Abstract:
Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.
Abstract:
Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.
Abstract:
A method for treating waste printing circuit boards with molten mixture of inorganic salts comprising actions of: (1) putting the circuit boards into the molten inorganic salts contained in a treating furnace; (2) crushing and stirring for copper foil of the circuit boards to be separated therefrom; (3) further stirring to separate the foil from the plastic and the glass fiber of the circuit boards; (4) scraping the floating residues of the plastic and the glass fiber on upper surface of the molten inorganic salts with a floating residues scraping device; (5) collecting the carbonized plastic residues and the glass fiber; (6) converting waste gas produced in the process into an unharmful and stable one; and (7) removing the copper foil by a certain amount regularly with a removing device.
Abstract:
The invention relates to a method for recycling electronic waste in the form of disassembled printed circuit boards from electronic devices, from which the components have not been removed, known as printed circuit boards. After removal of the batteries, mercury switches and PCB-containing capacitors, the printed circuit boards are mechanically precomminuted and the particles are cryogenically embrittled with liquid nitrogen and comminuted in a hammermill. In order to obtain a higher purity of the recovered metal concentrates and, conversely, a lower metal content of the concentrated residue materials as well as less emission during recycling and a simpler process, the cryogenically embrittled particles are selectively comminuted batchwise in a hammermill, wherein the ground material is divided into a fine fraction, emerging from a sieve at the bottom of the grinding chamber, and a coarser metallic fraction, which can be discharged batchwise and from which iron particles can subsequently be magnetically removed. The fine fraction is sorted into several narrow-band size classes with a particle size of about 1:1.6 per size class. Each individual size class of particles can be separately separated with corona-roller separators into residue material particles and metal particles. The latter can then be divided into different metal classes.
Abstract:
Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.
Abstract:
A process for reusing circuit boards includes determining a type of solder used on a populated circuit board. A bio-slurry designed to remove the type of solder is selected. The populated circuit board is separated into a number of components and a circuit board.
Abstract:
A method and a device for treating waste printed circuit boards with molten tin include process of throwing printed circuit boards into a molten tin bath in treating furnace, letting the boards proceed crashing, stirring and carbonizing treatment for separating copper foil, thermosetting plastic and glass fiber. Then these three kinds of materials are respectively separated from each other by taking advantage of their different specific gravity and collected in separate tanks to recover copper and other metals from the waste printed circuit boards.
Abstract:
An apparatus separates a substantially metallic portion from a substantially non-metallic portion or constituent components of at least one electrical product, comprising a plurality of crushing machines, such as a first crushing machine and a second crushing machine and a separating machine. The first crushing machine crushes the at least one electrical product to create at least one crushed electrical product. The first crushing machine has a first screen affixed thereto to regulate a first flow of the at least one first crushed electrical product from the first crushing machine. The second crushing machine crushes the at least one first crushed electrical product to create at least one second crushed electrical product. The second crushing machine has a second screen affixed thereto to regulate a second flow of the at least one second crushed electrical product from the second crushing machine. At least one separating machine receives the at least one second crushed electrical product from the second crushing machine to separate into three general categories: the metallic portion, the non-metallic portion, and a mixed portion having metallic and non-metallic subportions. The mixed portion are directly returned to said second crushing machine to be recrushed and indirectly to at least one separating machine to be reevaluated. A plurality of conveyors may also be used to transport the at least one first crushed electrical product from the first crushing machine to the second crushing machine, the at least one second crushed electrical product from the second crushing machine to the at least one separating machine. A plurality of air separators may be used to remove non-metallic light weight materials from the crushed electronic products and deposit the non-metallic light weight materials in a collection bin.
Abstract:
In a method of grinding a printed circuit board, a printed circuit board having various parts mounted thereon, or a residual ground product produced in the manufacturing process for the boards, and recovering valuable substances by separating the ground product into a portion containing a large amount of metal component such as copper and a portion consisting a resin, a filler material, and the like through a separation step, the separation step includes a specific gravity separation step of separating the ground product into a portion containing a large amount of substance having a high specific gravity and a portion containing a large amount of substance having a low specific gravity, and an electrostatic separation step of separating the ground product into a portion having a large amount of conductor and a portion containing large amount of insulator. The grinding step includes a coarse grinding step and a fine grinding step.
Abstract:
To insure that rejects or scraps of composite materials such as printed wiring boards that consist of the mixture of metal and non-metal parts are separated into the metal and non-metal components with good precision so that both components can be recovered as recyclable valuables, the composite materials are broken into pieces by means of a shearing machine or the like and the pieces are thereafter ground with a hammer mill or the like to form a mixed powder consisting of metal and non-metal particles, which mixed powder is then fed continuously on to a belt conveyor inclined at an angle with respect to a line perpendicular to the direction of travel, whereby the metal particles are efficiently separated from the non-metal particles; the recovered metal particles being fed to an electrostatic separator to obtain higher grade of concentration by removing the non-metal inclusions.