公开(公告)号：US08186562B1

公开(公告)日：2012-05-29

申请号：US12967243

申请日：2010-12-14

申请人： Keng Yew James Song ,  Ka Shing Kenny Kwan ,  Boon June Yeap ,  Shi Jie Chen ,  Sathish Kumar Balakrishnan ,  Kumaresh Govindan Radhakrishnan

发明人： Keng Yew James Song ,  Ka Shing Kenny Kwan ,  Boon June Yeap ,  Shi Jie Chen ,  Sathish Kumar Balakrishnan ,  Kumaresh Govindan Radhakrishnan

IPC分类号： B23K37/00 ,  B23K31/02

CPC分类号： B23K20/004 ,  H01L2224/78

摘要： A main body of an apparatus for delivering shielding gas during wire bonding of an electronic device has a through-hole in the main body which is sized for allowing a capillary tip of a bonding tool to be insertable through the main body when performing wire bonding. At least one gas outlet located on a bottom surface of the main body adjacent to the through-hole is operative to direct an inert gas in a direction towards the electronic device. At least one gas inlet in the main body is operative to supply the inert gas to the through-hole and to the gas outlet.

摘要翻译： 用于在电子装置的引线接合期间输送保护气体的装置的主体具有在主体中的通孔，该通孔的尺寸适于允许接合工具的毛细管尖端在进行引线接合时通过主体插入。 位于主体的与通孔相邻的底表面上的至少一个气体出口可操作以沿着朝向电子设备的方向引导惰性气体。 主体中的至少一个气体入口用于将惰性气体供应到通孔和气体出口。

公开(公告)号：US08707550B2

公开(公告)日：2014-04-29

申请号：US12508780

申请日：2009-07-24

申请人： Keng Yew James Song ,  Ka Shing Kenny Kwan ,  Choong Kead Leslie Lum ,  Ting Yu He

发明人： Keng Yew James Song ,  Ka Shing Kenny Kwan ,  Choong Kead Leslie Lum ,  Ting Yu He

IPC分类号： H01L21/58 ,  H01L21/60 ,  H05K13/04

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/3011 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53183 ,  Y10T29/53261 ,  Y10T29/53265 ,  H01L2924/00 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756

摘要： A bonding apparatus for bonding electronic devices including substrates comprises first and second rails arranged adjacent to each other which are configured to align the substrates in vertical orientations during transportation along the rails. A bonding system is locatable over a first bonding site which is located along the first rail and a second bonding site which is located along the second rail. A first indexer is located adjacent to the first rail and a second indexer is located adjacent to the second rail wherein each indexer is independently operative to transport a substrate along one rail while a substrate held on the other rail is being bonded. A container located at one end of the rails for holding multiple unbonded substrates is operative to feed unbonded substrates directly to the rails.

摘要翻译： 用于接合包括基板的电子设备的接合装置包括彼此相邻布置的第一和第二轨道，所述第一和第二轨道被配置为在沿着轨道的运输期间沿垂直取向对准基板。 接合系统可位于沿着第一轨道定位的第一接合位置和沿着第二轨道定位的第二接合位置。 第一分度器位于第一轨道附近并且第二分度器位于第二轨道附近，其中每个分度器独立地操作以沿着一个轨道输送基板，同时保持在另一个导轨上的基板被接合。 位于轨道一端的用于保持多个未粘结基底的容器可操作以将未粘合的基底直接供给到轨道。

公开(公告)号：US07568606B2

公开(公告)日：2009-08-04

申请号：US11550855

申请日：2006-10-19

申请人： Yam Mo Wong ,  Keng Yew James Song ,  Ka Shing Kenny Kwan

发明人： Yam Mo Wong ,  Keng Yew James Song ,  Ka Shing Kenny Kwan

IPC分类号： B23K37/04

CPC分类号： H01L21/67144 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/52 ,  H01L2924/00 ,  H01L2924/00015

摘要： A bonding apparatus is provided which includes a device handler for handling electronic devices, the bonding apparatus including a bonding tool at which the electronic devices are locatable for bonding. A storage assembly is provided for storing multiple electronic devices and a conveying track is further provided for conveying electronic devices towards and away from the bonding tool. The device handler includes a rotary platform for holding an electronic device, and which is operable between an orientation wherein the rotary platform is aligned with the conveying track for transferring an electronic device between the rotary platform and the conveying track, and another orientation wherein the rotary platform is aligned with the storage assembly for transferring an electronic device between the rotary platform and the storage assembly.

摘要翻译： 提供了一种接合装置，其包括用于处理电子装置的装置处理器，所述接合装置包括接合工具，电子装置可定位在该接合工具上用于接合。 提供存储组件用于存储多个电子设备，并且进一步提供用于将电子设备朝向和远离粘合工具传送的输送轨道。 设备处理器包括用于保持电子设备的旋转平台，并且其可旋转平台与用于在旋转平台和输送轨道之间传送电子设备的输送轨道对准的方向之间操作，并且另一方向 平台与用于在旋转平台和存储组件之间传送电子设备的存储组件对准。

公开(公告)号：US07677431B2

公开(公告)日：2010-03-16

申请号：US11843012

申请日：2007-08-22

申请人： Yam Mo Wong ,  Keng Yew James Song ,  Ka Shing Kenny Kwan

发明人： Yam Mo Wong ,  Keng Yew James Song ,  Ka Shing Kenny Kwan

IPC分类号： B23K31/02

CPC分类号： B23K37/047 ,  B23K20/004 ,  B23K2101/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/7865 ,  H01L2224/85121 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： A large electronic device having a bonding area on one side that comprises first and second portions may be bonded by first locating the first portion but not the second portion of the electronic device for bonding by a bonding tool. After the first portion of the electronic device has been bonded, the electronic device is conveyed to a rotary platform that is rotatable along a substantially horizontal plane. The electronic device is rotated on the rotary platform to change the respective positions of the bonded first portion and unbonded second portion of the electronic device, before the electronic device is conveyed to the bonding tool such that the second portion of the electronic device is located for bonding by the bonding tool. The second portion of the electronic device may then be bonded.

摘要翻译： 具有包括第一和第二部分的一侧上具有接合区域的大型电子设备可以通过首先定位用于通过接合工具进行接合的电子设备的第一部分而不是第二部分来进行接合。 在电子设备的第一部分已经结合之后，电子设备被传送到可沿着基本上水平的平面旋转的旋转平台。 在电子设备被传送到接合工具之前，电子设备在旋转平台上旋转以改变接合的第一部分和未结合的电子设备的第二部分的位置，使得电子设备的第二部分位于 通过粘合工具进行粘合。 然后可以结合电子设备的第二部分。

公开(公告)号：US08459530B2

公开(公告)日：2013-06-11

申请号：US12608279

申请日：2009-10-29

申请人： Yue Zhang ,  Keng Yew James Song ,  Xiao Liang Chen

发明人： Yue Zhang ,  Keng Yew James Song ,  Xiao Liang Chen

IPC分类号： B23K31/00

CPC分类号： B23K20/005 ,  B23K2101/42 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48463 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2224/48 ,  H01L2924/00015 ,  H01L2924/00

摘要： Wire is fed to a bonding tool of a wire bonder by a pneumatic device that is operative to urge the wire to feed through an outlet of the pneumatic device towards the bonding tool. A wire clamp is located adjacent to the outlet of the pneumatic device and a wire guider with a hole is located adjacent to the wire clamp between the wire clamp and the bonding tool for threading the wire through the hole before being fed to the bonding tool.

摘要翻译： 电线通过气动装置供给到引线接合器的接合工具，所述气动装置可操作以促使电线通过气动装置的出口朝向接合工具进料。 线夹位于气动装置的出口附近，具有孔的导线器位于线夹与接线工具之间的线夹附近，用于在馈送到接合工具之前将线穿过孔。