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    Method and apparatus for holding and centering electronic component
    1.
    发明授权
    Method and apparatus for holding and centering electronic component 失效
    用于保持和定心电子部件的方法和装置

    公开(公告)号：US4515507A

    公开(公告)日：1985-05-07

    申请号：US525392

    申请日：1983-08-22

    申请人： Koichi Asai ,  Mamoru Tsuda ,  Kunio Oe ,  Yasuo Muto

    发明人： Koichi Asai ,  Mamoru Tsuda ,  Kunio Oe ,  Yasuo Muto

    IPC分类号： B23P19/00 ,  B23P21/00 ,  B25J15/00 ,  H05K13/04 ,  B65G47/91 ,  H05K13/02

    CPC分类号： H05K13/0404 ,  H05K13/0413 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53261

    摘要： Method and apparatus for holding an electronic component prior to its placement on a circuit substrate. The component sucked by a sucker is first centered in one direction by closing movements of a first pair of opposed positioning members toward the component, and then centered in another direction normal to the above one direction by closing movements of a second pair of opposed positioning members which occur only after the first pair of positioning members are opened. The first pair of positioning members are provided on an assembly holding the sucker, and the second pair of positioning members are provided on the sucker holder assembly or separately from the sucker holder assembly. In the latter instance, the assembly holding the sucker and the first pair of positioning members are adapted to be movable relative to the separately provided second pair for alignment of the sucker with the separate second pair.

    摘要翻译： 在将电子元件放置在电路基板上之前将电子元件保持的方法和装置。 由吸盘吸附的部件首先通过闭合第一对相对的定位部件朝向部件的运动而中心在一个方向上，然后通过闭合第二对相对的定位部件的运动而沿垂直于上述一个方向的另一个方向居中 其仅在第一对定位构件打开之后才发生。 第一对定位构件设置在保持吸盘的组件上，第二对定位构件设置在吸盘支架组件上或与吸盘架组件分开设置。 在后一种情况下，保持吸盘和第一对定位构件的组件适于相对于单独提供的第二对可移动，用于使吸盘与单独的第二对对准。

    Apparatus for automatically mounting non-lead electronic components on printed-circuit
    2.
    发明授权
    Apparatus for automatically mounting non-lead electronic components on printed-circuit 失效
    用于在印刷电路上自动安装非铅电子部件的装置

    公开(公告)号：US4438559A

    公开(公告)日：1984-03-27

    申请号：US277105

    申请日：1981-06-25

    申请人： Koichi Asai ,  Kunio Oe ,  Mamoru Tuda

    发明人： Koichi Asai ,  Kunio Oe ,  Mamoru Tuda

    IPC分类号： H05K13/04 ,  B23P19/00

    CPC分类号： H05K13/0413 ,  H05K13/0417 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178

    摘要： A method and an apparatus for automatically mounting, on printed circuit boards, non-lead electronic components which are stored mutually independently within a multiplicity of apertures equally spaced longitudinally in a strip member and is covered with a covering tape. The covering tape is separated first by a covering tape separating assembly from the strip member so as to uncover a leading one of the apertures. A leading portion of the strip member including the uncovered leading aperture is cut off the strip member by a severing assembly consecutively. A plurality of the leading portions cut off the strip members respectively storing different kinds of components are arranged on a transfer element of a transfer assembly in a desired order and transferred to a fixed position by the transfer member. Each component stored in the cut-off leading portions is picked up, transferred, and mounted on a printed circuit board one by one. The uncovered and cut-off leading portion is utilized as a part of the transfer assembly.

    摘要翻译： 一种用于自动安装在印刷电路板上的非铅电子部件的方法和装置，它们相互独立地存储在多个孔中，该多个孔在带状部件中纵向间隔开并被覆盖带覆盖。 覆盖带首先由覆盖带分离组件与带状部件分离，以便露出一个前导孔。 包括未覆盖的前导孔的带状构件的引导部分通过切断组件连续地切除带状构件。 分离出分别存储不同种类的部件的条状部件的多个引导部分按所需顺序布置在转印组件的转印元件上，并由转印部件转移到固定位置。 存储在截止引导部分中的每个部件被逐个拾取，传送和安装在印刷电路板上。 未覆盖和截止的引导部分被用作传送组件的一部分。

    Transfer type circuit board fabricating system
    3.
    发明授权
    Transfer type circuit board fabricating system 失效
    转印式电路板制造系统

    公开(公告)号：US5692292A

    公开(公告)日：1997-12-02

    申请号：US520989

    申请日：1995-08-30

    申请人： Koichi Asai ,  Kunio Oe ,  Masayuki Shimmura

    发明人： Koichi Asai ,  Kunio Oe ,  Masayuki Shimmura

    IPC分类号： B23P19/00 ,  H05K13/00 ,  H05K13/02 ,  H05K3/30 ,  B23P21/00 ,  H05K13/08

    CPC分类号： H05K13/0061 ,  Y10T29/53013 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53378 ,  Y10T29/53409

    摘要： A transfer type circuit board fabricating system having a plurality of working modules each including (a) a conveyor device for transferring circuit boards in a predetermined transfer direction, (b) a working device for performing a predetermined operation on the circuit boards, and (c) a controller constituted principally by a computer, for controlling the working device, wherein the conveyor devices transfer the circuit boards one after another in the predetermined transfer direction through the working devices of the working modules, the system further having a coordinating control device constituted principally by a computer, for controlling the controllers of the working modules, on the basis of predetermined working schedule information stored therein, and status information which is received from the controllers of said working modules and which indicates operating states of the working modules.

    摘要翻译： 一种传送式电路板制造系统，具有多个工作模块，每个工作模块包括：（a）用于沿预定传送方向传送电路板的传送装置，（b）用于在电路板上执行预定操作的工作装置，以及（c ）主要由计算机构成的用于控制工作装置的控制器，其中传送装置通过工作模块的工作装置在预定传送方向上一个接一个地传送电路板，该系统还具有主要构成的协调控制装置 通过计算机，根据存储在其中的预定工作时间表信息和从所述工作模块的控制器接收并指示工作模块的操作状态的状态信息来控制工作模块的控制器。

    Circuit component supplying system, feeder, and circuit component supplying managing method
    4.
    发明授权
    Circuit component supplying system, feeder, and circuit component supplying managing method 失效
    电路元件供应系统，馈线和电路元件供应管理方法

    公开(公告)号：US5930140A

    公开(公告)日：1999-07-27

    申请号：US942363

    申请日：1997-10-02

    申请人： Koichi Asai ,  Kunio Oe ,  Masayuki Shimmura ,  Seigo Kodama ,  Tetsunori Kawasumi

    发明人： Koichi Asai ,  Kunio Oe ,  Masayuki Shimmura ,  Seigo Kodama ,  Tetsunori Kawasumi

    IPC分类号： B23P21/00 ,  B65G47/49 ,  H05K13/02 ,  G06F17/00 ,  G06F19/00

    CPC分类号： H05K13/02 ,  H05K13/0417 ,  H05K13/08 ,  Y10T29/53365 ,  Y10T29/53478

    摘要： A circuit component supplying system including a plurality of feeders each of which stores a plurality of circuit components of at least one sort and supplies the circuit components of the one sort, one by one, a feeder holder including a plurality of feeder holding portions which hold the plurality of feeders, respectively, and a managing device which manages the supplying of the circuit components by the each of the feeders, the each feeder including a code holder which holds at least a feeder identification code distinguishing the each feeder from the other feeders, and the managing device managing the supplying of the circuit components by the each feeder, based on the feeder identification code held by the code holder of the each feeder.

    摘要翻译： 一种电路元件供给系统，包括多个供给器，每个供给器存储至少一个类型的多个电路元件，并且一个接一个地供应一种电路元件;馈电器保持器，其包括多个馈电器保持部分， 所述多个供给器分别具有管理装置，该管理装置管理由所述供给部供给的所述电路部件，所述各供给装置包括代码保持部，所述代码保持部至少保持将所述各供给体与所述其他供给部区分开的供给器识别码， 并且管理装置基于由每个馈送器的代码保持器保持的馈线识别码来管理由每个馈线提供电路部件的管理装置。

    Electronic-component mounting head
    5.
    发明授权
    Electronic-component mounting head 失效
    电子元件安装头

    公开(公告)号：US5758410A

    公开(公告)日：1998-06-02

    申请号：US627993

    申请日：1996-04-04

    申请人： Koichi Asai ,  Kunio Oe ,  Seiichi Terui

    发明人： Koichi Asai ,  Kunio Oe ,  Seiichi Terui

    IPC分类号： B23P21/00 ,  B25J15/06 ,  H05K13/04 ,  H05K3/30 ,  H05K13/00

    CPC分类号： H05K13/0408 ,  Y10S29/044 ,  Y10T29/4913 ,  Y10T29/53052 ,  Y10T29/53178 ,  Y10T29/53191

    摘要： A mounting head, a mounting apparatus, and a mounting method which are capable of contacting an electronic component with a substrate with a small contact load and mounting the component on the substrate, are provided. A suction device 120 is fit on a splined axis portion 118 of a support shaft 84 via a ball spline 126, is biased downward by a first spring 130, and is biased upward by a second spring 134. A suction nozzle 124 is attached to a nozzle holder 122 by engaging engagement ridges 172 of sheet springs 166 fixed to the suction nozzle 124 with engagement grooves 144 of the nozzle holder 122, respectively. Prior to the mounting of electronic components 178, a relationship between contact load and position of lift 28 is obtained, and a position to which the lift 28 is moved downward for mounting each electronic component 178 is pre-determined. Thus, each component 178 is contacted with a printed circuit board with an appropriate load. Each component 178 is contacted with the circuit board with a small load, by removing the self weight of the suction device 120 owing to the biasing action of the second spring 134 and reducing the frictional resistance produced between the suction device 120 and the axis member 84 owing to the provision of the ball spline 126.

    摘要翻译： 提供了能够使电子部件与具有小的接触负载的基板接触并将部件安装在基板上的安装头，安装装置和安装方法。 抽吸装置120通过滚珠花键126装配在支撑轴84的花键轴部分118上，并被第一弹簧130向下偏压，并被第二弹簧134向上偏压。吸嘴124附接到 通过将固定到吸嘴124的片弹簧166的接合脊172分别与喷嘴保持器122的接合槽144分别接合而形成喷嘴保持器122。 在安装电子部件178之前，获得了接触载荷与升程28的位置之间的关系，并且预先确定升降机28向下移动以安装每个电子部件178的位置。 因此，每个部件178与具有适当负载的印刷电路板接触。 通过由于第二弹簧134的偏置动作而去除吸引装置120的自重，并且减小了抽吸装置120与轴构件84之间产生的摩擦阻力，使每个部件178以小的载荷与电路板接触 由于提供球形花键126。

    Electronic-component mounting head, electronic-component mounting apparatus, and electronic-component mounting method
    6.
    发明授权
    Electronic-component mounting head, electronic-component mounting apparatus, and electronic-component mounting method 失效
    电子部件安装头，电子部件安装装置和电子部件安装方法

    公开(公告)号：US6012222A

    公开(公告)日：2000-01-11

    申请号：US40590

    申请日：1998-03-18

    申请人： Koichi Asai ,  Kunio Oe ,  Seiichi Terui

    发明人： Koichi Asai ,  Kunio Oe ,  Seiichi Terui

    IPC分类号： B23P21/00 ,  B25J15/06 ,  H05K13/04 ,  H05K3/30

    CPC分类号： H05K13/0408 ,  Y10S29/044 ,  Y10T29/4913 ,  Y10T29/53052 ,  Y10T29/53178 ,  Y10T29/53191

    摘要： A mounting head, a mounting apparatus, and a mounting method which are capable of contacting an electronic component with a substrate with a small contact load and mounting the component on the substrate, are provided. A suction device 120 is fit on a splined axis portion 118 of a support shaft 84 via a ball spline 126, is biased downward by a first spring 130, and is biased upward by a second spring 134. A suction nozzle 124 is attached to a nozzle holder 122 by engaging engagement ridges 172 of sheet springs 166 fixed to the suction nozzle 124 with engagement grooves 144 of the nozzle holder 122, respectively. Prior to the mounting of electronic components 178, a relationship between contact load and position of lift 28 is obtained, and a position to which the lift 28 is moved downward for mounting each electronic component 178 is pre-determined. Thus, each component 178 is contacted with a printed circuit board with an appropriate load. Each component 178 is contacted with the circuit board with a small load, by removing the self weight of the suction device 120 owing to the biasing action of the second spring 134 and reducing the frictional resistance produced between the suction device 120 and the axis member 84 owing to the provision of the ball spline 126.

    摘要翻译： 提供了能够使电子部件与具有小的接触负载的基板接触并将部件安装在基板上的安装头，安装装置和安装方法。 抽吸装置120通过滚珠花键126装配在支撑轴84的花键轴部分118上，并被第一弹簧130向下偏压，并被第二弹簧134向上偏压。吸嘴124附接到 通过将固定到吸嘴124的片弹簧166的接合脊172分别与喷嘴保持器122的接合槽144分别接合而形成喷嘴保持器122。 在安装电子部件178之前，获得了接触载荷与升程28的位置之间的关系，并且预先确定升降机28向下移动以安装每个电子部件178的位置。 因此，每个部件178与具有适当负载的印刷电路板接触。 由于第二弹簧134的偏置动作，通过去除吸引装置120的自重而减小吸引装置120与轴构件84之间产生的摩擦阻力，使各构件178与电路板以小负载接触 由于提供球形花键126。

    Electronic-component removing system
    7.
    发明授权
    Electronic-component removing system 失效
    电子元件去除系统

    公开(公告)号：US5784777A

    公开(公告)日：1998-07-28

    申请号：US645489

    申请日：1996-05-13

    申请人： Koichi Asai ,  Kunio Oe

    发明人： Koichi Asai ,  Kunio Oe

    IPC分类号： C09J7/02 ,  C09J5/00 ,  H05K13/02 ,  H05K13/04 ,  H05K3/30

    CPC分类号： H05K13/0417 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49769

    摘要： An electronic-component ("EC") removing system including a supplying device which feeds an EC carrier tape in a feeding direction parallel to a length-wise direction of an adhesive tape of the carrier tape, a thrusting device including a thrust member and a first actuator which moves the thrust member between a thrusted and a retracted position through an opening of the adhesive tape in a thrusting direction perpendicular to the feeding direction, and a receiving device including a holder which holds each of ECs adhered to the adhesive tape, a movable member which supports the holder such that the holder is movable relative thereto, and a second actuator which moves the movable member between an EC removing position in which the holder is opposed via each EC to the thrust member and, when the thrust member is moved to the thrusted position through the opening of the adhesive tape to thrust each EC toward the holder, the holder is moved with each EC relative to the movable member in the thrusting direction to remove each EC from the adhesive tape, and a different position thereof away from the EC removing position.

    摘要翻译： 一种电子部件（“EC”）移除系统，包括供给装置，该供给装置沿与载带的胶带的长度方向平行的进给方向供给EC载带，包括推力部件和 第一致动器，其通过沿着与进给方向垂直的推力方向将推力构件在推进位置和缩回位置之间穿过粘合带的开口移动;以及接收装置，其包括保持器，其保持粘附到胶带上的每个EC， 可移动构件，其支撑保持器，使得保持器能够相对于其移动;以及第二致动器，其将可移动构件在EC移除位置之间移动，其中保持器经由每个EC相对于推动构件，并且当推动构件移动 通过打开胶带将推动位置推向每个EC朝向保持器，使保持器在每个EC相对于可移动部件移动到 推压方向从胶带中除去每个EC，并且其远离EC去除位置的不同位置。

    Method for automatically mounting non-lead electronic components on printed-circuit boards
    8.
    发明授权
    Method for automatically mounting non-lead electronic components on printed-circuit boards 失效
    在印刷电路板上自动安装非铅电子部件的方法

    公开(公告)号：US4503607A

    公开(公告)日：1985-03-12

    申请号：US562812

    申请日：1983-12-19

    申请人： Koichi Asai ,  Kunio Oe ,  Mamoru Tuda

    发明人： Koichi Asai ,  Kunio Oe ,  Mamoru Tuda

    IPC分类号： H05K13/04 ,  H05K3/30

    CPC分类号： H05K13/0413 ,  H05K13/0417 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178

    摘要： A method and an apparatus for automatically mounting, on printed circuit boards, non-lead electronic components which are stored mutually independently within a multiplicity of apertures equally spaced longitudinally in a strip member and is covered with a covering tape. The covering tape is separated first by a covering tape separating assembly from the strip member so as to uncover a leading one of the apertures. A leading portion of the strip member including the uncovered leading aperture is cut off the strip member by a severing assembly consecutively. A plurality of the leading portions cut off the strip members respectively storing different kinds of components are arranged on a transfer element of a transfer assembly in a desired order and transferred to a fixed position by the transfer member. Each component stored in the cut-off leading portions is picked up, transferred and mounted on a printed circuit board one by one. The uncovered and cut-off leading portion is utilized as a part of the transfer assembly.

    摘要翻译： 一种用于自动安装在印刷电路板上的非铅电子部件的方法和装置，它们相互独立地存储在多个孔中，该多个孔在带状部件中纵向间隔开并被覆盖带覆盖。 覆盖带首先由覆盖带分离组件与带状部件分离，以便露出一个前导孔。 包括未覆盖的前导孔的带状构件的引导部分通过切断组件连续地切除带状构件。 分离出分别存储不同种类的部件的条状部件的多个引导部分按所需顺序布置在转印组件的转印元件上，并由转印部件转移到固定位置。 存储在截止引导部分中的每个部件被逐个拾取，传送并安装在印刷电路板上。 未覆盖和截止的引导部分被用作传送组件的一部分。