公开(公告)号：US06787389B1

公开(公告)日：2004-09-07

申请号：US09695311

申请日：2000-10-25

申请人： Minoru Oohira ,  Kenji Ohgiyama ,  Teruhisa Fujihara

发明人： Minoru Oohira ,  Kenji Ohgiyama ,  Teruhisa Fujihara

IPC分类号： H01L2144

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： Provide a discrete semiconductor device, particularly a discrete semiconductor device for small signal operation with a smaller packaging area and has excellent high frequency characteristics and good heat dissipation performance, and a method for producing the same. The discrete semiconductor elements are mounted on die bond pads and wire bond pads with the packaging surface being sealed with a resin, and connecting the back faces of the die bond pads and the wire bond pads directly to a mother board.

摘要翻译： 提供分立半导体器件，特别是用于具有较小封装面积的小信号操作的分立半导体器件，并且具有优异的高频特性和良好的散热性能及其制造方法。 分立半导体元件安装在芯片接合焊盘和引线接合焊盘上，封装表面用树脂密封，并将芯片焊盘和背面焊盘的背面直接连接到母板上。

公开(公告)号：US06907053B2

公开(公告)日：2005-06-14

申请号：US10183509

申请日：2002-06-28

申请人： Kenji Ohgiyama ,  Kiyoaki Tsumura ,  Koji Yamashita ,  Toshio Takeuchi ,  Susumu Ishida ,  Kenji Kan

发明人： Kenji Ohgiyama ,  Kiyoaki Tsumura ,  Koji Yamashita ,  Toshio Takeuchi ,  Susumu Ishida ,  Kenji Kan

IPC分类号： G11B7/08 ,  G11B7/125 ,  H01S5/00 ,  H01S5/022 ,  H01S5/024 ,  H01S3/04

CPC分类号： H01S5/02244 ,  G11B7/082 ,  G11B7/127 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01S5/005 ,  H01S5/02216 ,  H01S5/02292 ,  H01S5/02469 ,  H01L2924/00014

摘要： A semiconductor laser element and a protective wall surrounding the element are provided on the surface of a metal frame of a semiconductor laser device. Circumferential portions are provided on an outer periphery of the metal frame for rotating the optical axis of light originating from a light-emitting point of the semiconductor laser element to a direction along the surface of the metal frame. By way of a guide of an optical pickup base corresponding to the circumferential portions, the semiconductor laser device is mounted on the optical pickup base.

摘要翻译： 半导体激光元件和围绕元件的保护壁设置在半导体激光器件的金属框架的表面上。 在金属框架的外周设置有圆周部分，用于将源自半导体激光元件的发光点的光的光轴旋转到沿着金属框架的表面的方向。 通过对应于圆周部分的光学拾取器基座的引导，半导体激光器件安装在光学拾取器基座上。

公开(公告)号：US06901093B2

公开(公告)日：2005-05-31

申请号：US10452517

申请日：2003-06-03

申请人： Yasunori Hosokawa ,  Kenji Ohgiyama ,  Makoto Kanda

发明人： Yasunori Hosokawa ,  Kenji Ohgiyama ,  Makoto Kanda

IPC分类号： H01S3/04 ,  H01S5/022 ,  H01S5/024 ,  H01S5/10

CPC分类号： H01S5/02268 ,  H01S5/02469 ,  H01S5/1039

摘要： A semiconductor laser apparatus includes a base, a block, and a semiconductor laser element. The base has a recess on a main plane thereof. The block is perpendicularly elongating on the main plane. The block is neighboring the recess. The semiconductor laser element is mounted on a side of the block. A first end of the semiconductor element is located on outer side of the recess, and a second end of the semiconductor element is located on inner side of the recess.

摘要翻译： 半导体激光装置包括基底，块和半导体激光元件。 底座在其主平面上具有凹部。 该块在主平面上垂直伸长。 该块与凹槽相邻。 半导体激光元件安装在块的一侧。 半导体元件的第一端位于凹部的外侧，半导体元件的第二端位于凹部的内侧。

公开(公告)号：US06462406B2

公开(公告)日：2002-10-08

申请号：US09234712

申请日：1999-01-21

申请人： Kenji Ohgiyama ,  Teruhisa Fujihara ,  Atsushi Yamasaki

发明人： Kenji Ohgiyama ,  Teruhisa Fujihara ,  Atsushi Yamasaki

IPC分类号： H01L2348

CPC分类号： H01L21/6836 ,  H01L23/3107 ,  H01L23/544 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2223/54473 ,  H01L2224/29007 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device including at least one die bond pad; at least one semiconductor element mounted on the at least one die bond pad; a plurality of substantially parallel wire bond pads connected to electrodes of the at least one semiconductor element, and disposed substantially in parallel to the at least one die bond pad in a longitudinal direction; and a sealing resin configured to mold the at least one semiconductor element, wherein back surfaces of the at least one die bond pad and the plurality of parallel wire bond pads are free from the sealing resin.

摘要翻译： 一种半导体器件，包括至少一个管芯接合焊盘; 安装在所述至少一个管芯接合焊盘上的至少一个半导体元件; 连接到所述至少一个半导体元件的电极并且沿纵向方向基本上平行于所述至少一个管芯接合焊盘设置的多个基本平行的引线接合焊盘; 以及密封树脂，其被配置为模制所述至少一个半导体元件，其中所述至少一个管芯接合焊盘和所述多个平行引线接合焊盘的后表面不与所述密封树脂一起形成。

公开(公告)号：US06309909B1

公开(公告)日：2001-10-30

申请号：US09669697

申请日：2000-09-26

申请人： Kenji Ohgiyama

发明人： Kenji Ohgiyama

IPC分类号： H01L2144

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L23/3107 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device which includes a semiconductor chip mounted on a die pad having first and second surfaces opposite to each other with the semiconductor chip mounted on the first surface, and one or a plurality of electrode terminals having third and fourth surfaces opposite to each other and spaced a distance from the die pad and electrically connected with the semiconductor chip through a corresponding wire with the wire being connected to the third surface. Further, a sealing resin encloses the die pad and the electrode terminal. A surface of the die pad opposite to the surface on which the second and fourth surfaces of the die pad and the electrode terminal, respectively, is exposed to an outside of the sealing resin.

摘要翻译： 一种半导体器件，其包括安装在具有彼此相对的第一和第二表面的芯片焊盘的半导体芯片，半导体芯片安装在第一表面上，以及一个或多个电极端子，具有彼此相对的第三和第四表面， 与芯片焊盘间隔一段距离，并通过相应的导线与半导体芯片电连接，导线连接到第三表面。 此外，密封树脂封装管芯焊盘和电极端子。 芯片焊盘的与芯片焊盘和电极端子的第二表面和第四表面分别相对的表面暴露于密封树脂的外部。

公开(公告)号：US06372546B2

公开(公告)日：2002-04-16

申请号：US09828132

申请日：2001-04-09

申请人： Kenji Ohgiyama ,  Teruhisa Fujihara ,  Tamotsu Ueda

发明人： Kenji Ohgiyama ,  Teruhisa Fujihara ,  Tamotsu Ueda

IPC分类号： H01L2144

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Providing a method of producing a semiconductor device wherein semiconductor element are sealed with a resin by using the same lead and other means regardless of the specifications of the semiconductor elements, and a semiconductor device which can be reduced in size and weight and has good heat dissipation performance and high-frequency performance. The semiconductor devices can be produced by mounting a plurality of the semiconductor elements on the lead frame having leads disposed substantially parallel to each other, sealing the whole with a resin, and cutting off the individual semiconductor devices.

摘要翻译： 提供一种制造半导体器件的方法，其中半导体元件通过使用相同的引线等方式用树脂密封而与半导体元件的规格无关，以及可以减小尺寸和重量并具有良好散热性的半导体器件 性能和高频性能。半导体器件可以通过将多个半导体元件安装在具有彼此大致平行布置的引线的引线框架上，用树脂密封整体并切断各个半导体器件来制造。

公开(公告)号：US06252306B1

公开(公告)日：2001-06-26

申请号：US09234321

申请日：1999-01-21

申请人： Kenji Ohgiyama ,  Teruhisa Fujihara ,  Tamotsu Ueda

发明人： Kenji Ohgiyama ,  Teruhisa Fujihara ,  Tamotsu Ueda

IPC分类号： H01L2348

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Providing a method of producing a semiconductor device wherein semiconductor element are sealed with a resin by using the same lead and other means regardless of the specifications of the semiconductor elements, and a semiconductor device which can be reduced in size and weight and has good heat dissipation performance and high-frequency performance. The semiconductor devices can be produced by mounting a plurality of the semiconductor elements on the lead frame having leads disposed substantially parallel to each other, sealing the whole with a resin, and cutting off the individual semiconductor devices.

摘要翻译： 提供一种制造半导体器件的方法，其中半导体元件通过使用相同的引线等方式用树脂密封而与半导体元件的规格无关，以及可以减小尺寸和重量并具有良好散热性的半导体器件 性能和高频性能。 半导体器件可以通过将多个半导体元件安装在具有彼此大致平行布置的引线的引线框架上，用树脂密封整体并切断各个半导体器件来制造。

公开(公告)号：US06215179B1

公开(公告)日：2001-04-10

申请号：US09252817

申请日：1999-02-19

申请人： Kenji Ohgiyama

发明人： Kenji Ohgiyama

IPC分类号： H01L23495

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L23/3107 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device which includes a semiconductor chip mounted on a die pad having first and second surfaces opposite to each other with the semiconductor chip mounted on the first surface, and one or a plurality of electrode terminals having third and fourth surfaces opposite to each other and spaced a distance from the die pad and electrically connected with the semiconductor chip through a corresponding wire with the wire being connected to the third surface. Further, a sealing resin encloses the die pad and the electrode terminal. A surface of the die pad opposite to the surface on which the second and fourth surfaces of the die pad and the electrode terminal, respectively, is exposed to an outside of the sealing resin.

摘要翻译： 一种半导体器件，其包括安装在具有彼此相对的第一和第二表面的芯片焊盘的半导体芯片，半导体芯片安装在第一表面上，以及一个或多个电极端子，具有彼此相对的第三和第四表面， 与芯片焊盘间隔一段距离，并通过相应的导线与半导体芯片电连接，导线连接到第三表面。 此外，密封树脂封装管芯焊盘和电极端子。 芯片焊盘的与芯片焊盘和电极端子的第二表面和第四表面分别相对的表面暴露于密封树脂的外部。

公开(公告)号：US6163069A

公开(公告)日：2000-12-19

申请号：US70724

申请日：1998-05-01

申请人： Minoru Oohira ,  Kenji Ohgiyama ,  Teruhisa Fujihara

发明人： Minoru Oohira ,  Kenji Ohgiyama ,  Teruhisa Fujihara

IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L21/68 ,  H01L23/12 ,  H01L23/31 ,  H05K1/02 ,  H05K3/34 ,  H01L23/34 ,  H05K1/18

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2224/0603 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19043 ,  H05K1/0201 ,  H05K3/341 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： Provide a discrete semiconductor device, particularly a discrete semiconductor device for small signal operation with a smaller packaging area and has excellent high frequency characteristics and good heat dissipation performance, and a method for producing the same. The discrete semiconductor elements are mounted on die bond pads and wire bond pads with the packaging surface being sealed with a resin, and connecting the back faces of the die bond pads and the wire bond pads directly to a mother board.

摘要翻译： 提供分立半导体器件，特别是用于具有较小封装面积的小信号操作的分立半导体器件，并且具有优异的高频特性和良好的散热性能及其制造方法。 分立半导体元件安装在芯片接合焊盘和引线接合焊盘上，封装表面用树脂密封，并将芯片焊盘和背面焊盘的背面直接连接到母板上。