MEMORY DEVICE
    1.
    发明公开
    MEMORY DEVICE 审中-公开

    公开(公告)号:US20230223938A1

    公开(公告)日:2023-07-13

    申请号:US18125081

    申请日:2023-03-22

    CPC classification number: G11C7/1048

    Abstract: A device includes a memory cell array configured to store data; and a signal propagation circuit configured to propagate a signal between the memory cell array and a host. The signal propagation circuit includes a first inverted signal output circuit, a second inverted signal output circuit including an input terminal connected to i) an output terminal of the first inverted signal output circuit and ii) an output terminal of the second inverted signal output circuit, a third inverted signal output circuit including an input terminal connected to i) the output terminal of the first inverted signal output circuit and ii) the output terminal of the second inverted signal output circuit, and a fourth inverted signal output circuit including an input terminal connected to i) an output terminal of the third inverted signal output circuit and ii) an output terminal of the fourth inverted signal output circuit.

    Memory system
    3.
    发明公开
    Memory system 审中-公开

    公开(公告)号:US20240094941A1

    公开(公告)日:2024-03-21

    申请号:US18520612

    申请日:2023-11-28

    Inventor: Kensuke YAMAMOTO

    Abstract: A semiconductor memory device includes a memory cell storing data; a signal pad inputting write data to the memory cell and from which read data read from the memory cell is output to an external controller; a first control pad receiving a first timing control signal from the external controller; and a second control pad outputting a second timing control signal to the external controller. In a first time period after a data out command is received, dummy data are output from the signal pad while the second timing control signal from the second control pad is toggling in response to toggling of the first timing control signal input to the first control pad. In a second time period after the first time period, read data are output from the signal pad while the second timing control signal is toggling in response to toggling of the first timing control signal.

    SEMICONDUCTOR MEMORY DEVICE
    4.
    发明申请

    公开(公告)号:US20220093185A1

    公开(公告)日:2022-03-24

    申请号:US17202590

    申请日:2021-03-16

    Abstract: According to one embodiment, a semiconductor memory device includes: first and second circuit units, a driver circuit, an input/output pad, first and second power supply pads, and first and second interconnects. The first interconnect is configured to provide coupling between the first circuit unit and the first power supply pad. The second interconnect is configured to provide coupling between the second circuit unit and the first power supply pad and have no electrical coupling to the first interconnect.

    SEMICONDUCTOR MEMORY DEVICE
    5.
    发明申请

    公开(公告)号:US20210226632A1

    公开(公告)日:2021-07-22

    申请号:US17002816

    申请日:2020-08-26

    Abstract: According to one embodiment, a semiconductor memory device includes: a memory cell array and a signal propagation circuit disposed on a propagation path of a signal or a control signal, wherein the signal propagation circuit includes: a first inverted signal output circuit; a second inverted signal output circuit including an input terminal connected to an output terminal of the first inverted signal output circuit; a third inverted signal output circuit including an input terminal connected to output terminals of the first inverted signal output circuit and the second inverted signal output circuit; a fourth inverted signal output circuit including an input terminal connected to an output terminal of the third inverted signal output circuit; and a fifth inverted signal output circuit including an input terminal connected to output terminals of the third inverted signal output circuit and the fourth inverted signal output circuit.

    SEMICONDUCTOR DEVICE
    6.
    发明公开

    公开(公告)号:US20240312532A1

    公开(公告)日:2024-09-19

    申请号:US18672202

    申请日:2024-05-23

    CPC classification number: G11C16/32 G11C16/0483 G11C16/08 G11C16/26 H10B69/00

    Abstract: A semiconductor memory device includes a memory cell array having a memory cell; a data signal terminal configured to receive data to be written into the memory cell from an exterior of the semiconductor memory device and to output data read from the memory cell to the exterior of the semiconductor memory, and a timing signal terminal configured to receive a timing control signal. An interface circuit includes a first comparator having a first input terminal connected to the data signal terminal, a second input terminal connected to a reference voltage, and an output terminal. A plurality of first inverters are connected in series, an input terminal of a first stage one of the first inverters being connected to the output terminal first of the first comparator. A first switch circuit has a first terminal connected to an output terminal of a final stage one of the first inverters and a second terminal; a second inverter having an input terminal connected to the second terminal of the first switch and an output terminal connected to the second terminal of the first switch; and a first latch circuit connected to the second terminal of the first switch.

    SEMICONDUCTOR MEMORY DEVICE
    7.
    发明申请

    公开(公告)号:US20230028971A1

    公开(公告)日:2023-01-26

    申请号:US17959098

    申请日:2022-10-03

    Abstract: According to one embodiment, a semiconductor memory device includes: first and second circuit units, a driver circuit, an input/output pad, first and second power supply pads, and first and second interconnects. The first interconnect is configured to provide coupling between the first circuit unit and the first power supply pad. The second interconnect is configured to provide coupling between the second circuit unit and the first power supply pad and have no electrical coupling to the first interconnect.

    SEMICONDUCTOR DEVICE
    9.
    发明申请

    公开(公告)号:US20220093188A1

    公开(公告)日:2022-03-24

    申请号:US17202661

    申请日:2021-03-16

    Abstract: According to an embodiment, a semiconductor device includes a first circuit, a second circuit, and a third circuit. The first circuit is configured to receive a first signal, and output a first voltage to a first node in accordance with a voltage of the first signal being at a first level and output a second voltage to the first node in accordance with the voltage of the first signal being at a second level. The first voltage is higher than the second voltage. The second circuit is coupled to the first node and configured to latch data based on a voltage of the first node. The third circuit includes a first inverter. The first inverter includes a first input terminal coupled to the first node and a first output terminal coupled to the first node.

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