摘要:
A method, computer program product, and system (100) for computerized analysis of the likelihood of malignancy in a pulmonary nodule using artificial neural networks (ANNs) (S4). The method, on which the computer program product and the system is based on, includes obtaining a digital outline of a nodule; generating objective measures corresponding to physical features of the outline of the nodule; applying the generated objective measures to an ANN; and determining a likelihood of malignancy of the nodule based on an output of the ANN. Techniques include novel developments and implementations of artificial neural networks and feature extraction for digital images. Output from the inventive method yields an estimate of the likelihood of malignancy (S7) for a pulmonary nodule.
摘要:
A semiconductor device includes a semiconductor substrate in which an active region and an edge termination region are defined, a semiconductor element formed in the active region, and first to fourth P layers formed in a region spanning from an edge portion of the active region to the edge termination region in the surface of the semiconductor substrate. The first to fourth P layers respectively have surface concentrations P(1) to P(4) that decrease in this order, bottom-end distances D(1) to D(4) that increase in this order, and distances B(1) to B(4) to the edge of the semiconductor substrate that increase in this order. The surface concentration P(4) is 10 to 1000 times the impurity concentration of the semiconductor substrate, and the bottom-end distance D(4) is in the range of 15 to 30 μm.
摘要:
A stabilizing plate portion is formed in a region of a first main surface lying between first and second insulated gate field effect transistor portions. The stabilizing plate portion includes a first stabilizing plate arranged closest to the first insulated gate field effect transistor portion and a second stabilizing plate arranged closest to the second insulated gate field effect transistor portion. An emitter electrode is electrically connected to an emitter region of each of the first and second insulated gate field effect transistor portions, electrically connected to each of the first and second stabilizing plates, and arranged on the entire first main surface lying between the first and second stabilizing plates, with an insulating layer being interposed.
摘要:
A gate electrode is provided to fill up a trench while covering its opening. Assuming that WG represents the diameter (sectional width) of a head portion of the gate electrode located upward beyond a P-type base layer and an N+-type emitter diffusion layer , WT represents the diameter (sectional width) of an inner wall of a linearly extending portion of the trench and WC represents the distance between the boundary (the inner wall of the trench 300) between a gate oxide film and the P-type base layer and an end surface of the gate electrode located upward beyond the trench in a section of the trench , relation of either WG≧1.3·WT or WC≧0.2 μm holds between these dimensions.
摘要:
A pin diode is formed by a p+ collector region, an n type buffer region, an n− region and an n+ cathode region. A trench is formed from the surface of n+ cathode region through n+ cathode region to reach n− region. An insulating film is formed along an inner wall surface of trench. A gate electrode layer is formed to oppose to the sidewall of n+ cathode region with insulating film interposed. A cathode electrode is formed to be electrically connected to n+ cathode region. An anode electrode is formed to be electrically connected to p+ collector region. The n+ cathode region is formed entirely over the surface between trenches extending parallel to each other. Thus, a power semiconductor device in which gate control circuit is simplified and which has good on property can be obtained.
摘要:
A semiconductor device which includes a substrate made of a semiconductor having a main surface. A trench is selectively formed in the substrate at a predetermined depth from the main surface. An insulating film is formed at an inner wall of the trench. A control electrode layer fills an inside of the trench through the insulating film. An insulating layer protrudes from the main surface on the control electrode layer. At least one of an edge of an opening of the trench and a bottom of the trench has a rounded surface.
摘要:
In a semiconductor device with a high breakdown voltage, insulating layers are buried at regions in n− silicon substrate located between gate trenches which are arranged with a predetermined pitch. This structure increases a carrier density at a portion near an emitter, and improves characteristic of an IGBT of a gate trench type having a high breakdown voltage.
摘要:
A connecting structure for connecting a radiator having a reinforcement member and a condenser having a bracket is provided. The structure includes a connecting member having a spacer portion and a holding portion integrally formed on opposite sides of a notch. The spacer portion is fittingly inserted into the reinforcement member, and a folded portion of the reinforcement member and the condenser bracket are inserted into the notch. A bolt is inserted through the reinforcement member, the spacer portion, the bracket and the holding portion and a nut is screwed onto a tip of the bolt for clamping the radiator and the condenser together.
摘要:
An integrated heat exchanger includes a radiator having a core formed between a pair of radiator tanks, a condenser adjoining the radiator and having the core formed between a pair of condenser tanks, and a corrugated fin provided in the core and shared between the radiator and the condenser, the heat exchanger containing first partitions which divide the inside of the pair of condenser tanks to thereby create fluid chambers on one side of the respective condenser tanks in such a way as to become opposite to each other; and a fluid inflow pipe and a fluid outflow pipe connected to the fluid chamber of the condenser tanks.
摘要:
In a semiconductor device with a high breakdown voltage, insulating layers are buried at regions in n.sup.- silicon substrate located between gate trenches which are arranged with a predetermined pitch. This structure increases a carrier density at a portion near an emitter, and improves characteristic of an IGBT of a gate trench type having a high breakdown voltage.