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公开(公告)号：US20160027975A1
公开(公告)日：2016-01-28
申请号：US14806761
申请日：2015-07-23
申请人： Ken Kitamura , Masato Toita , Hironori Ishii , Yuting Wang , Leo J. Schowalter , Jianfeng Chen , James R. Grandusky
发明人： Ken Kitamura , Masato Toita , Hironori Ishii , Yuting Wang , Leo J. Schowalter , Jianfeng Chen , James R. Grandusky
CPC分类号： H01L33/56 , H01L33/54 , H01L33/58 , H01L2933/005 , H01L2933/0058
摘要： In various embodiments, a layer of organic encapsulant is provided over a surface of an ultraviolet (UV) light-emitting semiconductor die, and at least a portion of the encapsulant is exposed to UV light to convert at least some of said portion of the encapsulant into non-stoichiometric silica material. The non-stoichiometric silica material includes silicon, oxygen, and carbon, and a carbon content of the non-stoichiometric silica material is greater than 1 ppm and less than 40 atomic percent.
摘要翻译： 在各种实施例中，在紫外（UV）发光半导体管芯的表面上提供有机密封剂层，并且将至少一部分密封剂暴露于UV光以将至少一部分密封剂 成为非化学计量的二氧化硅材料。 非化学计量的二氧化硅材料包括硅，氧和碳，非化学计量的二氧化硅材料的碳含量大于1ppm且小于40原子％。
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公开(公告)号：US09935247B2
公开(公告)日：2018-04-03
申请号：US14806761
申请日：2015-07-23
申请人： Ken Kitamura , Masato Toita , Hironori Ishii , Yuting Wang , Leo J. Schowalter , Jianfeng Chen , James R. Grandusky
发明人： Ken Kitamura , Masato Toita , Hironori Ishii , Yuting Wang , Leo J. Schowalter , Jianfeng Chen , James R. Grandusky
CPC分类号： H01L33/56 , H01L33/54 , H01L33/58 , H01L2933/005 , H01L2933/0058
摘要： In various embodiments, a layer of organic encapsulant is provided over a surface of an ultraviolet (UV) light-emitting semiconductor die, and at least a portion of the encapsulant is exposed to UV light to convert at least some of said portion of the encapsulant into non-stoichiometric silica material. The non-stoichiometric silica material includes silicon, oxygen, and carbon, and a carbon content of the non-stoichiometric silica material is greater than 1 ppm and less than 40 atomic percent.
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公开(公告)号：US10347805B2
公开(公告)日：2019-07-09
申请号：US15898347
申请日：2018-02-16
申请人： Ken Kitamura , Masato Toita , Hironori Ishii , Yuting Wang , Leo J. Schowalter , Jianfeng Chen , James R. Grandusky
发明人： Ken Kitamura , Masato Toita , Hironori Ishii , Yuting Wang , Leo J. Schowalter , Jianfeng Chen , James R. Grandusky
摘要： In various embodiments, a layer of organic encapsulant is provided over a surface of an ultraviolet (UV) light-emitting semiconductor die, and at least a portion of the encapsulant is exposed to UV light to convert at least some of said portion of the encapsulant into non-stoichiometric silica material. The non-stoichiometric silica material includes silicon, oxygen, and carbon, and a carbon content of the non-stoichiometric silica material is greater than 1 ppm and less than 40 atomic percent.
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公开(公告)号：US20180190883A1
公开(公告)日：2018-07-05
申请号：US15898347
申请日：2018-02-16
申请人： Ken Kitamura , Masato Toita , Hironori Ishii , Yuting Wang , Leo J. Schowalter , Jianfeng Chen , James R. Grandusky
发明人： Ken Kitamura , Masato Toita , Hironori Ishii , Yuting Wang , Leo J. Schowalter , Jianfeng Chen , James R. Grandusky
CPC分类号： H01L33/56 , H01L33/54 , H01L33/58 , H01L2933/005 , H01L2933/0058
摘要： In various embodiments, a layer of organic encapsulant is provided over a surface of an ultraviolet (UV) light-emitting semiconductor die, and at least a portion of the encapsulant is exposed to UV light to convert at least some of said portion of the encapsulant into non-stoichiometric silica material. The non-stoichiometric silica material includes silicon, oxygen, and carbon, and a carbon content of the non-stoichiometric silica material is greater than 1 ppm and less than 40 atomic percent.
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公开(公告)号：US11515455B2
公开(公告)日：2022-11-29
申请号：US17083580
申请日：2020-10-29
申请人： Ken Kitamura , Masato Toita , Hironori Ishii , Yuting Wang , Leo J. Schowalter , Jianfeng Chen , James R. Grandusky
发明人： Ken Kitamura , Masato Toita , Hironori Ishii , Yuting Wang , Leo J. Schowalter , Jianfeng Chen , James R. Grandusky
摘要： In various embodiments, a layer of organic encapsulant is provided over a surface of an ultraviolet (UV) light-emitting semiconductor die, and at least a portion of the encapsulant is exposed to UV light to convert at least some of said portion of the encapsulant into non-stoichiometric silica material. The non-stoichiometric silica material includes silicon, oxygen, and carbon, and a carbon content of the non-stoichiometric silica material is greater than 1 ppm and less than 40 atomic percent.
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公开(公告)号：US10854797B2
公开(公告)日：2020-12-01
申请号：US16421716
申请日：2019-05-24
申请人： Ken Kitamura , Masato Toita , Hironori Ishii , Yuting Wang , Leo J. Schowalter , Jianfeng Chen , James R. Grandusky
发明人： Ken Kitamura , Masato Toita , Hironori Ishii , Yuting Wang , Leo J. Schowalter , Jianfeng Chen , James R. Grandusky
摘要： In various embodiments, a layer of organic encapsulant is provided over a surface of an ultraviolet (UV) light-emitting semiconductor die, and at least a portion of the encapsulant is exposed to UV light to convert at least some of said portion of the encapsulant into non-stoichiometric silica material. The non-stoichiometric silica material includes silicon, oxygen, and carbon, and a carbon content of the non-stoichiometric silica material is greater than 1 ppm and less than 40 atomic percent.
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公开(公告)号：US20170087262A1
公开(公告)日：2017-03-30
申请号：US15373175
申请日：2016-12-08
申请人： Masato Toita , Jianfeng Chen , Yuxin Li , Yuting Wang , Hironori Ishii , Ken Kitamura
发明人： Masato Toita , Jianfeng Chen , Yuxin Li , Yuting Wang , Hironori Ishii , Ken Kitamura
CPC分类号： A61L2/10 , H01L33/44 , H01L33/483 , H01L33/486 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/16145 , H01L2224/48091 , H01L2924/1815 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014
摘要： In various embodiments, an illumination device features an ultraviolet (UV) light-emitting device at least partially surrounded by an encapsulant. A barrier layer is disposed between the light-emitting device and the encapsulant and is configured to substantially prevent UV light emitted by the light-emitting device from entering the encapsulant.
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公开(公告)号：US09548431B2
公开(公告)日：2017-01-17
申请号：US15044577
申请日：2016-02-16
申请人： Masato Toita , Jianfeng Chen , Yuxin Li , Yuting Wang , Hironori Ishii , Ken Kitamura
发明人： Masato Toita , Jianfeng Chen , Yuxin Li , Yuting Wang , Hironori Ishii , Ken Kitamura
IPC分类号： H01L21/46 , H01L21/78 , H01L21/301 , H01L33/56 , H01L33/58 , H01L33/48 , H01L33/62 , H01L33/44 , H01L33/54
CPC分类号： A61L2/10 , H01L33/44 , H01L33/483 , H01L33/486 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/16145 , H01L2224/48091 , H01L2924/1815 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014
摘要： In various embodiments, an illumination device features an ultraviolet (UV) light-emitting device at least partially surrounded by an encapsulant and having a rigid lens. Downward forces is applied while the encapsulant is at least partially cured to substantially prevent partial or full detachment of the rigid lens from the light-emitting device, and/or substantially suppress formation of bubbles between the light-emitting device and the rigid lens.
摘要翻译： 在各种实施例中，照明装置具有至少部分地由密封剂包围并具有刚性透镜的紫外（UV）发光装置。 施加向下的力，同时密封剂至少部分固化，以基本上防止刚性透镜从发光装置的部分或全部脱离，和/或基本上抑制在发光装置和刚性透镜之间形成气泡。
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公开(公告)号：US20160172553A1
公开(公告)日：2016-06-16
申请号：US15044577
申请日：2016-02-16
申请人： Masato Toita , Jianfeng Chen , Yuxin Li , Yuting Wang , Hironori Ishii , Ken Kitamura
发明人： Masato Toita , Jianfeng Chen , Yuxin Li , Yuting Wang , Hironori Ishii , Ken Kitamura
CPC分类号： A61L2/10 , H01L33/44 , H01L33/483 , H01L33/486 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/16145 , H01L2224/48091 , H01L2924/1815 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014
摘要： In various embodiments, an illumination device features an ultraviolet (UV) light-emitting device at least partially surrounded by an encapsulant. A barrier layer is disposed between the light-emitting device and the encapsulant and is configured to substantially prevent UV light emitted by the light-emitting device from entering the encapsulant.
摘要翻译： 在各种实施例中，照明装置具有至少部分地被密封剂包围的紫外（UV）发光装置。 阻挡层设置在发光器件和密封剂之间，并且被配置为基本上防止由发光器件发射的UV光进入密封剂。
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公开(公告)号：US10383963B2
公开(公告)日：2019-08-20
申请号：US15373175
申请日：2016-12-08
申请人： Masato Toita , Jianfeng Chen , Yuxin Li , Yuting Wang , Hironori Ishii , Ken Kitamura
发明人： Masato Toita , Jianfeng Chen , Yuxin Li , Yuting Wang , Hironori Ishii , Ken Kitamura
IPC分类号： A61L2/10 , H01L33/60 , H01L33/48 , H01L33/54 , H01L33/44 , H01L33/58 , H01L33/56 , H01L33/62
摘要： In various embodiments, an illumination device features an ultraviolet (UV) light-emitting device at least partially surrounded by an encapsulant. A barrier layer is disposed between the light-emitting device and the encapsulant and is configured to substantially prevent UV light emitted by the light-emitting device from entering the encapsulant.
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