公开(公告)号：US20060241239A1

公开(公告)日：2006-10-26

申请号：US11373738

申请日：2006-03-09

申请人： Kuan-Yuan Hwang ,  An-Pang Tu ,  Sheng-Yen Wu

发明人： Kuan-Yuan Hwang ,  An-Pang Tu ,  Sheng-Yen Wu

IPC分类号： C08G18/08 ,  C08G73/00

CPC分类号： C08G18/603 ,  C08G73/14 ,  C09D175/12 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0209

摘要： The present invention provides a polyoxyalkylene amine-modified polyamideimide resin and a polyamideimide resin composition includes said polyoxyalkylene amine-modified polyamideimide resin, a thermosetting resin and a rubber elastomer, and may further include an inorganic filler. The polyamideimide resin composition of the present invention has high heat resistance and high bond strength and can achieve sufficient adhesion at lower temperature, for example, 160 to 180° C. Thus, the resin composition of the present invention is suitable for use in bonding circuit boards and IC members.

摘要翻译： 本发明提供聚氧亚烷基胺改性的聚酰胺酰亚胺树脂和聚酰胺酰亚胺树脂组合物，其包含所述聚氧亚烷基胺改性的聚酰胺酰亚胺树脂，热固性树脂和橡胶弹性体，还可以包括无机填料。 本发明的聚酰胺酰亚胺树脂组合物具有高耐热性和高粘合强度，并且可以在较低温度例如160-180℃下实现足够的粘合。因此，本发明的树脂组合物适用于接合电路 董事会和IC成员。

公开(公告)号：US20060287468A1

公开(公告)日：2006-12-21

申请号：US11442501

申请日：2006-05-26

申请人： Kuen-Yuan Hwang ,  An-Pang Tu ,  Sheng-Yen Wu

发明人： Kuen-Yuan Hwang ,  An-Pang Tu ,  Sheng-Yen Wu

IPC分类号： C08G73/00

CPC分类号： H05K1/0346 ,  C08G73/16 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2203/065

摘要： The present invention provides a polyimide resin formed by polycondensating a dianhydride monomer including at least a dianhydride monomer represented by formula (I) and a diamine monomer to form a polyamic acid resin, and then cyclodehydrating the polyamic acid. Through using the dianhydride monomer of formula (I) as the polymerizing unit, a biphenyl moiety is introduced into the main chain of polyimide resin, such that the resulting polyimide resin has lower moisture absorption and smaller thermal expansion coefficient, as well as satisfactory heat resistance and dimensional stability.

摘要翻译： 本发明提供一种聚酰亚胺树脂，该聚酰亚胺树脂通过至少包含由式（I）表示的二酐单体和二胺单体的二酐单体缩聚形成聚酰胺酸树脂，然后使聚酰胺酸环化脱水形成。 通过使用式（I）的二酐单体作为聚合单元，将联苯部分引入聚酰亚胺树脂的主链中，使得所得聚酰亚胺树脂具有较低的吸湿性和较小的热膨胀系数，以及令人满意的耐热性 和尺寸稳定性。

公开(公告)号：US06900269B2

公开(公告)日：2005-05-31

申请号：US10412126

申请日：2003-04-11

申请人： Kuen-Yuan Hwang ,  An-Pang Tu ,  Mong Liang ,  Chi-Yi Ju ,  Sheng-Yen Wu ,  Chun-Hsiung Kao ,  Fang-Shian Su

发明人： Kuen-Yuan Hwang ,  An-Pang Tu ,  Mong Liang ,  Chi-Yi Ju ,  Sheng-Yen Wu ,  Chun-Hsiung Kao ,  Fang-Shian Su

IPC分类号： C09K21/14 ,  C08G59/30 ,  C08G59/40 ,  C08G59/50 ,  C08K3/00 ,  C08L63/00 ,  C08L63/02 ,  C08L71/12 ,  C09D11/00 ,  C09J7/00 ,  C09J163/00 ,  C09J171/10 ,  H05K1/03

CPC分类号： C08G59/5046 ,  C08G59/304 ,  C08L63/00 ,  C08L71/12 ,  H05K1/0326 ,  C08L2666/22

摘要： Disclosed is a halogen-free resin composition comprising: (A) one or more phosphorus-containing epoxy resins; (B) a hardener; (C) a hardening accelerator; (D) a polyphenylene oxide resin; and (E) a filling material, wherein the hardener of component B has the structure represented by the following formula (I): wherein each symbol is as defined above. The halogen-free resin composition of the present invention without adding halogen has excellent heat resistance and flame retardant property, and excellent dielectric property. The halogen-free resin composition of the present invention is particularly useful in the application of bonding sheets, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor packaging materials and the like.

摘要翻译： 公开了一种无卤树脂组合物，其包含：（A）一种或多种含磷环氧树脂; （B）硬化剂; （C）硬化促进剂; （D）聚苯醚树脂; 和（E）填充材料，其中组分B的硬化剂具有由下式（I）表示的结构：其中每个符号如上所定义。 不添加卤素的本发明的无卤树脂组合物具有优异的耐热性和阻燃性，并且具有优异的介电性能。 本发明的无卤素树脂组合物特别适用于粘合片，复合材料，层压板，印刷电路板，铜箔粘合剂，用于堆积工艺的油墨，半导体包装材料等的应用。

公开(公告)号：US20070088136A1

公开(公告)日：2007-04-19

申请号：US11340638

申请日：2006-01-27

申请人： Kuen-Yuan Hwang ,  An-Pang Tu ,  Sheng-Yen Wu ,  Yu-Lin Huang

发明人： Kuen-Yuan Hwang ,  An-Pang Tu ,  Sheng-Yen Wu ,  Yu-Lin Huang

IPC分类号： C08L63/02

CPC分类号： C08G59/22 ,  C08G59/38 ,  C08G59/621 ,  H05K1/0326

摘要： The present invention relates to a flame-retarding epoxy resin composition containing no halogen, which comprises an epoxy resin containing no halogen, a toughening agent, and a flame retarding agent. The present flame-retarding epoxy resin composition exhibits a high heat-resistance and excellent adhesion and is useful as adhesive agent in flexible printed circuit board.

摘要翻译： 本发明涉及不含卤素的阻燃性环氧树脂组合物，其包含不含卤素的环氧树脂，增韧剂和阻燃剂。 本发明的阻燃性环氧树脂组合物具有高耐热性和优异的粘合性，并且可用作柔性印刷电路板中的粘合剂。

公开(公告)号：US20070009751A1

公开(公告)日：2007-01-11

申请号：US11262788

申请日：2005-11-01

申请人： Kuen-Yuan Hwang ,  An-Pang Tu ,  Sheng-Yen Wu ,  Yu-Lin Huang

发明人： Kuen-Yuan Hwang ,  An-Pang Tu ,  Sheng-Yen Wu ,  Yu-Lin Huang

IPC分类号： B32B27/00

CPC分类号： C08L79/08 ,  B32B27/281 ,  B82Y30/00 ,  C08J5/005 ,  C08J2379/08 ,  H05K1/0346 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0257 ,  Y10T428/31721

摘要： The present invention relates to a polyamic acid resin composition, which is characterized by containing nanolayer silica sheet and/or nanometer silica powder. The present invention also relates to a polyimide film prepared from the composition, the resultant film exhibits improved dimension stability, low water-absorbability, high transparency, and low Coefficient of Thermal Expansion (CTE) value and is suitable used in flexible print wiring board and wiring board for liquid crystal display (LCD).

摘要翻译： 本发明涉及聚酰胺酸树脂组合物，其特征在于含有纳米二氧化硅片和/或纳米二氧化硅粉末。 本发明还涉及由该组合物制备的聚酰亚胺膜，所得膜具有改进的尺寸稳定性，低吸水性，高透明度和低的热膨胀系数（CTE）值，并且适用于柔性印刷布线板和 液晶显示接线板（LCD）。

公开(公告)号：US20060287467A1

公开(公告)日：2006-12-21

申请号：US11441662

申请日：2006-05-26

申请人： Kuen-Yuan Hwang ,  An-Pang Tu ,  Sheng-Yen Wu

发明人： Kuen-Yuan Hwang ,  An-Pang Tu ,  Sheng-Yen Wu

IPC分类号： C08G73/00

CPC分类号： H05K1/0346 ,  C08G73/16 ,  H05K1/0393

摘要： The present invention provides a polyimide resin, which is prepared by epolycondensing a dianhydride monomer including at least a dianhydride represented by formula (I) wherein R is O or O(CH2)nO, n is an integer of 1 to 2 and a diamine monomer represented by formula (II) H2N—Ar—NH2   (II) wherein Ar is defined as in the text then imidizing the resulting polyamic acid resin to form a polyimide resin. Through using the dianhydride represented by formula (I) as the polymerizing unit, a biphenyl moiety and an ester moiety are introduced into the main chain of the polyimide resin, such that the resulting polyimide resin has lower moisture absorption and smaller linear thermal expansion coefficient and therefore have satisfactory heat resistance and dimensional stability, in addition, become more soluble in organic solvents.

摘要翻译： 本发明提供一种聚酰亚胺树脂，其通过将至少包含式（I）表示的二酐的二酐单体进行缩聚来制备，其中R为O或O（CH 2） SUB，O，n为1〜2的整数，式（II）表示的二胺单体<？in-line-formula description =“In-Line Formulas”end =“lead”？> H＆ N-Ar-NH 2（II）<？in-line-formula description =“In-line Formulas”end =“tail”？>其中Ar定义如下， 酰亚胺化得到的聚酰胺酸树脂以形成聚酰亚胺树脂。 通过使用由式（I）表示的二酐作为聚合单元，将联苯部分和酯部分引入聚酰亚胺树脂的主链中，使得所得聚酰亚胺树脂具有较低的吸湿性和较小的线性热膨胀系数， 因此具有令人满意的耐热性和尺寸稳定性，另外在有机溶剂中变得更易溶。