摘要:
There is provided a treatment method of efficiently separating an additive component from a resin component for the purpose of treating and recycling a thermoplastic resin composition containing an additive. The treatment method includes heating and agitating the thermoplastic resin composition containing the additive together with a solvent for dissolving at least part of the additive at a temperature ranging from the glass transition temperature of the thermoplastic resin to the boiling point of the solvent inclusive, and separating and recovering the solvent in a liquid state in which at least part of the additive is dissolved, so that at least part of the additive is separated and removed from the thermoplastic resin composition.
摘要:
There is provided a treatment method of efficiently separating an additive component from a resin component for the purpose of treating and recycling a thermoplastic resin composition containing an additive. The treatment method includes heating and agitating the thermoplastic resin composition containing the additive together with a solvent for dissolving at least part of the additive at a temperature ranging from the glass transition temperature of the thermoplastic resin to the boiling point of the solvent inclusive, and separating and recovering the solvent in a liquid state in which at least part of the additive is dissolved, so that at least part of the additive is separated and removed from the thermoplastic resin composition.
摘要:
A method for treating waste printed circuit boards, the method has the steps of: heating up for dry-distilling the waste printed circuit boards having copper foil retaining solder in at least a part of the surface, at a temperature of 250° C. or higher; pulverizing the dry-distilled material of the waste printed circuit boards obtained in the heating step; and separating the pulverized material of the waste printed circuit boards obtained in the pulverizing step, into board resin component and metal component.
摘要:
A dehalogenation treatment method of a halogen-containing flame-retardant resin composition has a step of bringing the halogen-containing flame-retardant resin composition into contact with a material mixture containing a dehalogenation material and a dehalogenation promoting material at a temperature lower than a thermal decomposition temperature of the resin composition.
摘要:
A method for treating waste printed circuit boards, the method has the steps of: heating up for dry-distilling the waste printed circuit boards having copper foil retaining solder in at least a part of the surface, at a temperature of 250° C. or higher; pulverizing the dry-distilled material of the waste printed circuit boards obtained in the heating step; and separating the pulverized material of the waste printed circuit boards obtained in the pulverizing step, into board resin component and metal component.
摘要:
A polymer composition includes a polymer and a flame retardant. The flame retardant includes: at least one nucleic-acid-related substance that is selected from the group consisting of a nucleic acid base, a nucleoside, a nucleotide and a polynucleotide; and/or at least one derivative of the nucleic-acid-related substance. The derivative is selected from the group consisting of: (a) a sulfate, a nitrate, a borate, a hydrochloride or an isocyanurate of the nucleic acid base; (b) a metal salt of the nucleotide; and (c) a compound obtained by substituting an alkyl group having 1 to 4 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group or a mercapto group for a hydrogen atom that is bonded to a nitrogen atom of the nucleic acid base, the nucleoside or the nucleotide.
摘要:
A flame-retardant polymer composition contains a polymer and a flame retardant, in which the flame retardant includes a polymer having a flame-retardant moiety in a side chain thereof.
摘要:
A method of reclaiming waste cured resins, wherein the components of a decomposition product produced by bringing waste cured resins, which have at least one type of bond selected from the group consisting of oxazolidone bond, urethane bond, amino bond and ester bond, into contact with a decomposition material which decomposes the waste cured resins has an alkenyl compound.
摘要:
A method for disposal of a thermosetting resin containing a material, at least part of which is affected by an alkaline aqueous solution, is disclosed. It comprises at least two steps of including a step of immersing the molded product in an alkaline aqueous solution and a subsequent step of immersing the molded product in water. This method does not require a high temperature as required in a thermal decomposition and does not generate any exhaust gas, and consumes only small energy.
摘要:
A molding composition containing an unsaturated alkyd resin and an unsaturated polyester containing a crosslinking monomer, which may be 2-hydroxyethyl acrylate or 2-hydroxyethyl methacrylate. A molded part is manufactured by (a) covering the surrounding of a stator part having a heat generating coil with the molding composition, (b) feeding power to the coil for generating heat in the stator part, and (c) curing the molding composition by the heat generated in the stator part. The curing time is shortened, the molding cycle is improved, and, as a result, a molding composition excellent in productivity is presented, and by using this molding composition, molded parts are manufactured at excellent productivity.