公开(公告)号：US07495333B2

公开(公告)日：2009-02-24

申请号：US11124498

申请日：2005-05-06

申请人： Kenichi Miyazaki ,  Hiroyuki Kusamori

发明人： Kenichi Miyazaki ,  Hiroyuki Kusamori

IPC分类号： H01L23/10 ,  B23K31/02

CPC分类号： H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

摘要： A hermetic seal cover capable of inhibiting defects such as voids from generating in sealing a package, and a method of manufacturing the seal cover are provided. The hermetic seal cover comprises: a seal cover main body; a Ni plating layer applied onto a surface of the seal cover main body; and a Au—Sn brazing material layer fusion bonded to a surface of the Ni plating layer, and is characterized by a Ni—Sn ally layer disposed between the Ni plating layer and the Au—Sn brazing material layer. It is preferable if the Ni—Sn alloy layer has a thickness of 0.6-5.0 μm. It is also preferable if Au—Sn brazing material layer has a Sn content of 20.65-23.5 wt %.

摘要翻译： 提供能够抑制诸如空隙之类的缺陷以密封封装件的气密密封盖，以及制造密封盖的方法。 气密密封盖包括：密封盖主体; 施加到密封盖主体的表面上的Ni镀层; 以及与Ni镀层的表面熔合的Au-Sn钎焊材料层，其特征在于，在Ni镀层和Au-Sn钎料层之间设置Ni-Sn层。 Ni-Sn合金层的厚度优选为0.6〜5.0μm。 Au-Sn钎料层的Sn含量也优选为20.65〜23.5重量％。

公开(公告)号：US20060001172A1

公开(公告)日：2006-01-05

申请号：US11124498

申请日：2005-05-06

申请人： Kenichi Miyazaki ,  Hiroyuki Kusamori

发明人： Kenichi Miyazaki ,  Hiroyuki Kusamori

IPC分类号： H01L23/48 ,  H01L21/20

CPC分类号： H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

摘要： A hermetic seal cover capable of inhibiting defects such as voids from generating in sealing a package, and a method of manufacturing the seal cover are provided. The hermetic seal cover comprises: a seal cover main body; a Ni plating layer applied onto a surface of the seal cover main body; and a Au—Sn brazing material layer fusion bonded to a surface of the Ni plating layer, and is characterized by a Ni—Sn ally layer disposed between the Ni plating layer and the Au—Sn brazing material layer. It is preferable if the Ni—Sn alloy layer has a thickness of 0.6-5.0 μm. It is also preferable if Au—Sn brazing material layer has a Sn content of 20.65-23.5 wt %.

摘要翻译： 提供能够抑制诸如空隙之类的缺陷以密封封装件的气密密封盖，以及制造密封盖的方法。 气密密封盖包括：密封盖主体; 施加到密封盖主体的表面上的Ni镀层; 以及与Ni镀层的表面熔合的Au-Sn钎焊材料层，其特征在于，在Ni镀层和Au-Sn钎料层之间设置Ni-Sn层。 Ni-Sn合金层的厚度优选为0.6〜5.0μm。 Au-Sn钎料层的Sn含量也优选为20.65〜23.5重量％。

公开(公告)号：US08362527B2

公开(公告)日：2013-01-29

申请号：US12808757

申请日：2008-12-08

申请人： Osamu Matsushima ,  Kenichi Miyazaki

发明人： Osamu Matsushima ,  Kenichi Miyazaki

IPC分类号： H01L27/146 ,  H01L31/0232

CPC分类号： H01L27/14632 ,  H01L27/1463 ,  H01L27/14643 ,  H01L27/14687 ,  H01L31/022466 ,  H01L31/022483 ,  H01L31/0322 ,  Y02E10/541 ,  Y02P70/521

摘要： Provision of a solid-state imaging device of a planarized structure with reduced dark currents, allowing for high sensitivities over a wide wavelength band ranging from visible wavelengths to near-infrared wavelengths, and a fabrication method of the same.There are steps of having circuitry (30) formed on a substrate (10), forming a lower electrode layer (25) on the circuitry (30), patterning the lower electrode layer (25) to separate pixel-wise into a set of segments, forming a compound-semiconductor thin film of chalcopyrite structure (24) over a whole area of element regions, applying a resist layer (27) on the compound-semiconductor thin film (24) to pixel-wise pattern in accordance with the lower electrode layer (25) as a base separated into the set of segments, applying an ion doping over a whole area of element regions, forming element separating regions (34) in the compound-semiconductor thin film (24), removing the resist layer (27) for exposure of surfaces of a set of compound-semiconductor thin films (24) pixel-wise separated by the element separating regions (34), and forming a transparent electrode layer (26) in a planarizing manner over a whole area of element regions.

摘要翻译： 提供具有减小的暗电流的平坦化结构的固态成像装置，其允许在从可见波长到近红外波长的宽波长带上的高灵敏度及其制造方法。 具有形成在基板（10）上的电路（30）的步骤，在电路（30）上形成下电极层（25），图案化下电极层（25），将其逐像分割成一组段 在元件区域的整个区域上形成黄铜矿结构（24）的化合物半导体薄膜，将化合物半导体薄膜（24）上的抗蚀剂层（27）根据下部电极施加到像素图案 层（25）作为分隔成该组段的基底，在元件区域的整个区域上施加离子掺杂，在化合物半导体薄膜（24）中形成元件分离区域（34），去除抗蚀剂层（27） ），用于曝光由元件分离区域（34）以像素方式隔开的一组化合物半导体薄膜（24）的表面，并且在元件区域的整个区域上以平坦化方式形成透明电极层（26） 。

公开(公告)号：US08299510B2

公开(公告)日：2012-10-30

申请号：US12525357

申请日：2008-02-01

申请人： Osamu Matsushima ,  Masaki Takaoka ,  Kenichi Miyazaki ,  Shogo Ishizuka ,  Keiichiro Sakurai ,  Shigeru Niki

发明人： Osamu Matsushima ,  Masaki Takaoka ,  Kenichi Miyazaki ,  Shogo Ishizuka ,  Keiichiro Sakurai ,  Shigeru Niki

IPC分类号： H01L31/062 ,  H01L31/113

CPC分类号： H01L31/18 ,  H01L27/14632 ,  H01L27/14665 ,  H01L27/14687 ,  H01L31/0322

摘要： A solid state imaging device with an easy structure in which have the high sensitivity which reaches the wide wavelength region from visible light to near infrared light wavelength region, and dark current is reduced, and a fabrication method for the same, are provided.A solid state imaging device and a fabrication method for the same, the solid state imaging device comprising: a circuit unit formed on a substrate; and a photoelectric conversion unit including a lower electrode layer placed on the circuit unit, a compound semiconductor thin film of chalcopyrite structure which is placed on the lower electrode layer and functions as an optical absorption layer, and an optical transparent electrode layer placed on the compound semiconductor thin film, wherein the lower electrode layer, the compound semiconductor thin film, and the optical transparent electrode layer are laminated one after another on the circuit unit.

摘要翻译： 具有容易结构的固态成像装置具有从可见光到近红外光波长区域到达宽波长区域的高灵敏度，并且暗电流降低，并且提供了其制造方法。 固态成像装置及其制造方法，所述固态成像装置包括：形成在基板上的电路单元; 以及光电转换单元，其包括设置在电路单元上的下电极层，放置在下电极层上并用作光吸收层的黄铜矿结构的化合物半导体薄膜和放置在化合物上的光透明电极层 半导体薄膜，其中下电极层，化合物半导体薄膜和光透明电极层在电路单元上依次层叠。

公开(公告)号：US20120217498A1

公开(公告)日：2012-08-30

申请号：US13393631

申请日：2010-08-31

申请人： Takamitsu Yamanaka ,  Goro Nakatani ,  Osamu Matsushima ,  Kenichi Miyazaki

发明人： Takamitsu Yamanaka ,  Goro Nakatani ,  Osamu Matsushima ,  Kenichi Miyazaki

IPC分类号： H01L31/0224 ,  H01L31/18

CPC分类号： H01L27/1461 ,  H01L27/14636 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14692 ,  H01L31/022466 ,  H01L31/0322

摘要： A photoelectric converter according to the present invention includes an insulating layer, a plurality of lower electrodes that are mutually spaced and disposed on the insulating layer, a photoabsorption layer made of a chalcopyrite compound semiconductor and formed to cover the plurality of lower electrodes all together, and a transparent conductive film formed to cover the photoabsorption layer. Variation of sensitivity among pixels due to influence (damage) by etching of the photoabsorption layer is thereby eliminated and a pixel aperture ratio can be made 100%.

摘要翻译： 根据本发明的光电转换器包括绝缘层，互相间隔并设置在绝缘层上的多个下电极，由黄铜矿化合物半导体制成并形成为一起覆盖多个下电极的光吸收层， 以及形成为覆盖光吸收层的透明导电膜。 由此消除了由于光吸收层的蚀刻引起的影响（损伤）的像素之间的灵敏度的变化，并且可以使像素开口率为100％。

公开(公告)号：US20100006336A1

公开(公告)日：2010-01-14

申请号：US12305035

申请日：2008-05-09

申请人： Tomohiro Shimada ,  Kenichi Miyazaki

发明人： Tomohiro Shimada ,  Kenichi Miyazaki

IPC分类号： H01L23/02 ,  H05K5/00 ,  B23K1/00

CPC分类号： H01L23/10 ,  H01L21/50 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/166 ,  H01L2924/00

摘要： The present invention provides a lid or a case for a sealed package, which is provided with a frame-shaped soldering material on its face to be joined, wherein the frame-shaped soldering material is formed of aligned ball-shaped soldering materials having particle sizes of 10 to 300 μm. This lid or case can be manufactured by the steps of: (1) forming a droplet from the soldering material in a molten state; (2) discharging the soldering material which has been formed into the droplet onto the face to be joined of the lid or the case to fix the ball-shaped soldering material on the face; and (3) repeating the steps (1) and (2).

摘要翻译： 本发明提供一种用于密封包装的盖或壳体，其在其待接合面上设置有框状焊接材料，其中框状焊接材料由具有粒径的对准的球形焊接材料形成 10到300个妈妈。 该盖或壳体可以通过以下步骤制造：（1）以熔融状态从焊料形成液滴; （2）将已经形成为液滴的焊接材料排出到要接合的盖或壳体的表面上以将球形焊接材料固定在表面上; 和（3）重复步骤（1）和（2）。

公开(公告)号：USD516120S1

公开(公告)日：2006-02-28

申请号：US29200222

申请日：2004-02-26

申请人： Hirokazu Yamano ,  Ikuo Masujima ,  Kenichi Miyazaki

设计人： Hirokazu Yamano ,  Ikuo Masujima ,  Kenichi Miyazaki

公开(公告)号：US20050184135A1

公开(公告)日：2005-08-25

申请号：US11055945

申请日：2005-02-11

申请人： Kenichi Miyazaki

发明人： Kenichi Miyazaki

IPC分类号： B23K35/00 ,  B23K35/30 ,  C22C5/02 ,  B23K31/02

CPC分类号： B23K35/3013 ,  B23K35/001 ,  B23K35/004

摘要： The present invention provides a method of joining members to be joined by use of an Au—Sn brazing material, in which joining is performed by adjusting the composition and thickness of the Au—Sn brazing material so that the Sn content of the joint after joining is from 20.65 to 23.5 wt %. The invention has been completed on the basis of the discovery that the true eutectic point of this alloy system corresponds to 20.65 wt % Sn. In the invention, as means for adjusting the composition of a resulting joint, it is necessary to appropriately adjust the composition and thickness of a brazing material according to the thickness of a gold plating. In the invention, the relationship between the brazing material thickness and the gold plating thickness is shown when the brazing material to be used has an Sn content of 21 wt % to 25 wt %.

摘要翻译： 本发明提供一种通过使用Au-Sn钎焊材料将待接合的构件接合的方法，其中通过调节Au-Sn钎焊材料的组成和厚度进行接合，使得接合后的接合体的Sn含量 为20.65〜23.5重量％。 本发明是基于这样的发现，即该合金系统的真正共晶点对应于20.65重量％的Sn。 在本发明中，作为调整所得接头的组成的装置，需要根据镀金的厚度适当地调整钎焊材料的组成和厚度。 在本发明中，当使用的钎焊材料的Sn含量为21重量％〜25重量％时，示出了钎焊材料厚度与镀金厚度之间的关系。

公开(公告)号：US4968995A

公开(公告)日：1990-11-06

申请号：US375439

申请日：1989-07-05

申请人： Yutaka Mizoguchi ,  Itsuo Takanashi ,  Hideshi Tanaka ,  Terumi Ohara ,  Kenichi Miyazaki ,  Toshinori Takahashi ,  Hiroki Kitamura ,  Tadao Shinya ,  Katsuhiko Terada

发明人： Yutaka Mizoguchi ,  Itsuo Takanashi ,  Hideshi Tanaka ,  Terumi Ohara ,  Kenichi Miyazaki ,  Toshinori Takahashi ,  Hiroki Kitamura ,  Tadao Shinya ,  Katsuhiko Terada

IPC分类号： B41J2/38

CPC分类号： B41J2/38

摘要： A thermal printer comprises a thermal head and a printing data output circuit outputting printing data. A portion of the printing data is copied. The copied portion of the printing data is added to a head of the printing data to form a combination of the copied portion and the printing data. The data combination is outputted to the thermal head. The thermal head is driven with the copied portion to preheat the thermal head. Then, the thermal head is driven with the printing data to perform actual printing.

摘要翻译： 热敏打印机包括热敏头和输出打印数据的打印数据输出电路。 打印数据的一部分被复制。 打印数据的复制部分被添加到打印数据的头部以形成复印部分和打印数据的组合。 数据组合输出到热敏头。 热敏头用复印部分驱动，以预热热敏头。 然后，利用打印数据驱动热敏打印头进行实际打印。

公开(公告)号：US4900083A

公开(公告)日：1990-02-13

申请号：US171813

申请日：1988-03-22

申请人： Hideyuki Kumasaka ,  Tarou Haiwara ,  Katsumi Nakamura ,  Kenichi Miyazaki ,  Hiroshi Kuriyama ,  Kouji Takao ,  Keizo Inoue

发明人： Hideyuki Kumasaka ,  Tarou Haiwara ,  Katsumi Nakamura ,  Kenichi Miyazaki ,  Hiroshi Kuriyama ,  Kouji Takao ,  Keizo Inoue

IPC分类号： B62D23/00 ,  B62D27/06 ,  B62D31/02 ,  B62D65/04

CPC分类号： B62D65/04 ,  B62D23/00 ,  B62D27/065 ,  Y10T29/49904

摘要： A vehicle body consists of six independent body sections, i.e., an engine compartment assembly, floor assembly, rear end assembly, a pair of body side assemblies and roof assembly. The assemblies are prepared and painted independently and then respectively provided with equipment such as an engine, suspensions, upholsteries, etc. so as to constitute an engine compartment module, floor module, rear end module, body side modules and roof module, respectively. A complete vehicle or nearly complete vehicle is obtained by joining the modules together with bolts and nuts.

摘要翻译： 车身由六个独立的主体部分组成，即发动机舱组件，地板组件，后端组件，一对车身侧组件和车顶组件。 各组件的制备和独立涂装，分别设置有发动机，悬架，升降器等设备，以分别构成发动机舱模块，地板模块，后端模块，车身侧模块和车顶模块。 通过将模块与螺栓和螺母连接在一起可获得完整的车辆或几乎完整的车辆。