摘要:
This invention relates to a photoconductive antenna element having a structure capable of preventing element characteristics from deteriorating and attain a smaller size at the same time. This photoconductive antenna element (17) comprises a pair of electrodes (21) formed on a semiconductor layer (19). Each electrode (21) is constituted by an antenna part (22), pad parts (23), and a line part (24) connecting them, while the line part (24) includes a parallel portion (24a) extending from the antenna part (22). In the line part (24) of one electrode (21), a portion other than the antenna region (A) is bent opposite to the other electrode (21). In the line part (24) of the other electrode (21), a portion other than the antenna region (A) is bent opposite to the one electrode (21). This structure can prevent the photoconductive antenna element (17) from deteriorating its element characteristics and make it smaller.
摘要:
This invention relates to a photoconductive antenna element having a structure capable of preventing element characteristics from deteriorating and attain a smaller size at the same time. This photoconductive antenna element (17) comprises a pair of electrodes (21) formed on a semiconductor layer (19). Each electrode (21) is constituted by an antenna part (22), pad parts (23), and a line part (24) connecting them, while the line part (24) includes a parallel portion (24a) extending from the antenna part (22). In the line part (24) of one electrode (21), a portion other than the antenna region (A) is bent opposite to the other electrode (21). In the line part (24) of the other electrode (21), a portion other than the antenna region (A) is bent opposite to the one electrode (21). This structure can prevent the photoconductive antenna element (17) from deteriorating its element characteristics and make it smaller.
摘要:
In a semiconductor photodetector 1 according to the present invention, flat surfaces of three steps with different heights are formed in a top surface portion of a semi-insulating GaAs substrate 2. An n-type GaAs layer 3, an i-type GaAs layer 4, and a p-type GaAs layer 5 are successively deposited on the lower step surface formed in a central region of the semi-insulating GaAs substrate 2. Furthermore, a p-side ohmic electrode 6 is provided astride and above a flat surface formed by the p-type GaAs layer 5 and the upper step surface of the semi-insulating GaAs substrate 2, and an n-side ohmic electrode 7 is provided astride and above a flat surface formed by the n-type GaAs layer 3 and the middle step surface of the semi-insulating GaAs substrate 2.
摘要:
SUM and CARRY output signals of a first optical half adder are provided to one input terminal of a second optical half adder and an optical latch memory, respectively, and an output signal of the optical latch memory is provided to the other input terminal of the second optical half adder. Input and output of the two optical half adders and optical latch memory are performed through an optical signal. Each optical half adder includes two light-receiving elements each having a symmetrical electrode arrangement in which two Schottky junctions are connected to each other opposite in polarity, and peripheral elements of resistors, a capacitor and an amplifier. The optical latch memory is an optical flip-flop memory in which a high-speed light-receiving element produces an electric signal in response to an input optical signals, and a high-speed light-emitting element produces, in response to the electric signal guided from the light-receiving element, feed-back light to be applied to the light-receiving element and an output optical signal.
摘要:
There is disclosed a waveguide structure that propagates surface plasmon waves, comprising: a quantum well structure, disposed on a semiconductor substrate; wherein the quantum well structure has a quantum well layer, in turn having an intersecting region that intersects a hypothetical plane substantially orthogonal to an alignment direction of the quantum well structure with respect to the semiconductor substrate, and a real part of a dielectric constant of the quantum well structure is negative for THz waves of a predetermined wavelength.
摘要:
A UV sensor (1) includes a container (5) in which the upper end opening of a metal side tube (2) is sealed with a front plate (3) composed of borosilicate glass as an incident light window and the lower end opening is sealed with a base plate (4). The front plate (3) serving as an incident light window constitutes part of the wall of container (5) by sealing the upper end opening of the metal side tube (2). A pin-type photodiode (6) is disposed inside the container (5). The pin-type photodiode (6) comprises a photoabsorption layer (9) formed from InxGa(1−x)N (0
摘要:
An optical flip-flop circuit which includes an electrical power source for providing an electrical signal, a light-receiving element provided in series with the power source for switching the electrical signal in response to an optical signal, a light-emitting element for emitting the optical signal in response to the electric signal, an electrical signal path between the light-receiving element and the light-emitting element, whereby the electrical signal passes from the power source to the light-emitting element in response to the optical signal received by the light-receiving element, a light path for directing the optical signal from the light-emitting element to the light-receiving element, wherein the light path and the electrical signal path form a signal loop through which a signal circulates, said circulating signal comprising the electrical signal through the electrical signal path portion of the signal loop and the optical signal through the light path portion of the signal loop, and input/output means for providing an input optical signal to the light-receiving element and for emitting a portion of the optical signal directed by the light path.
摘要:
A semiconductor photocathode 1 includes: a transparent substrate 11; a first electrode 13, formed on the transparent substrate 11 and enabling passage of light that has been transmitted through the transparent substrate 11; a window layer 14, formed on the first electrode 13 and formed of a semiconductor material with a thickness of no less than 10 nm and no more than 200 nm; a light absorbing layer 15, formed on the window layer 14, formed of a semiconductor material that is lattice matched to the window layer 14, is narrower in energy band gap than the window layer 14, and in which photoelectrons are excited in response to the incidence of light; an electron emission layer 16, formed on the light absorbing layer 15, formed of a semiconductor material that is lattice matched to the light absorbing layer 15, and emitting the photoelectrons excited in the light absorbing layer 15 to the exterior from a surface; and a second electrode 18, formed on the electron emission layer.
摘要:
A semiconductor light-receiving device has a substrate including upper, middle and lower regions in its front side. A p-type layer on the lower region has a top surface including a portion on a level with the middle region. An electrode covers at least part of the boundary between the portion of the p-type layer and the middle region. An n-type layer on the p-type layer has a top surface including a portion on a level with the upper region. Another electrode covers at least part of the boundary between the portion of the n-type layer and the upper region.
摘要:
Multilayer films (2 to 7 ) containing a light absorption layer (4) are formed on a GaAs substrate. After laminating the GaAs substrate (1) and a glass substrate (8) so that an uppermost surface film (7) of the multilayer film and the glass substrate (8) may come into contact with each other, by pressurizing between the GaAs substrate (1) and the glass substrate (8) and heating them together, both substrates (1) and (8) are fusion-bonded. Next, the GaAs substrate (1) and the buffer layer (2) are first removed, and then the etch stop layer (3) is removed. Then, while coming into contact with the light absorption layer (4), comb-type Schottky electrodes (10) and (11), which are mutually apart, are formed.