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    Plating apparatus, plating method and substrate processing apparatus
    4.
    发明申请
    Plating apparatus, plating method and substrate processing apparatus 审中-公开
    电镀装置，电镀方法和基板处理装置

    公开(公告)号：US20050023149A1

    公开(公告)日：2005-02-03

    申请号：US10860115

    申请日：2004-06-04

    申请人： Tsutomu Nakada ,  Junji Kunisawa ,  Hiroyuki Kanda ,  Mizuki Nagai ,  Satoru Yamamoto ,  Koji Mishima ,  Shinya Morisawa ,  Seiji Katsuoka ,  Natsuki Makino ,  Yukio Fukunaga

    发明人： Tsutomu Nakada ,  Junji Kunisawa ,  Hiroyuki Kanda ,  Mizuki Nagai ,  Satoru Yamamoto ,  Koji Mishima ,  Shinya Morisawa ,  Seiji Katsuoka ,  Natsuki Makino ,  Yukio Fukunaga

    IPC分类号： C25D5/00 ,  C25D7/12 ,  C25D17/06

    CPC分类号： C25D17/001 ,  C25D7/123 ,  C25D17/06

    摘要： The present invention provides a plating apparatus which uses an insoluble anode and which can perform plating of a substrate stably while preventing oxygen gas, generated due to the use of the insoluble anode, from causing defects in the substrate. The plating apparatus includes: a substrate holder for holding a substrate; a cathode section including a seal ring for contacting a peripheral portion of a surface, to be plated, of the substrate held by the substrate holder to seal the peripheral portion water-tightly, and a cathode for contacting the substrate to supply current to the substrate; a vertically-movable electrode head provided above the cathode section, including an anode chamber housing an anode made of an insoluble material and having a bottom opening closed with a water-permeable porous member; a plating solution injection section for injecting a plating solution between the anode and the surface, to be plated, of the substrate held by the substrate holder; a power source for applying a plating voltage between the cathode and the anode; and a gas discharge line for discharging a gas from the anode chamber.

    摘要翻译： 本发明提供一种电镀装置，其使用不溶性阳极，并且可以在防止由于使用不溶性阳极而产生的氧气导致基板中的缺陷的同时稳定地进行基板的电镀。 电镀装置包括：用于保持基板的基板保持件; 阴极部分，包括用于接触被基板保持器保持的基板的周边部分的密封环，以密封周边部分，以及用于接触基板以向基板供应电流的阴极 ; 设置在所述阴极部分上方的可垂直移动的电极头，包括容纳由不溶性材料制成的阳极并且具有用透水性多孔构件封闭的底部开口的阳极室; 电镀溶液注入部，用于在被基板保持器保持的基板的阳极和要被电镀的表面之间注入电镀液; 用于在阴极和阳极之间施加电镀电压的电源; 以及用于从阳极室排出气体的气体排出管线。

    Electroplating apparatus and electroplating method
    5.
    发明申请
    Electroplating apparatus and electroplating method 有权
    电镀设备和电镀方法

    公开(公告)号：US20080029398A1

    公开(公告)日：2008-02-07

    申请号：US11708548

    申请日：2007-02-21

    申请人： Satoru Yamamoto ,  Keiichi Kurashina ,  Takashi Kawakami ,  Tsutomu Nakada ,  Hiroyuki Kanda ,  Junji Kunisawa ,  Kunihito Ide

    发明人： Satoru Yamamoto ,  Keiichi Kurashina ,  Takashi Kawakami ,  Tsutomu Nakada ,  Hiroyuki Kanda ,  Junji Kunisawa ,  Kunihito Ide

    IPC分类号： C25D5/00 ,  C25D17/00

    CPC分类号： C25D17/001 ,  C25D5/18 ,  C25D7/123 ,  C25D17/004 ,  C25D17/008 ,  C25D17/12 ,  H01L21/6723

    摘要： An electroplating apparatus can form a plated film having a more uniform thickness and good film quality over an entire surface of a substrate having a conductive layer (seed layer) whose resistivity is equal to or higher than that of copper. The electroplating apparatus includes: a substrate holder for holding a substrate; a sealing member for contact with a peripheral portion of a surface of a substrate, held by the substrate holder, to seal the peripheral portion; a cathode contact for contact with a conductive layer formed in the surface of the substrate, held by the substrate holder, to feed electricity to the conductive layer; and a housing having therein an anode to be immersed in a plating solution, and a porous structure disposed at an open end facing the substrate held by the substrate holder, said porous structure defining a plating chamber in the housing; wherein the plating chamber is divided into rooms by a partition plate and the porous structure, and the anode is comprised of a plurality of divided anodes, each divided anode being disposed in each room of the plating chamber so that each divided anode can pass an independent plating current.

    摘要翻译： 电镀装置可以在具有等于或高于铜的导电层（种子层）的基板的整个表面上形成具有更均匀的厚度和更好的膜质量的镀膜。 电镀装置包括：用于保持基板的基板保持件; 密封构件，其与由所述基板保持件保持的基板的表面的周边部接触，以密封所述周边部; 阴极接触件，用于与由衬底保持器保持的衬底表面中形成的导电层接触，以将电力馈送到导电层; 以及壳体，其中具有要浸入电镀溶液中的阳极，以及设置在面向由所述基板保持件保持的所述基板的开口端的多孔结构，所述多孔结构在所述壳体中限定电镀室; 其特征在于，通过分隔板和多孔结构将电镀室分为室，阳极由多个分开的阳极组成，每个分隔的阳极设置在电镀室的每个房间中，使得每个分隔的阳极可以通过独立的 电镀电流。

    Electroplating apparatus and electroplating method
    6.
    发明授权
    Electroplating apparatus and electroplating method 有权
    电镀设备和电镀方法

    公开(公告)号：US08029653B2

    公开(公告)日：2011-10-04

    申请号：US11708548

    申请日：2007-02-21

    申请人： Satoru Yamamoto ,  Keiichi Kurashina ,  Takashi Kawakami ,  Tsutomu Nakada ,  Hiroyuki Kanda ,  Junji Kunisawa ,  Kunihito Ide

    发明人： Satoru Yamamoto ,  Keiichi Kurashina ,  Takashi Kawakami ,  Tsutomu Nakada ,  Hiroyuki Kanda ,  Junji Kunisawa ,  Kunihito Ide

    IPC分类号： C25D17/00

    CPC分类号： C25D17/001 ,  C25D5/18 ,  C25D7/123 ,  C25D17/004 ,  C25D17/008 ,  C25D17/12 ,  H01L21/6723

    摘要： An electroplating apparatus can form a plated film having a more uniform thickness and good film quality over an entire surface of a substrate having a conductive layer (seed layer) whose resistivity is equal to or higher than that of copper. The electroplating apparatus includes: a substrate holder for holding a substrate; a sealing member for contact with a peripheral portion of a surface of a substrate, held by the substrate holder, to seal the peripheral portion; a cathode contact for contact with a conductive layer formed in the surface of the substrate, held by the substrate holder, to feed electricity to the conductive layer; and a housing having therein an anode to be immersed in a plating solution, and a porous structure disposed at an open end facing the substrate held by the substrate holder, said porous structure defining a plating chamber in the housing; wherein the plating chamber is divided into rooms by a partition plate and the porous structure, and the anode is comprised of a plurality of divided anodes, each divided anode being disposed in each room of the plating chamber so that each divided anode can pass an independent plating current.

    摘要翻译： 电镀装置可以在具有等于或高于铜的导电层（种子层）的基板的整个表面上形成具有更均匀的厚度和更好的膜质量的镀膜。 电镀装置包括：用于保持基板的基板保持件; 密封构件，其与由所述基板保持件保持的基板的表面的周边部接触，以密封所述周边部; 阴极接触件，用于与由衬底保持器保持的衬底表面中形成的导电层接触，以将电力馈送到导电层; 以及壳体，其中具有要浸入电镀溶液中的阳极，以及设置在面向由所述基板保持件保持的所述基板的开口端的多孔结构，所述多孔结构在所述壳体中限定电镀室; 其特征在于，通过分隔板和多孔结构将电镀室分为室，阳极由多个分开的阳极组成，每个分隔的阳极设置在电镀室的每个房间中，使得每个分隔的阳极可以通过独立的 电镀电流。

    Electrolytic processing apparatus and method
    8.
    发明申请
    Electrolytic processing apparatus and method 审中-公开
    电解处理装置及方法

    公开(公告)号：US20070034526A1

    公开(公告)日：2007-02-15

    申请号：US11202684

    申请日：2005-08-12

    申请人： Natsuki Makino ,  Junji Kunisawa ,  Keisuke Namiki ,  Yukio Fukunaga ,  Katsuyuki Musaka ,  Ray Fang ,  Emanuel Cooper ,  John Cotte ,  Hariklia Deligianni ,  Keith Kwietniak ,  Brett Baker-O'Neal ,  Matteo Flotta ,  Philippe Vereecken

    发明人： Natsuki Makino ,  Junji Kunisawa ,  Keisuke Namiki ,  Yukio Fukunaga ,  Katsuyuki Musaka ,  Ray Fang ,  Emanuel Cooper ,  John Cotte ,  Hariklia Deligianni ,  Keith Kwietniak ,  Brett Baker-O'Neal ,  Matteo Flotta ,  Philippe Vereecken

    IPC分类号： B23H3/00

    CPC分类号： B23H5/08 ,  C25F3/02 ,  C25F7/00

    摘要： An electrolytic processing apparatus can planarize uniformly over an entire surface of a substrate under a low pressure without any damages to the substrate. The electrolytic processing apparatus has a substrate holder configured to hold and rotate a substrate having a metal film formed on a surface of the substrate and an electrolytic processing unit configured to perform an electrolytic process on the substrate held by the substrate holder. The electrolytic processing unit has a rotatable processing electrode, a polishing pad attached to the rotatable processing electrode, and a pressing mechanism configured to press the polishing pad against the substrate. The electrolytic processing unit also has a liquid supply mechanism configured to supply an electrolytic processing liquid between the substrate and the rotatable processing electrode, a relative movement mechanism operable to move the substrate and the rotatable processing electrode relative to each other, and a power supply configured to applying a voltage between the rotatable processing electrode and the metal film of the substrate so that the rotatable processing electrode serves as a cathode and the metal film of the substrate serves as an anode.

    摘要翻译： 电解处理装置可以在低压下在基板的整个表面上均匀地平坦化，而不会对基板造成任何损坏。 所述电解处理装置具有基板保持件，所述基板保持器被构造成保持和旋转形成在所述基板的表面上的金属膜的基板和被配置为在由所述基板保持器保持的所述基板上进行电解处理的电解处理单元。 电解处理单元具有可旋转的处理电极，附接到可旋转处理电极的抛光垫，以及被配置为将抛光垫压靠在基板上的按压机构。 电解处理单元还具有：液体供给机构，被构造成在基板和可旋转处理电极之间提供电解处理液体;相对移动机构，其可操作以相对于彼此移动基板和可旋转处理电极;电源配置 在可旋转处理电极和基板的金属膜之间施加电压，使得可旋转处理电极用作阴极，并且基板的金属膜用作阳极。

    Plating apparatus
    9.
    发明授权
    Plating apparatus 有权
    电镀装置

    公开(公告)号：US07901550B2

    公开(公告)日：2011-03-08

    申请号：US11907591

    申请日：2007-10-15

    申请人： Natsuki Makino ,  Keisuke Namiki ,  Kunihito Ide ,  Junji Kunisawa ,  Katsuyuki Musaka

    发明人： Natsuki Makino ,  Keisuke Namiki ,  Kunihito Ide ,  Junji Kunisawa ,  Katsuyuki Musaka

    IPC分类号： C25D17/06

    CPC分类号： C25D17/00 ,  C25D5/52 ,  C25D17/004 ,  C25D17/007 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76877

    摘要： A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus includes a substrate holder, a cathode contact for contacting a conductive film formed on the substrate so that the conductive film serves as a cathode, a ring-shaped seal member for covering the cathode contact and bringing its inner circumferential portion into contact with the peripheral portion of the substrate to seal the peripheral portion of the substrate, an anode disposed so as to face the conductive film formed on the substrate, and an auxiliary cathode disposed with respect to the seal member such that at least part of the auxiliary cathode is exposed on a surface of the seal member. Plating is carried out by bringing the conductive film, the anode and the auxiliary cathode into contact with a plating solution.

    摘要翻译： 电镀装置可以在基板的整个表面上形成均匀厚度的镀膜，而不会改变构件。 镀覆装置包括：基板保持件，用于使形成在基板上的导电膜接触以使导电膜用作阴极的阴极接触件，用于覆盖阴极接触并使其内周部分与其接触的环形密封构件 所述基板的周边部分密封所述基板的周边部分，设置成面对形成在所述基板上的导电膜的阳极和相对于所述密封部件设置的辅助阴极，使得所述辅助阴极的至少一部分 暴露在密封构件的表面上。 通过使导电膜，阳极和辅助阴极与电镀液接触来进行电镀。

    Plating apparatus
    10.
    发明申请
    Plating apparatus 有权
    电镀装置

    公开(公告)号：US20090095618A1

    公开(公告)日：2009-04-16

    申请号：US11907591

    申请日：2007-10-15

    申请人： Natsuki Makino ,  Keisuke Namiki ,  Kunihito Ide ,  Junji Kunisawa ,  Katsuyuki Musaka

    发明人： Natsuki Makino ,  Keisuke Namiki ,  Kunihito Ide ,  Junji Kunisawa ,  Katsuyuki Musaka

    IPC分类号： C25D17/00

    CPC分类号： C25D17/00 ,  C25D5/52 ,  C25D17/004 ,  C25D17/007 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76877

    摘要： A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus included a substrate holder, a cathode contact for contacting a conductive film formed on the substrate so that the conductive film serves as a cathode, a ring-shaped seal member for covering the cathode contact and bringing its inner circumferential portion into contact with the peripheral portion of the substrate to seal the peripheral portion of the substrate, an anode disposed so as to face the conductive film formed on the substrate, and an auxiliary cathode disposed to the seal member such that at least part of the auxiliary cathode expose on a surface of the seal member. Plating is carried out by bringing the conductive film, the anode and the auxiliary cathode into contact with a plating solution.

    摘要翻译： 电镀装置可以在基板的整个表面上形成均匀厚度的镀膜，而不会改变构件。 电镀装置包括：衬底保持器，用于接触形成在衬底上的导电膜的阴极接触件，使得导电膜用作阴极;环形密封构件，用于覆盖阴极接触并使其内周部分与 基板的周边部分，以密封基板的周边部分，设置成面对形成在基板上的导电膜的阳极和设置在密封部件上的辅助阴极，使得辅助阴极的至少一部分暴露于 密封件的表面。 通过使导电膜，阳极和辅助阴极与电镀液接触来进行电镀。