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公开(公告)号：US10347805B2
公开(公告)日：2019-07-09
申请号：US15898347
申请日：2018-02-16
申请人： Ken Kitamura , Masato Toita , Hironori Ishii , Yuting Wang , Leo J. Schowalter , Jianfeng Chen , James R. Grandusky
发明人： Ken Kitamura , Masato Toita , Hironori Ishii , Yuting Wang , Leo J. Schowalter , Jianfeng Chen , James R. Grandusky
摘要： In various embodiments, a layer of organic encapsulant is provided over a surface of an ultraviolet (UV) light-emitting semiconductor die, and at least a portion of the encapsulant is exposed to UV light to convert at least some of said portion of the encapsulant into non-stoichiometric silica material. The non-stoichiometric silica material includes silicon, oxygen, and carbon, and a carbon content of the non-stoichiometric silica material is greater than 1 ppm and less than 40 atomic percent.
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公开(公告)号：US20180219124A1
公开(公告)日：2018-08-02
申请号：US15884461
申请日：2018-01-31
申请人： Masato TOITA , Satoshi YAMADA , Ken KITAMURA , Craig MOE , Amy MILLER
发明人： Masato TOITA , Satoshi YAMADA , Ken KITAMURA , Craig MOE , Amy MILLER
IPC分类号： H01L33/06 , H01L33/32 , H01L33/40 , H01L33/48 , H01L33/56 , H01L33/58 , H01L33/64 , H01L31/0203
摘要： In various embodiments, degradation of epoxy within packages for ultraviolet light-emitting devices is reduced or substantially eliminated via package venting, prevention of transmission of ultraviolet light to one or more regions of epoxy utilized in the package, and/or utilization of packaging schemes that reduce or avoid utilization of epoxy and/or specific metals.
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公开(公告)号：US20180190883A1
公开(公告)日：2018-07-05
申请号：US15898347
申请日：2018-02-16
申请人： Ken Kitamura , Masato Toita , Hironori Ishii , Yuting Wang , Leo J. Schowalter , Jianfeng Chen , James R. Grandusky
发明人： Ken Kitamura , Masato Toita , Hironori Ishii , Yuting Wang , Leo J. Schowalter , Jianfeng Chen , James R. Grandusky
CPC分类号： H01L33/56 , H01L33/54 , H01L33/58 , H01L2933/005 , H01L2933/0058
摘要： In various embodiments, a layer of organic encapsulant is provided over a surface of an ultraviolet (UV) light-emitting semiconductor die, and at least a portion of the encapsulant is exposed to UV light to convert at least some of said portion of the encapsulant into non-stoichiometric silica material. The non-stoichiometric silica material includes silicon, oxygen, and carbon, and a carbon content of the non-stoichiometric silica material is greater than 1 ppm and less than 40 atomic percent.
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公开(公告)号：US09548431B2
公开(公告)日：2017-01-17
申请号：US15044577
申请日：2016-02-16
申请人： Masato Toita , Jianfeng Chen , Yuxin Li , Yuting Wang , Hironori Ishii , Ken Kitamura
发明人： Masato Toita , Jianfeng Chen , Yuxin Li , Yuting Wang , Hironori Ishii , Ken Kitamura
IPC分类号： H01L21/46 , H01L21/78 , H01L21/301 , H01L33/56 , H01L33/58 , H01L33/48 , H01L33/62 , H01L33/44 , H01L33/54
CPC分类号： A61L2/10 , H01L33/44 , H01L33/483 , H01L33/486 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/16145 , H01L2224/48091 , H01L2924/1815 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014
摘要： In various embodiments, an illumination device features an ultraviolet (UV) light-emitting device at least partially surrounded by an encapsulant and having a rigid lens. Downward forces is applied while the encapsulant is at least partially cured to substantially prevent partial or full detachment of the rigid lens from the light-emitting device, and/or substantially suppress formation of bubbles between the light-emitting device and the rigid lens.
摘要翻译： 在各种实施例中，照明装置具有至少部分地由密封剂包围并具有刚性透镜的紫外（UV）发光装置。 施加向下的力，同时密封剂至少部分固化，以基本上防止刚性透镜从发光装置的部分或全部脱离，和/或基本上抑制在发光装置和刚性透镜之间形成气泡。
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公开(公告)号：US20170087262A1
公开(公告)日：2017-03-30
申请号：US15373175
申请日：2016-12-08
申请人： Masato Toita , Jianfeng Chen , Yuxin Li , Yuting Wang , Hironori Ishii , Ken Kitamura
发明人： Masato Toita , Jianfeng Chen , Yuxin Li , Yuting Wang , Hironori Ishii , Ken Kitamura
CPC分类号： A61L2/10 , H01L33/44 , H01L33/483 , H01L33/486 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/16145 , H01L2224/48091 , H01L2924/1815 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014
摘要： In various embodiments, an illumination device features an ultraviolet (UV) light-emitting device at least partially surrounded by an encapsulant. A barrier layer is disposed between the light-emitting device and the encapsulant and is configured to substantially prevent UV light emitted by the light-emitting device from entering the encapsulant.
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公开(公告)号：US10383963B2
公开(公告)日：2019-08-20
申请号：US15373175
申请日：2016-12-08
申请人： Masato Toita , Jianfeng Chen , Yuxin Li , Yuting Wang , Hironori Ishii , Ken Kitamura
发明人： Masato Toita , Jianfeng Chen , Yuxin Li , Yuting Wang , Hironori Ishii , Ken Kitamura
IPC分类号： A61L2/10 , H01L33/60 , H01L33/48 , H01L33/54 , H01L33/44 , H01L33/58 , H01L33/56 , H01L33/62
摘要： In various embodiments, an illumination device features an ultraviolet (UV) light-emitting device at least partially surrounded by an encapsulant. A barrier layer is disposed between the light-emitting device and the encapsulant and is configured to substantially prevent UV light emitted by the light-emitting device from entering the encapsulant.
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公开(公告)号：US09935247B2
公开(公告)日：2018-04-03
申请号：US14806761
申请日：2015-07-23
申请人： Ken Kitamura , Masato Toita , Hironori Ishii , Yuting Wang , Leo J. Schowalter , Jianfeng Chen , James R. Grandusky
发明人： Ken Kitamura , Masato Toita , Hironori Ishii , Yuting Wang , Leo J. Schowalter , Jianfeng Chen , James R. Grandusky
CPC分类号： H01L33/56 , H01L33/54 , H01L33/58 , H01L2933/005 , H01L2933/0058
摘要： In various embodiments, a layer of organic encapsulant is provided over a surface of an ultraviolet (UV) light-emitting semiconductor die, and at least a portion of the encapsulant is exposed to UV light to convert at least some of said portion of the encapsulant into non-stoichiometric silica material. The non-stoichiometric silica material includes silicon, oxygen, and carbon, and a carbon content of the non-stoichiometric silica material is greater than 1 ppm and less than 40 atomic percent.
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公开(公告)号：US09293670B2
公开(公告)日：2016-03-22
申请号：US14679655
申请日：2015-04-06
申请人： Masato Toita , Jianfeng Chen , Yuxin Li , Yuting Wang , Hironori Ishii , Ken Kitamura
发明人： Masato Toita , Jianfeng Chen , Yuxin Li , Yuting Wang , Hironori Ishii , Ken Kitamura
CPC分类号： A61L2/10 , H01L33/44 , H01L33/483 , H01L33/486 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/16145 , H01L2224/48091 , H01L2924/1815 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014
摘要： In various embodiments, an illumination device features an ultraviolet (UV) light-emitting device at least partially surrounded by an encapsulant. A barrier layer is disposed between the light-emitting device and the encapsulant and is configured to substantially prevent UV light emitted by the light-emitting device from entering the encapsulant.
摘要翻译： 在各种实施例中，照明装置具有至少部分地被密封剂包围的紫外（UV）发光装置。 阻挡层设置在发光器件和密封剂之间，并且被配置为基本上防止由发光器件发射的UV光进入密封剂。
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公开(公告)号：US20150287894A1
公开(公告)日：2015-10-08
申请号：US14679655
申请日：2015-04-06
申请人： Masato Toita , Jianfeng Chen , Yuxin Li , Yuting Wang , Hironori Ishii , Ken Kitamura
发明人： Masato Toita , Jianfeng Chen , Yuxin Li , Yuting Wang , Hironori Ishii , Ken Kitamura
CPC分类号： A61L2/10 , H01L33/44 , H01L33/483 , H01L33/486 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/16145 , H01L2224/48091 , H01L2924/1815 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014
摘要： In various embodiments, an illumination device features an ultraviolet (UV) light-emitting device at least partially surrounded by an encapsulant. A barrier layer is disposed between the light-emitting device and the encapsulant and is configured to substantially prevent UV light emitted by the light-emitting device from entering the encapsulant.
摘要翻译： 在各种实施例中，照明装置具有至少部分地被密封剂包围的紫外（UV）发光装置。 阻挡层设置在发光器件和密封剂之间，并且被配置为基本上防止由发光器件发射的UV光进入密封剂。
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公开(公告)号：US11942569B2
公开(公告)日：2024-03-26
申请号：US15884461
申请日：2018-01-31
申请人： Masato Toita , Satoshi Yamada , Ken Kitamura , Craig Moe , Amy Miller
发明人： Masato Toita , Satoshi Yamada , Ken Kitamura , Craig Moe , Amy Miller
IPC分类号： H01L33/06 , H01L31/0203 , H01L33/32 , H01L33/40 , H01L33/48 , H01L33/58 , H01L33/64 , H01L25/16 , H01L33/56
CPC分类号： H01L33/06 , H01L31/0203 , H01L33/32 , H01L33/405 , H01L33/486 , H01L33/58 , H01L33/648 , H01L25/167 , H01L33/56
摘要： In various embodiments, degradation of epoxy within packages for ultraviolet light-emitting devices is reduced or substantially eliminated via package venting, prevention of transmission of ultraviolet light to one or more regions of epoxy utilized in the package, and/or utilization of packaging schemes that reduce or avoid utilization of epoxy and/or specific metals.
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