公开(公告)号：US06379772B1

公开(公告)日：2002-04-30

申请号：US09344410

申请日：1999-06-24

申请人： Kenneth J. Lubert

发明人： Kenneth J. Lubert

IPC分类号： B32B324

CPC分类号： B32B3/266 ,  B32B27/06 ,  H01L23/13 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2924/0002 ,  H05K1/0269 ,  H05K3/4069 ,  H05K3/42 ,  H05K2201/09063 ,  H05K2201/09918 ,  Y10S428/901 ,  Y10T29/49131 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24273 ,  Y10T428/24322 ,  H01L2924/00

摘要： A substrate comprising at least one optical fiducial hole and a plurality of holes surrounding at least substantially one-half of the at least one optical fiducial hole.

摘要翻译： 一种衬底，包括至少一个光学基准孔和围绕所述至少一个光学基准孔的至少基本上一半的多个孔。

公开(公告)号：US06618940B2

公开(公告)日：2003-09-16

申请号：US09909211

申请日：2001-07-19

申请人： Kenneth J. Lubert ,  Curtis L. Miller ,  Thomas R. Miller ,  Robert D. Sebesta ,  James W. Wilson ,  Michael Wozniak

发明人： Kenneth J. Lubert ,  Curtis L. Miller ,  Thomas R. Miller ,  Robert D. Sebesta ,  James W. Wilson ,  Michael Wozniak

IPC分类号： H05K310

CPC分类号： H05K3/0094 ,  H05K3/061 ,  H05K3/064 ,  H05K3/427 ,  H05K2201/0166 ,  H05K2201/0209 ,  H05K2201/0959 ,  H05K2203/025 ,  H05K2203/0353 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49171

摘要： A high density printed wiring board is prepared by applying an essentially solid material into plated through holes such that the metallized layers within the through hole are unaffected by chemical metal etchants. In this manner, lateral surface metallized layers can exclusively be reduced in thickness by use of said chemical agents. These thinned lateral surface metallized layers are ultimately converted into fine pitch, 25 to 40 microns, circuitry, thereby providing high density boards. Since the through hole wall metallization is unaffected by the etching process, excellent electrical connection between the fine line circuitry is obtained. Various printed wiring board embodiments are also presented.

摘要翻译： 通过将基本上固体的材料施加到电镀的通孔中来制备高密度印刷线路板，使得通孔内的金属化层不受化学金属蚀刻剂的影响。 以这种方式，通过使用所述化学试剂，侧表面金属化层可以专门地减小厚度。 这些变薄的侧表面金属化层最终被转换为25至40微米的细间距，电路，从而提供高密度板。 由于通孔壁金属化不受蚀刻工艺的影响，所以可以获得细线电路之间的良好的电连接。 还提出了各种印刷线路板实施例。

公开(公告)号：US06291779B1

公开(公告)日：2001-09-18

申请号：US09345573

申请日：1999-06-30

申请人： Kenneth J. Lubert ,  Curtis L. Miller ,  Thomas R. Miller ,  Robert D. Sebesta ,  James W. Wilson ,  Michael Wozniak

发明人： Kenneth J. Lubert ,  Curtis L. Miller ,  Thomas R. Miller ,  Robert D. Sebesta ,  James W. Wilson ,  Michael Wozniak

IPC分类号： H05K111

CPC分类号： H05K3/0094 ,  H05K3/061 ,  H05K3/064 ,  H05K3/427 ,  H05K2201/0166 ,  H05K2201/0209 ,  H05K2201/0959 ,  H05K2203/025 ,  H05K2203/0353 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49171

摘要： A high density printed wiring board is prepared by applying an essentially solid material into plated through holes such that the metallized layers within the through hole are unaffected by chemical metal etchants. In this manner, lateral surface metallized layers can exclusively be reduced in thickness by use of said chemical agents. These thinned lateral surface metallized layers are ultimately converted into fine pitch, 25 to 40 microns, circuitry, thereby providing high density boards. Since the through hole wall metallization is unaffected by the etching process, excellent electrical connection between the fine line circuitry is obtained. Various printed wiring board embodiments are also presented.

摘要翻译： 通过将基本上固体的材料施加到电镀的通孔中来制备高密度印刷线路板，使得通孔内的金属化层不受化学金属蚀刻剂的影响。 以这种方式，通过使用所述化学试剂，侧表面金属化层可以专门地减小厚度。 这些变薄的侧表面金属化层最终被转换为25至40微米的细间距，电路，从而提供高密度板。 由于通孔壁金属化不受蚀刻工艺的影响，所以可以获得细线电路之间的良好的电连接。 还提出了各种印刷线路板实施例。