摘要:
A dynamic random access memory that contains a memory cell array including a plurality of memory cells includes a pre-amplifier intended to amplify data which is read out from a memory cell accessed by an address signal; a main-amplifier intended to amplify the output of the pre-amplifier and output the amplified signal; and a driver circuit intended to output a driving signal for driving the main-amplifier, the driver circuit includes a first and a second transistor, wherein a drain of the first transistor is connected to a node corresponding to an output terminal of the driver circuit, with a source of the first transistor being earthed and with a gate thereof being connected to the drain of the second transistor, and wherein a gate of the second transistor is connected to the node with a source thereof being earthed.
摘要:
An LSI semiconductor memory device in which errors in reading out memory cells connected to outermost bit lines of a memory cell array of the device are substantially eliminated. In accordance with the invention, this is done by making capacitances associated with the bit lines of respective ones of the memory cell array substantially equal to one another. To accomplish this, the configuration of an inside portion of wiring other than the bit lines of the array is made the same as that of the bit lines, and the distance between the outermost bit line and the other wiring is made equal to the distance between adjacent ones of the bit lines.
摘要:
A semiconductor memory device operable for reading and writing in a normal mode and in a test mode is divided into memory cell sections each having blocks of memory cells. Data bus lines are connected to the respective blocks, and switches interconnect data bus lines connected to blocks of the different sections. The switch are made conductive during reading and writing in the normal mode and during writing in the test mode, and nonconductive during reading in the test mode. Input data are applied onto the data bus lines connected to one of the blocks for writing in the blocks of the sections simultaneously during writing in the normal mode and in the test mode. In the normal mode, data are read out of the blocks of the sections through the data bus lines connected to the above-mentioned one of the blocks. In the test mode, the data are read out of the blocks of the sections through the data bus lines connected to the respective blocks.
摘要:
In a metal-oxide semiconductor (MOS) dynamic formed on a semiconductor substrate, data nodes of a first flip-flop are connected to a first pair of folded bit lines. Its power supply node is connected through a switch to a first power supply (Vss). Data nodes of a second flip-flop are connected to a second pair of folded bit lines. Its power supply node is connected through a switch to the first power supply (Vss). A power supply node of a third flip-flop is connected through a switch to a second power supply (Vcc). Data nodes of the third flip-flop are coupled through a first pair of transfer gates to the first pair of the folded bit lines, and through a second pair of transfer gates to the second pair of the folded bit lines. Coupling the first to the third flip-flops forms a first sense amplifier and coupling the second to the third flip-flops forms a second sense amplifier.
摘要:
A CMOS row decoder circuit in which a row decoder for selecting a single word line from a memory cell array and a column decoder for selecting a single bit line can use in common an internal address signal transmission line. The row decoder circuit comprises a series of MOSFETs of a first conductivity type which is turned on or off in response to address signals selected from external address signals, a second MOSFET of a second conductivity type provided between a power supply potential and the series of MOSFETs and having a gate receiving a first timing signal for providing decoding timing of the address signals, a third MOSFET of the first conductivity type provided between the series of MOSFETs and the second MOSFET and having a gate receiving a first operation timing signal, a fourth MOSFET which is turned on or off in response to a second operation timing signal for transmitting the potential of a node of the second MOSFET and the third MOSFET, and a fifth MOSFET having a gate receiving an output of the fourth MOSFET for transmitting a word line driving signal to a corresponding word line.
摘要:
A semiconductor memory device operable for reading and writing in a normal mode and in a test mode is divided into memory cell sections each having blocks of memory cells. Data bus lines are connected to the respective blocks, and switches interconnect data bus lines connected to blocks of the different sections. The switches are made conductive during reading and writing in the normal mode and during writing in the test mode, and nonconductive during reading in the test mode. Input data are applied onto the data bus lines connected to one of the blocks for writing in the blocks of the sections simultaneously during writing in the normal mode and in the test mode. In the normal mode, data are read out of the blocks of the sections through the data bus lines connected to the above-mentioned one of the blocks. In the test mode, the data are read out of the blocks of the sections through the data bus lines connected to the respective blocks.
摘要:
A memory cell array is divided into two groups, one bit line of a pair of bit lines is connected to corresponding memory cells in the first group of the memory cell array, and the other bit line thereof is connected to corresponding memory cells in the second group of the memory cell array.
摘要:
In a memory cell comprising a data cell array and a parity cell array, an error checking.multidot.correcting circuit is connected to each of the arrays through a selector. The selector is constituted by transistors connected to each of the bit lines in the memory cell. The number of circuit elements constituting the error checking.multidot.correcting circuit corresponds to one-half of the number of the bit line pairs included in the data cell array and the parity cell array. In an error correcting mode, half of the data appeared on the bit line pairs in data cell array and the parity cell array are transferred to the error checking.multidot.correcting circuit by the selector, so that the errors are corrected. Thereafter, the data of the remaining half of the bit line pairs are processed in the same manner. Therefore, the number of circuit elements of the error checking.multidot.correcting circuit can be reduced compared with the prior art, improving the degree of integration of the device.
摘要:
In a semiconductor memory device having an error correcting circuit, a pair of bit lines and inverted bit lines are connected to the inputs of first and second inverting amplitude circuits through a first and second N channel MOS transistors, respectively, and the output of the first inverting amplitude circuit is connected to the bit line through a third transistor and the output of the second inverting amplitude circuit is connected to the inverted bit line through a fourth transistor. When an error of information of any bit line pair is detected by an error detecting circuit, the first and second N channel MOS transistors are turned off and each bit line pair is separated from the input of the first and second inverting amplitude circuits and, as a result, information of a bit line pair is rewritten by the output of the first and second inverting amplitude circuits.
摘要:
In a semiconductor memory device of a redundancy configuration having lines (rows or columns) of main memory cells and a line of spare memory cells made to substitute a defective line responsive to the address of the defective line, a comparator compares an address input to the memory device, with the address of the defective line which has been programmed in it, and a spare line selector selects the spare line when the input address is found to coincide with the programmed address. The comparator comprises a dynamic NOR gate having discharge paths each formed of a gate element receiving a bit or its inversion of the input address to be opened or closed depending on the value of the particular bit of the input address currently applied, and a PROM element in series with the gate element. The dynamic NOR gate has a first node forming an output thereof and a second node, each of the series connections of the PROM element and the gate element is connected across the first and the second nodes. The potential on the second node is caused to be identical with the potential on the first node during the precharge period.