Abstract:
In various embodiments, an illumination device features an ultraviolet (UV) light-emitting device at least partially surrounded by an encapsulant. A barrier layer is disposed between the light-emitting device and the encapsulant and is configured to substantially prevent UV light emitted by the light-emitting device from entering the encapsulant.
Abstract:
The present invention relates to a battery mounted integrated circuit device where an integrated circuit and a solid state battery are formed on the same substrate. In this battery mounted integrated circuit device, a first diffusion layer containing an N-type impurity is formed between a region of a semiconductor substrate where the solid state battery is mounted and a region of the semiconductor substrate where the integrated circuit is mounted, and a second diffusion layer containing an N-type impurity is formed below the region of the semiconductor substrate where the solid state battery is mounted, and overlaps with the first diffusion layer.
Abstract:
A tube flaw detecting method detects a flaw portion in a heat exchanger tube constituting a boiler furnace wall using two probes, enabling one to carry out appropriate inspection work with a high efficiency. A transmitter probe and a receiver probe are juxtaposed in a circumferential direction, and an ultrasonic wave is transmitted from the transmitter probe to propagate. Repeated reflections occur at a tube inner surface and tube outer surface, and the wave is reflected at a crack extending in the circumferential direction to return, propagating likewise to be received by the receiver probe so that existence of the crack is confirmed. Thus, inspection work for a crack can be done with certainty with a simple arrangement.
Abstract:
In various embodiments, a layer of organic encapsulant is provided over a surface of an ultraviolet (UV) light-emitting semiconductor die, and at least a portion of the encapsulant is exposed to UV light to convert at least some of said portion of the encapsulant into non-stoichiometric silica material. The non-stoichiometric silica material includes silicon, oxygen, and carbon, and a carbon content of the non-stoichiometric silica material is greater than 1 ppm and less than 40 atomic percent.
Abstract:
In various embodiments, a layer of organic encapsulant is provided over a surface of an ultraviolet (UV) light-emitting semiconductor die, and at least a portion of the encapsulant is exposed to UV light to convert at least some of said portion of the encapsulant into non-stoichiometric silica material. The non-stoichiometric silica material includes silicon, oxygen, and carbon, and a carbon content of the non-stoichiometric silica material is greater than 1 ppm and less than 40 atomic percent.
Abstract:
In various embodiments, an illumination device features an ultraviolet (UV) light-emitting device at least partially surrounded by an encapsulant and having a rigid lens. Downward forces is applied while the encapsulant is at least partially cured to substantially prevent partial or full detachment of the rigid lens from the light-emitting device, and/or substantially suppress formation of bubbles between the light-emitting device and the rigid lens.
Abstract:
In various embodiments, an illumination device features an ultraviolet (UV) light-emitting device at least partially surrounded by an encapsulant. A barrier layer is disposed between the light-emitting device and the encapsulant and is configured to substantially prevent UV light emitted by the light-emitting device from entering the encapsulant.
Abstract:
In various embodiments, a layer of organic encapsulant is provided over a surface of an ultraviolet (UV) light-emitting semiconductor die, and at least a portion of the encapsulant is exposed to UV light to convert at least some of said portion of the encapsulant into non-stoichiometric silica material. The non-stoichiometric silica material includes silicon, oxygen, and carbon, and a carbon content of the non-stoichiometric silica material is greater than 1 ppm and less than 40 atomic percent.
Abstract:
In various embodiments, an illumination device features an ultraviolet (UV) light-emitting device at least partially surrounded by an encapsulant. A barrier layer is disposed between the light-emitting device and the encapsulant and is configured to substantially prevent UV light emitted by the light-emitting device from entering the encapsulant.
Abstract:
In various embodiments, an illumination device features an ultraviolet (UV) light-emitting device at least partially surrounded by an encapsulant. A barrier layer is disposed between the light-emitting device and the encapsulant and is configured to substantially prevent UV light emitted by the light-emitting device from entering the encapsulant.