Silicon-containing polyamic acid derivative and photosensitive resin
composition using it
    1.
    发明授权
    Silicon-containing polyamic acid derivative and photosensitive resin composition using it 失效
    含硅聚酰胺酸衍生物和使用它的感光性树脂组合物

    公开(公告)号:US5449705A

    公开(公告)日:1995-09-12

    申请号:US229741

    申请日:1994-04-19

    摘要: The present invention provides a silicon-containing polyamic acid derivative which is represented by the formula (VI) ##STR1## and which has a logarithmic viscosity number of 0.1 to 5.0 dl/g at 30.degree. C. in N-methyl-2-pyrrolidone, said silicon-containing polyamic acid derivative being obtained by reacting A mol of a tetracarboxylic acid derivative, B mol of a diamine, and C mol of an aminosilicon compound so as to meet the relations of the equations (IV) and (V): ##EQU1## A photosensitive resin composition using this silicon-containing polyamic acid derivative can be easily manufactured, permits the formation of a negative type sharp relief pattern, can inhibit film reduction at the time of curing by baking, and is excellent in adhesive properties to substrates, heat stability and shelf stability.

    摘要翻译: 本发明提供由式(VI)XkR3-k5Si(VI)< IMAGE>表示的含硅聚酰胺酸衍生物,其在30℃下的对数粘度为0.1〜5.0dl / g - 甲基-2-吡咯烷酮,所述含硅聚酰胺酸衍生物是通过使A摩尔四羧酸衍生物,B摩尔二胺和C摩尔的氨基硅化合物反应得到的,以满足式(IV (V):(V)使用该含硅聚酰胺酸衍生物的感光性树脂组合物可以容易地制造,允许形成负型锐利浮雕图案,可以抑制膜还原 在通过烘烤固化时,对基材的粘合性优异,热稳定性和贮存稳定性优异。

    Photosensitive polyimide resin composition
    3.
    发明授权
    Photosensitive polyimide resin composition 失效
    感光聚酰亚胺树脂组合物

    公开(公告)号:US5589319A

    公开(公告)日:1996-12-31

    申请号:US196125

    申请日:1994-02-17

    摘要: The present invention provides a photosensitive resin composition into which a photosensitive group can be easily given and introduced and which is excellent in conservation, stability, heat resistance, practical physical properties and sensitivity and which can inhibit cracks from occurring at the time of development.The photosensitive resin composition of the present invention comprises 100 parts by weight of a polyimide, 10-100 parts by weight of an isocyanurate having a (meth)acrylic group, 10-100 parts by weight of a polyalkylene glycol di(meth)acrylate, and 0.5-20 parts by weight of a photopolymerization initiator. This composition can be utilized to obtain a patterned polyimide film having heat resistance.This composition can be applied to uses of electronic materials such as interlayer films of multi-layer boards of printed-wiring boards, and the like.

    摘要翻译: PCT No.PCT / JP93 / 00853 Sec。 371日期1994年2月17日 102(e)日期1994年2月17日PCT提交1993年6月24日PCT公布。 WO94 / 00800 PCT出版物 日本1994年1月6日本发明提供一种光敏性树脂组合物,其中可以容易地引入光敏基团并且具有优异的保存性,稳定性,耐热性,实际物理性质和灵敏度,并且可以抑制在 发展时间 本发明的感光性树脂组合物含有100重量份聚酰亚胺,10-100重量份具有(甲基)丙烯酸基团的异氰脲酸酯,10-100重量份聚亚烷基二醇二(甲基)丙烯酸酯, 和0.5-20重量份的光聚合引发剂。 该组合物可用于获得具有耐热性的图案化聚酰亚胺膜。 该组合物可以应用于诸如印刷电路板的多层板的层间膜等电子材料的使用。

    Photosensitive polymide precursor resin composition
    4.
    发明授权
    Photosensitive polymide precursor resin composition 失效
    感光聚酰亚胺前体树脂组合物

    公开(公告)号:US06664021B1

    公开(公告)日:2003-12-16

    申请号:US08756440

    申请日:1996-11-26

    IPC分类号: G03C176

    摘要: A photosensitive resin composition is provide which includes a compound for generating an acid by light irradiation and at least one polyimide precursor selected from the group consisting of a silicon-containing polyimide precursor (a) obtained from A mol of a tetracarboxylic dianhydride or its derivative formed by adding 2 mols or less of a monovalent saturated alcohol to 1 mol of the tetracarboxylic dianhydride, B mol of a diamine and C mol of an aminosilicon compound represented by the formula (1) H2N—R1—SiR23−kXk  (1) {wherein R1 is —(CH2)s—, (wherein s is an integer of from 1 to 4); R2 is independently an alkyl group having 1 to 6 carbon atoms, a phenyl group or a phenyl group substituted by an alkyl group having 7 to 12 carbon atoms; X is a hydrolytic alkoxy group; and k is 1≦k≦3} in a ratio meeting the following formulae (2) and (3) 1 ≦ C A - B ≦ 2.5 ( 2 ) 0.1 ≦ C B + C ≦ 1 ( 3 ) a silicon-containing polyamic acid ester (b) obtained by esterifying the precursor (a) with a monovalent saturated alcohol, and a partially esterified silicon-containing polyamic acid ester (c) obtained by partially esterifying the precursor (a) with the monovalent saturated alcohol.

    摘要翻译: 提供一种光敏树脂组合物,其包括通过光照射产生酸的化合物和至少一种选自由A摩尔四羧酸二酐或其衍生物形成的含硅聚酰亚胺前体(a)的聚酰亚胺前体 通过向1摩尔四羧酸二酐中加入2摩尔以下的一价饱和醇,B摩尔二胺和C摩尔由式(1)表示的氨基硅化合物{其中R 1为 - (CH 2)s - ,(其中s是1至4的整数); R 2独立地为具有1至6个碳原子的烷基,苯基或被具有7至12个碳原子的烷基取代的苯基; X是水解性烷氧基; 和k为1 <= K&LE; 3},满足下式(2)和(3)通过用一价饱和醇酯化前体(a)获得的含硅聚酰胺酸酯(b),和 通过用一价饱和醇部分酯化前体(a)而得到的部分酯化的含硅聚酰胺酸酯(c)。

    Photosensitive polyimide precursor composition
    5.
    发明授权
    Photosensitive polyimide precursor composition 失效
    感光聚酰亚胺前体组合物

    公开(公告)号:US5442024A

    公开(公告)日:1995-08-15

    申请号:US233693

    申请日:1994-04-26

    摘要: A photosensitive polyimide precursor composition of the present invention comprises a polyimide precursor represented by the formula (6)(OR.sup.5).sub.k R.sup.4.sub.3-k Si--R.sup.3 --X--Z (6)and having a logarithmic viscosity number of 0.1 to 5.0 dl/g measured in N-methyl-2-pyrrolidone at 30.degree. C. and a compound capable of generating an acid by light irradiation, said polyimide precursor being obtained by reacting A mol of a tetracarboxylic dianhydride, B mol of a diamine, and C mol of an aminosilane so as to meet the relations of the equations: ##EQU1## This composition not only has practical photosensitivity but also inhibits the reduction of film thickness due to curing and development, and it is also excellent in shelf stability in varnish and adhesive properties to a substrate such as a silicon wafer or the like.

    摘要翻译: 本发明的感光性聚酰亚胺前体组合物含有式(6)所示的聚酰亚胺前体(OR5)kR43-kSi-R3-XZ(6),其对数粘度为0.1〜5.0dl / g, 甲基-2-吡咯烷酮和30℃的能够通过光照射产生酸的化合物,所述聚酰亚胺前体是通过使A摩尔四羧酸二酐,B摩尔二胺和C摩尔的氨基硅烷反应得到的, 以满足方程式的关系: 该组合物不仅具有实用的光敏性,而且抑制了由于固化和显影而导致的膜厚度的降低,并且其清漆中的保存稳定性和对于 衬底如硅晶片等。

    Method of preparing a negative pattern utilizing photosensitive polymer
composition containing quinonediazide compound and a poly(amido)imide
precursor

    公开(公告)号:US5342739A

    公开(公告)日:1994-08-30

    申请号:US938139

    申请日:1992-10-22

    CPC分类号: G03F7/0757 G03F7/0233

    摘要: A method of preparing a negative type pattern of a polyimide film is provided which includes applying to a substrate a sufficient amount of a photosensitive polymer composition to form a negative type pattern, the photosensitive polymer composition comprising a mixture of a poly(amido)imide precursor containing a repeating unit represented by the following formula (I), at least one kind of quinonediazide compound and an organic solvent: ##STR1## R.sup.1 is a trivalent or a tetravalent carbocyclic aromatic group or heterocyclic group; R.sup.2 is an aliphatic group having at least two carbon atoms, an alicyclic group, an aromatic aliphatic group, a carbocyclic aromatic group, a heterocyclic group or a polysiloxane group; X is --O-- or NR.sup.5 --, where R.sup.5 is a hydrogen atom or a monovalent organic group having 10 or less carbon atoms; R.sup.3 is a divalent organic group; R.sup.4 is a hydrogen atom or a monovalent organic group having 20 or less carbon atoms; Ar is a hexavalent or decavalent organic group represented by the formula ##STR2## k is an integer of 1.ltoreq.k.ltoreq.5, and j+k+1 is equal to the valence of Ar; m is independently 1 or 2; n is independently 0 or 1 and the values of m and n are in the range of 1.ltoreq.m+n.ltoreq.2; prebaking the composition at 50.degree.-130.degree. C.; irradiating the composition through a mask with actinic radiation to form an irradiated composition; developing the irradiated composition with a developing solution comprising a basic solution of a basic substance in a solvent comprising 0 to 10 parts by weight of water and 100 to 90 parts by weight of a water-soluble organic solvent to remove unexposed portions of the composition and form a negative type pattern; rinsing and drying the pattern; and post-baking the pattern at 200.degree.-500.degree. C.

    Clamp
    7.
    发明申请
    Clamp 失效

    公开(公告)号:US20070033774A1

    公开(公告)日:2007-02-15

    申请号:US11543056

    申请日:2006-10-05

    IPC分类号: A44B11/25

    摘要: A clamp is provided having a synthetic clip and a metal plate spring. The clip includes a pair of side walls opposed each other at a certain distance, engaging shoulder portions each formed at an outer surface of each of the side walls and configured to be engaged with a peripheral edge of a mounting hole of a panel at the time of securing a mounting member to the panel. The spring is attached to one of the side walls of the clip. A press-fitting portion is formed at an inner surface of the other side wall and configured to be pressed against a boss portion of the mounting member. The spring includes a bite-into portion facing the press-fitting portion and configured to bite into the boss portion of the mounting member at the time of securing the mounting member to the panel.

    摘要翻译: 提供具有合成夹子和金属板弹簧的夹具。 该夹子包括一对相对于一定距离的侧壁,接合肩部,每个侧壁形成在每个侧壁的外表面,并被配置成与此时的面板的安装孔的周边接合 将安装构件固定到面板上。 弹簧连接到夹子的一个侧壁上。 压配部形成在另一侧壁的内表面,并被构造成压靠安装部件的凸台部。 弹簧包括面向压配部的咬入部,并且构造成在将安装构件固定到面板上时咬入安装构件的凸台部。

    Program execution device and method for controlling the same
    9.
    发明授权
    Program execution device and method for controlling the same 有权
    程序执行装置及其控制方法

    公开(公告)号:US08701089B2

    公开(公告)日:2014-04-15

    申请号:US12877515

    申请日:2010-09-08

    IPC分类号: G06F9/44

    CPC分类号: G06F11/3632

    摘要: Conventionally, when executing a plurality of programs while being synchronized by a plurality of debuggers, an interface has been required for performing a particular coordination between the debuggers. In the present invention, programs are synchronously executed without coordination between the debuggers by performing a control method including a step for maintaining a program execution state in the debuggers to be different from an actual program execution state, so that the program execution is retained, if necessary, in response to a program execution request from a debugger.

    摘要翻译: 通常,当在多个调试器同步的同时执行多个程序时,需要接口来执行调试器之间的特定协调。 在本发明中,通过执行包括将调试器中的程序执行状态维持为不同于实际程序执行状态的步骤的控制方法,在调试器之间不进行协调的同步执行程序,从而保持程序执行,如果 必要时,响应来自调试器的程序执行请求。

    Process for preparation of olefin polymers
    10.
    发明授权
    Process for preparation of olefin polymers 失效
    制备烯烃聚合物的方法

    公开(公告)号:US5137995A

    公开(公告)日:1992-08-11

    申请号:US711706

    申请日:1991-06-07

    CPC分类号: C08F10/00

    摘要: A process for the preparation of olefin polymers, which comprises polymerizing an olefin in the presence of a catalyst which comprises: (A) a solid catalyst component obtained by contacting a magnesium dihalide such as MgCl.sub.2 with a titanium tetra-alkoxide such as Ti(O-nBu).sub.4 and then with a polymeric silicon compound having a structure represented by the formula ##STR1## wherein R stands for a hydrocarbon residue such as CH.sub.3, and contacting the obtained solid component with a halogen compound of silicon such as SiCl.sub.4 or with a halogen compound of silicon such as SiCl.sub.4 and a halogen compound of titanium such as TiCl.sub.4, (B) an organoaluminum compound such as Al(Et).sub.3 ; and (C) an organic silicon compound having an Si--O--C linkage such as PhSi(OEt).sub.3. According to this process, a polymer having a high stereoregularity, a narrow particle size distribution and a high bulk density can be obtained in a high yield with a high efficiency.

    摘要翻译: 一种制备烯烃聚合物的方法,其包括在催化剂存在下使烯烃聚合,所述催化剂包括:(A)通过使二氯化镁如MgCl 2与四烷氧基钛如Ti(O)接触而获得的固体催化剂组分 -nBu)4,然后与具有由式“IMAGE”表示的结构的聚合物硅化合物反应,其中R代表烃残基例如CH 3,并使得到的固体组分与硅的卤素化合物如SiCl 4或与 诸如SiCl 4的硅卤素化合物和钛的卤素化合物如TiCl 4,(B)有机铝化合物如Al(Et)3; 和(C)具有Si-O-C键的有机硅化合物如PhSi(OEt)3。 根据该方法,可以高效率地获得具有高立构规整性,窄粒度分布和高堆积密度的聚合物。