公开(公告)号：US20230195002A1

公开(公告)日：2023-06-22

申请号：US17901774

申请日：2022-09-01

Applicant: KIOXIA CORPORATION

Inventor： Yoshio MIZUTA

IPC: G03F9/00

CPC classification number: G03F9/7088 ,  G03F9/7046

Abstract: According to one embodiment, an exposure device includes a stage, a measurement device, and a control device. For exposing a substrate, the control device calculates a first coefficient corresponding to a magnification positional misalignment in a first direction and a second coefficient corresponding to a magnification positional misalignment in a second direction based on measurement of at least three alignment marks. The control device can use the first coefficient to correct the magnification positional misalignment in the first direction and a third coefficient set based on the first correction coefficient to correct the magnification positional misalignment in the second direction. The control device can use a fourth coefficient set based on the second coefficient to correct the magnification positional misalignment in the first direction and the second coefficient to correct the magnification positional misalignment in the second direction.

公开(公告)号：US20250096027A1

公开(公告)日：2025-03-20

申请号：US18820760

申请日：2024-08-30

Applicant: Kioxia Corporation

Inventor： Yoshio MIZUTA

IPC: H01L21/683 ,  H01L21/687

Abstract: According to one embodiment, a substrate peeling device including an adsorption stage and a light source is provided. A bonded body including multiple substrates is adsorbed to the adsorption stage. The adsorption stage includes a first region and a second region. The second region is inside the first region. The light source can sequentially apply a laser beam toward the first region and the second region. The adsorption stage has weaker power of adsorbing the bonded body in the second region than in the first region.

公开(公告)号：US20240312820A1

公开(公告)日：2024-09-19

申请号：US18595341

申请日：2024-03-04

Applicant: Kioxia Corporation

Inventor： Yoshio MIZUTA

IPC: H01L21/68 ,  G03F7/00 ,  H01L21/66 ,  H01L21/67 ,  H01L23/00 ,  H01L21/311 ,  H01L21/683

CPC classification number: H01L21/68 ,  G03F7/70775 ,  H01L21/67092 ,  H01L21/67288 ,  H01L22/20 ,  H01L24/80 ,  H01L21/31105 ,  H01L21/6838 ,  H01L24/05 ,  H01L24/08 ,  H01L2224/05647 ,  H01L2224/08145 ,  H01L2224/80123 ,  H01L2224/80357 ,  H01L2224/80379 ,  H01L2224/80896 ,  H01L2924/05042 ,  H01L2924/05442

Abstract: According to embodiments, a semiconductor manufacturing apparatus includes a control circuit configured to acquire, for a pair of substrates including a first substrate and a second substrate, a warp amount of the first substrate, the warp amount of the first substrate including an amount of protrusion of a portion of the first substrate relative to an edge of the first substrate; determine a desired size for a gap between the first and second substrates based on the acquired warp amount; and control a chuck movement device to move one of the first and second substrates to adjust the gap to the determined size before the first and second substrates are bonded.

公开(公告)号：US20210296147A1

公开(公告)日：2021-09-23

申请号：US17019653

申请日：2020-09-14

Applicant: Kioxia Corporation

Inventor： Yoshio MIZUTA

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/50 ,  H01L21/20

Abstract: An apparatus includes a first and second stages. The first and second stages respectively hold a first and second substrates. The second stage being opposed to the first stage. A stress application portion applies a stress to the first substrate based on a first magnification value. A calculator calculates the first magnification value based on a flatness of the first substrate and a first equation. The first equation represents a relation between flatness of a third substrate, a second magnification value, and an amount of pattern misalignment between the third substrate and a fourth substrate bonded to the third substrate. A controller controls the stress application portion to apply a stress to the first substrate on the first stage based on the first magnification value while the first and second substrates are bonded to each other.

公开(公告)号：US20240210839A1

公开(公告)日：2024-06-27

申请号：US18461096

申请日：2023-09-05

Applicant: Kioxia Corporation

Inventor： Yoshio MIZUTA

IPC: G03F7/00 ,  H01L21/027

CPC classification number: G03F7/70558 ,  G03F7/70633 ,  H01L21/0274

Abstract: According to one embodiment, an exposure apparatus is configured to expose a substrate to light. The exposure apparatus includes a light source, a stage and a control device. The stage is configured to hold the substrate to be exposed. The control device is configured to correct exposure amount of light. The control device is configured to: calculate magnification components in a first direction and a second direction, based on measurement results of at least three alignment marks, the first direction and the second direction crossing each other and parallel with a surface of the substrate; and correct exposure amount based on a value of a difference between the magnification component of the first direction and the magnification component of the second direction.

公开(公告)号：US20230236495A1

公开(公告)日：2023-07-27

申请号：US17942339

申请日：2022-09-12

Applicant: Kioxia Corporation

Inventor： Yoshio MIZUTA

IPC: G03F1/42 ,  G03F7/20 ,  G03F9/00

CPC classification number: G03F1/42 ,  G03F7/7055 ,  G03F7/70533 ,  G03F9/7046

Abstract: An exposure apparatus according to an embodiment is configured to implement an exposure process for exposing a substrate to light. The exposure apparatus includes a stage, a storage device, and a controller. The stage is configured to hold the substrate. The storage device is configured to store a plurality of correction maps each having an alignment correction value that differs from each other. The controller is configured to control in the exposure process an exposure position relative to the substrate by selecting a correction map from the correction maps based on measurement results of a plurality of alignment marks arranged on the substrate or an amount of warpage of the substrate and moving the stage based on the selected correction map.

公开(公告)号：US20240419085A1

公开(公告)日：2024-12-19

申请号：US18664308

申请日：2024-05-15

Applicant: Kioxia Corporation

Inventor： Yoshio MIZUTA

IPC: G03F7/00

Abstract: An exposure apparatus according to one embodiment includes a stage and a control device. In an exposure process, the control device is configured to: calculate a calculated value of a magnification component by performing function approximation on measurement results of three or more alignment marks arranged on the substrate; set a first lower limit value and/or a first upper limit value for an alignment correction value of a magnification component; in a case where the first lower limit value is set and the calculated value is less than the first lower limit value, set the alignment correction value of the magnification component to a second correction value that is larger than the calculated value and smaller than the first correction value.

公开(公告)号：US20240297045A1

公开(公告)日：2024-09-05

申请号：US18591438

申请日：2024-02-29

Applicant: Kioxia Corporation

Inventor： Yoshio MIZUTA ,  Sadatoshi MURAKAMI

IPC: H01L21/268 ,  H01L21/683 ,  H01L21/762 ,  H01L21/78 ,  H01L23/00 ,  H01L25/065 ,  H10B80/00

CPC classification number: H01L21/268 ,  H01L21/6835 ,  H01L21/76251 ,  H01L21/7813 ,  H01L24/80 ,  H01L25/0657 ,  H10B80/00 ,  H01L2221/68386 ,  H01L2224/80006 ,  H01L2224/80948 ,  H01L2924/10158 ,  H01L2924/4015

Abstract: According to one embodiment, there is provided a method of manufacturing a semiconductor device. The method includes preparing a first substrate on which multiple projections distributed in a two-dimensional fashion are formed. The method includes stacking a first film over the multiple projections on the first substrate. The method includes stacking a second film on a second substrate. The method includes bonding a principal surface of the first film which is disposed on an opposite side of the first substrate to a principal surface of the second film which is disposed on an opposite side of the second substrate. The method includes performing irradiation with a laser beam from the first substrate. The method includes peeling the first substrate. A diameter of a spot area formed by the laser beam is larger than an average pitch between the projections arranged on the principal surface of the first substrate.

公开(公告)号：US20230411197A1

公开(公告)日：2023-12-21

申请号：US18166408

申请日：2023-02-08

Applicant: Kioxia Corporation

Inventor： Yoshio MIZUTA

IPC: H01L21/68 ,  H01L21/66 ,  H01L23/544 ,  H01L21/822 ,  H01L21/67 ,  G01B11/27

CPC classification number: H01L21/681 ,  H01L22/20 ,  H01L23/544 ,  H01L21/8221 ,  H01L21/67092 ,  G01B11/27 ,  H01L2223/54426

Abstract: According to one embodiment, a bonding apparatus includes first and second stages, first and second measuring devices, a stress generator, and a controller. The controller generates a focus map for each deformation amount of the first stage based on a deformation amount of the first stage deformed by the stress generator and the shape of the first substrate held by the deformed first stage. In the alignment processing of the first substrate, when causing the first measuring device to measure an alignment mark arranged on the first substrate held by the first stage, the controller uses a focus setting based on the focus map corresponding to the deformation amount applied to the first stage.

公开(公告)号：US20230091517A1

公开(公告)日：2023-03-23

申请号：US17694019

申请日：2022-03-14

Applicant: Kioxia Corporation

Inventor： Yoshio MIZUTA

IPC: H01L21/67 ,  H01L21/683 ,  B32B37/00

Abstract: A bonding apparatus according to an embodiment includes a first chuck, a second chuck, and a pushpin arranged in a center portion of the second chuck. The first chuck includes a first area and a second area in a plane view. The first chuck includes a first rib arranged to divide the first area and the second area from each other in the plane view. The first area includes an area that overlaps the pushpin in the plane view. The second area encircles an outer perimeter of the first area in the plane view. The first chuck has a plurality of pins arranged at intervals in the second area, and has no pin in the area of the first area that overlaps the pushpin in the plane view.