FIELD EFFECT TRANSISTOR USING OXIDE SEMICONDUCTOR AND METHOD FOR MANUFACTURING THE SAME
    3.
    发明申请
    FIELD EFFECT TRANSISTOR USING OXIDE SEMICONDUCTOR AND METHOD FOR MANUFACTURING THE SAME 有权
    使用氧化物半导体的场效应晶体管及其制造方法

    公开(公告)号:US20130146452A1

    公开(公告)日:2013-06-13

    申请号:US13761929

    申请日:2013-02-07

    IPC分类号: H01L29/24

    摘要: A field effect transistor which includes, on a substrate, at least a semiconductor layer, a passivation layer for the semiconductor layer, a source electrode, a drain electrode, a gate insulating film and a gate electrode, the source electrode and the drain electrode being connected through the semiconductor layer, the gate insulating film being present between the gate electrode and the semiconductor layer, the passivation layer being at least on one surface side of the semiconductor layer, and the semiconductor layer including a composite oxide which comprises In (indium), Zn (zinc) and Ga (gallium) in the following atomic ratios (1) to (3): In/(In+Zn)=0.2 to 0.8   (1) In/(In+Ga)=0.59 to 0.99   (2) Zn/(Ga+Zn)=0.29 to 0.99   (3).

    摘要翻译: 一种场效应晶体管,其在衬底上至少包含半导体层,所述半导体层的钝化层,源电极,漏电极,栅绝缘膜和栅电极,所述源电极和所述漏电极为 通过所述半导体层连接,所述栅极绝缘膜存在于所述栅电极和所述半导体层之间,所述钝化层至少在所述半导体层的一个表面侧,所述半导体层包括复合氧化物,所述复合氧化物包括In(铟) ,In(In + Zn)= 0.2〜0.8(1)In /(In + Ga)= 0.59〜0.99(2)的Zn(锌)和Ga(镓) )Zn /(Ga + Zn)= 0.29〜0.99(3)。

    TFT SUBSTRATE AND METHOD FOR PRODUCING TFT SUBSTRATE
    5.
    发明申请
    TFT SUBSTRATE AND METHOD FOR PRODUCING TFT SUBSTRATE 有权
    TFT基板及制造TFT基板的方法

    公开(公告)号:US20120009725A1

    公开(公告)日:2012-01-12

    申请号:US13216583

    申请日:2011-08-24

    IPC分类号: H01L33/62

    摘要: An object of the invention is to provide a TFT substrate and a method for producing a TFT substrate which is capable of drastically reducing the production cost by decreasing the number of steps in the production process and improving production yield. A TFT substrate comprises: a substrate; a first oxide layer formed above the substrate; a second oxide layer formed above the first oxide layer with a channel part interposed therebetween; gate insulating film formed above the substrate, the first oxide layer and the second oxide layer; a gate electrode and a gate wire formed above the gate insulating film.

    摘要翻译: 本发明的目的是提供一种TFT基板和TFT基板的制造方法,其能够通过减少制造工序中的工序数和提高生产率而大大降低生产成本。 TFT基板包括:基板; 在基板上形成的第一氧化物层; 形成在所述第一氧化物层上方的第二氧化物层,其间插入有沟道部分; 栅极绝缘膜,形成在衬底上方,第一氧化物层和第二氧化物层; 形成在栅极绝缘膜上方的栅电极和栅极线。

    WIRING MATERIAL AND WIRING BOARD USING THE SAME
    6.
    发明申请
    WIRING MATERIAL AND WIRING BOARD USING THE SAME 审中-公开
    使用相同的接线材料和接线板

    公开(公告)号:US20070228575A1

    公开(公告)日:2007-10-04

    申请号:US11758279

    申请日:2007-06-05

    申请人: Kazuyoshi INOUE

    发明人: Kazuyoshi INOUE

    IPC分类号: H01L23/49

    摘要: A wiring material for TFT-LCD which comprises an Ag alloy containing Ag and Zr as essential components and further one or more metals selected from the group consisting of Au, Ni, Co and Al; and a wiring material which comprises a Cu alloy comprising Au and/or Co and Cu, wherein the alloy has a Cu content of 80 to 99.5 wt % and a sum of a Au (or Cu) on a glass substrate or a silicon wafer by the sputtering method has exhibited satisfactorily low electric resistance and also satisfactorily high adhesion strength to the substrate or the wafer.

    摘要翻译: 一种用于TFT-LCD的布线材料,其包含含有Ag和Zr作为必要成分的Ag合金,还包括一种或多种选自Au,Ni,Co和Al的金属; 以及包含Au和/或Co和Cu的Cu合金的配线材料,其中,所述合金的Cu含量为80〜99.5重量%,玻璃基板或硅晶片上的Au(或Cu)的和为 溅射法表现出令人满意的低电阻,并且对基板或晶片的粘附强度也令人满意。