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公开(公告)号:US20120119347A1
公开(公告)日:2012-05-17
申请号:US13357690
申请日:2012-01-25
申请人: Kuniaki MAMITSU , Takanori Teshima
发明人: Kuniaki MAMITSU , Takanori Teshima
IPC分类号: H01L23/36
CPC分类号: H01L25/117 , H01L23/40 , H01L23/4012 , H01L23/473 , H01L25/115 , H01L2224/40137 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/09701 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/30107 , H05K7/20927 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing the semiconductor chip and the heat sink in such a manner as to expose the heat radiation surface of the heat sink. The radiation surface is cooled by a refrigerant. An opening is formed in a part of the seal member as a refrigerant path through which the refrigerant flows.
摘要翻译: 半导体器件至少包括半导体模块,该半导体模块包括半导体芯片,与半导体芯片热连接的散热器和用于将半导体芯片和散热片覆盖和密封的密封构件,以暴露热辐射表面 散热器。 辐射表面由制冷剂冷却。 在密封构件的一部分上形成有制冷剂流过制冷剂路径的开口。
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公开(公告)号:US20090224398A1
公开(公告)日:2009-09-10
申请号:US12397640
申请日:2009-03-04
CPC分类号: H01L23/473 , H01L23/051 , H01L23/4334 , H01L24/32 , H01L24/33 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor module and a method of manufacturing the same are disclosed including a semiconductor element having an electrode, a heat radiation plate placed in thermal contact with a main surface of the semiconductor element and electrically connected to the electrode thereof, an insulation body directly formed on an outside surface of the heat radiation plate, a metallic body directly formed on an outside surface of the insulation body and having a thickness lower than that of the insulation body, and a mold resin unitarily molding the heat radiation plate, the semiconductor element and the insulation body. The insulation body is covered with the metallic body and the mold resin and the metallic body has an outside surface exposed to an outside of the mold resin.
摘要翻译: 公开了一种半导体模块及其制造方法,其包括具有电极的半导体元件,与半导体元件的主表面热接触并与其电极电连接的散热板,绝缘体直接形成在 散热板的外表面,直接形成在绝缘体的外表面上并且具有比绝缘体低的厚度的金属体,以及模制树脂,将散热板,半导体元件和 绝缘体。 绝缘体被金属体和模制树脂覆盖,并且金属体具有暴露于模制树脂外部的外表面。
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公开(公告)号:US20120001318A1
公开(公告)日:2012-01-05
申请号:US13170475
申请日:2011-06-28
申请人: Kuniaki MAMITSU , Takahisa Kaneko , Masaya Tonomoto , Masayoshi Nishihata , Hiroyuki Wado , Chikage Noritake , Eiji Nomura , Toshiki Itoh
发明人: Kuniaki MAMITSU , Takahisa Kaneko , Masaya Tonomoto , Masayoshi Nishihata , Hiroyuki Wado , Chikage Noritake , Eiji Nomura , Toshiki Itoh
IPC分类号: H01L23/473
CPC分类号: H01L23/473 , H01L23/3672 , H01L23/3736 , H01L23/427 , H01L23/4334 , H01L23/46 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L2224/06181 , H01L2224/29111 , H01L2224/2929 , H01L2224/29299 , H01L2224/29339 , H01L2224/29347 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/48227 , H01L2224/73215 , H01L2224/73265 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/06 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1517 , H01L2924/1579 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.
摘要翻译: 半导体器件包括封装和冷却器。 半导体封装包括半导体元件,金属构件和用于封装半导体元件和金属构件的模制构件。 金属构件具有热连接到半导体元件的金属部分,金属部分上的绝缘层和绝缘层上的导电层。 导电层至少部分地暴露在模制构件的外部,并且用作用于辐射半导体元件的热的辐射表面。 冷却器具有冷却剂通道,冷却剂通过该通道冷却导电层。 导电层和冷却器电连接在一起。
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