氧树脂。 本发明的热固性树脂组合物与基材的粘合性优异,翘曲性,柔软性,耐湿热性,耐焊接性,耐镀锡性优异。