摘要:
The present invention provides a method of fabricating an improved gate of a nitride read only memory (NROM) in a semiconductor wafer. A bottom oxide and a silicon nitride layer are first formed on the surface of a silicon substrate in the semiconductor wafer, respectively, followed by injecting a tantalum penta ethoxide (Ta(OC2H5)5), under the condition of 300 mTorr and 200-650° C., to form a tantalum pentaoxide (Ta2O5) layer as a top oxide layer. The top oxide layer, silicon nitride layer and the bottom oxide layer compose an oxide-nitride-oxide (ONO) dielectric structure. Finally, a gate conductor layer is formed on the surface of the ONO structure to complete the fabrication of the NROM of the present invention. The tantalum pentaoxide has a high dielectric constant and is used to reduce the control gate voltage and thermal budget so as to increase the coupling ratio and yield of the semiconductor wafer.
摘要翻译:本发明提供一种在半导体晶片中制造氮化物只读存储器(NROM)的改进栅极的方法。 首先在半导体晶片中的硅衬底的表面上分别形成底部氧化物和氮化硅层,然后在300mTorr和200-650的条件下注入五乙氧基钽(Ta(OC 2 H 5)5) 以形成作为顶部氧化物层的五氧化钽(Ta 2 O 5)层。 顶部氧化物层,氮化硅层和底部氧化物层构成氧化物 - 氧化物 - 氧化物(ONO)电介质结构。 最后,在ONO结构的表面上形成栅极导体层,以完成本发明的NROM的制造。 五氧化二钽具有高介电常数,用于降低控制栅极电压和热预算,以增加半导体晶片的耦合比和产率。
摘要:
The present invention provides a protection circuit comprising one diode wherein the diode is formed by diffusing a heavily doped material of a first conductivity type into a first region of a second conductivity type. An integrated circuit, such as a memory array, is coupled to the diode. The other diode back-to-back is coupled to the diode wherein the other diode is formed by diffusing a heavily doped material of the second conductivity type into the first region and a second region of the first conductivity type. The two diodes in series are capable of discharging for the memory array during manufacturing process.
摘要:
A method of fabricating silicon nitride read only memory. A trapping layer is formed on a substrate. Next, a patterned photoresist layer is formed, and the substrate region at the lower section of the trapping layer masked by the photoresist layer is defined as a channel region. The substrate region at the lower section of the trapping layer and no masked by the photoresist layer is defined as a source/drain region. Next, a pocket ion implantation is performed while using the photoresist layer as amask, and a first dopant is implanted into the source/drain region of the substrate. The photoresist layer is used as a mask and the source/drain ions are implanted. A second dopant is implanted into the source/drain region of the substrate. After that, the photoresist layer is removed. Next, the trapping layer is used as a mask, and a thermal process is performed so that the substrate surface of the source/drain region forms a buried source/drain oxide layer, while at the same time, the second dopant at the lower section of the buried source/drain oxide layer forms a buried source/drain. The first dopant forms the pocket doping region at the edge of the channel region of the buried source/drain periphery as a result of thermal diffusion. Finally, a conductive gate is formed on the substrate.
摘要:
The present invention discloses a metal oxide semiconductor (MOS) device and a method for operating an array structure comprising the same devices. The MOS device of the present invention comprises a device layer; an ion-implanted layer formed on the device layer and providing the source, the drain and the channel; and a gate structure formed on the ion-implanted layer. Via applying a bias voltage to the gate, the carrier density in the channel region is different from that in the source region or the drain region; thereby, the MOS device of the present invention can undertake programming, erasing and reading activities. The present invention can simplify the MOS device fabrication process, reduce the operating voltage, and promote the integration density of a 2-dimensional or 3-dimensional MOS device array.
摘要:
A coding method of a multi-level cell, applied to a programming operation of a multi-level memory cell. The multi-level memory cell can store n bits and has 2n levels with respect to 2n codes. Each code is constructed with n bits. In the coding method, a code to be stored is provided. According to a relationship between the code and level, the multi-level memory cell has a specified level for corresponding code to be stored. The relationship is a correspondence between the 2n codes and the 2n levels. Two codes corresponding to any neighboring two levels has only a one-bit difference.
摘要:
A method for compensating a threshold voltage of a neighbor bit, are provided. The method includes the first step of arbitrating the word line voltages applied to bits demanded to be programmed, wherein the the word line voltages are arbitrated according to the threshold voltages of the neighbor bits adjacent to the bits. Next, the bits, to which a same word line voltage should be applied, in the memory cells are distributed to a group of bits with the same word line voltage. Then, the same word line voltage is applied to the bits of the group of bits with the same word line voltage.
摘要:
A fabrication method for a mask read-only memory includes forming an oxide layer on a provided substrate. A first mask layer is formed on the oxide layer, followed by performing a first ion implantation to form a plurality of equally spaced bit lines. A thermal process is further conducted to convert the oxide layer to a denser oxide layer. A plurality of word lines, which is perpendicular to the bit lines, is formed on the denser oxide layer. A second mask layer is formed on the plurality of the word lines, exposing the channel to be coded. A second ion implantation is conducted on the channel to complete the fabrication of the mask read-only memory device.
摘要:
A method of integrating a photodiode and a CMOS transistor with a NVM on a semiconductor substrate is provided. A photo sensor region, a periphery circuit region, and a memory cell region are defined on the substrate. A first doped area is formed within the semiconductor substrate in the periphery circuit region, the photo sensor region and the memory cell region. A second doped area is formed within the semiconductor substrate in the periphery circuit region. An ONO dielectric layer is formed on the surface of the semiconductor substrate. A third doped area is formed on the first doped area in the photo sensor region, and a fourth doped area is formed on the first doped area in the memory cell region. Following removal of portions of the ONO dielectric layer covering the fourth doped region in the photo sensor region, the periphery circuit region and the memory cell region, an oxide layer is formed on the first doped area, the second doped area, the third doped area, and the fourth doped area. A plurality of gates is formed in the periphery circuit region and in the memory cell region, and a source and a drain are formed in the periphery circuit region.
摘要:
A method for programming an analog/multi-level flash memory array, which insures fast programming to substantially all of the cells in the array, without over-programming, is based on providing a pattern of program retry pulses which have respective pulse widths and pulse heights which vary according to a pattern. The pattern includes three stages which program and verify cell threshold voltages with different program verification margins so that an accurate cell threshold voltage can be achieved for each cell.
摘要:
A method of designing a charge trapping memory array including designing a floating gate memory array layout. The floating gate memory layout includes a first type of transistors, electrical connections between memory cells of the floating gate memory array layout, a first input/output (I/O) interface, a first type of charge pump, and an I/O block. The method further includes modifying the floating gate memory array layout, using a processor, to replace the first type of transistors with a second type of transistors different than the first type of transistors. The method further includes determining an operating voltage difference between the I/O block and the second type of transistors. The method further includes modifying the floating gate memory array layout, using the processor, to modify the first charge pump based on the determined operating voltage difference.