公开(公告)号：US06319846B1

公开(公告)日：2001-11-20

申请号：US09755521

申请日：2001-01-05

申请人： Kuo-Wei Lin ,  James Chen ,  Eugene Chu ,  Alex Fahn ,  Chiou-Shian Peng ,  Gilbert Fane ,  Kenneth Lin

发明人： Kuo-Wei Lin ,  James Chen ,  Eugene Chu ,  Alex Fahn ,  Chiou-Shian Peng ,  Gilbert Fane ,  Kenneth Lin

IPC分类号： H01L21302

CPC分类号： H01L21/32134 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/81052 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

摘要： A method for removing a multiplicity of solder bodies connected to a semiconductor wafer through a copper wetting layer from the semiconductor wafer is disclosed. In the method, a semiconductor wafer that has on a top surface a multiplicity of solder bodies electrically connected to a multiplicity of bond pads through a multiplicity of copper wetting layers is first provided. When the multiplicity of solder bodies is found out of specification or must be removed for any other quality reasons, the semiconductor wafer is exposed to an etchant that has an etch rate toward the copper wetting layer at least 5 times the etch rate toward a metal that forms the multiplicity of bond pads. The semiconductor wafer may be removed from the etchant when the multiplicity of copper wetting layers is substantially dissolved such that the multiplicity of solder bodies is separated from the multiplicity of bond pads. The multiplicity of solder bodies may be either solder bumps or solder balls. The etchant may be a solution that contains Ce (NH4)2 (NO3)6 in a concentration range between about 3 wt. % and about 30 wt. % in water. Ultrasonic vibration may further be used to facilitate the dissolution of the copper wetting layers in the etchant.

摘要翻译： 公开了一种通过铜浸润层从半导体晶片去除连接到半导体晶片的多个焊料体的方法。 在该方法中，首先提供在顶表面上具有多个通过多个铜润湿层电连接到多个接合焊盘的多个焊料体的半导体晶片。 当发现多个焊料体不符合规格或由于任何其他质量原因必须除去多个焊料体时，将半导体晶片暴露于蚀刻剂，蚀刻速率朝向铜润湿层的刻蚀速率至少为蚀刻速率的5倍， 形成多个接合焊盘。 当多个铜润湿层基本上被溶解使得多个焊料体与多个接合焊盘分离时，半导体晶片可以从蚀刻剂中去除。 多个焊料体可以是焊料凸块或焊球。 蚀刻剂可以是含有浓度范围为约3重量％的Ce（NH 4）2（NO 3）6的溶液。 ％和约30wt。 ％ 在水里。 还可以使用超声振动来促进铜湿润层在蚀刻剂中的溶解。

公开(公告)号：US06756184B2

公开(公告)日：2004-06-29

申请号：US09976067

申请日：2001-10-12

申请人： Chiou-Shian Peng ,  Euegene Chu ,  Alex Fahn ,  Kenneth Lin ,  Gilbert Fane ,  James Chen ,  Kuo-Wei Lin

发明人： Chiou-Shian Peng ,  Euegene Chu ,  Alex Fahn ,  Kenneth Lin ,  Gilbert Fane ,  James Chen ,  Kuo-Wei Lin

IPC分类号： G03F700

CPC分类号： H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11502 ,  H01L2224/11849 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2224/11901 ,  H01L2224/1146

摘要： A method of making electrically conductive bumps of improved height on a semiconductor device. The method includes steps of depositing an under bump metallurgy over a semiconductor device onto a contact pad; depositing and patterning a photoresist layer to provide an opening over the under bump metallurgy; depositing a first electrically conductive material into the opening in the photoresist layer; depositing a second electrically conductive material over the first electrically conductive material; removing the photoresist layer and the excess under bump metallurgy; applying a flux agent to the top surface of the second electrically conductive material; hard baking the semiconductor device to remove any oxide; dipping a portion of the semiconductor device in an electroless plating solution; removing the semiconductor device from the electroless plating solution; and reflowing the electrically conductive materials to provide a bump of improved height on the semiconductor device.

摘要翻译： 一种在半导体器件上制造改进的高度的导电凸块的方法。 该方法包括以下步骤：在半导体器件上沉积凸块下的金属到接触焊盘上; 沉积和图案化光致抗蚀剂层以在凸块下冶金上提供开口; 将第一导电材料沉积到光致抗蚀剂层的开口中; 在所述第一导电材料上沉积第二导电材料; 去除光致抗蚀剂层和过量的凸块下冶金; 将助熔剂施加到所述第二导电材料的顶表面; 硬烘烤半导体器件去除任何氧化物; 将半导体器件的一部分浸入化学镀溶液中; 从化学镀液中除去半导体器件; 并且回流所述导电材料以在所述半导体器件上提供改善高度的突起。

公开(公告)号：US06534396B1

公开(公告)日：2003-03-18

申请号：US09686107

申请日：2000-10-10

申请人： Fu-Jier Fahn ,  Kuo-Wei Lin ,  James Chen ,  Eugene Cheu ,  Chien-Shian Peng ,  Gilbert Fan ,  Kenneth Lin

发明人： Fu-Jier Fahn ,  Kuo-Wei Lin ,  James Chen ,  Eugene Cheu ,  Chien-Shian Peng ,  Gilbert Fan ,  Kenneth Lin

IPC分类号： H01L214763

CPC分类号： H01L24/11 ,  H01L21/76801 ,  H01L21/76802 ,  H01L21/76819 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00

摘要： Within a method for forming a microelectronic fabrication there is first provided a substrate. There is then formed over the substrate a patterned conductor layer having a topographic variation at a periphery of the patterned conductor layer. There is then formed over the substrate and passivating the topographic variation at the periphery of the patterned conductor layer a planarizing passivation layer formed of a thermally reflowable material. There is then formed upon the planarizing passivation layer a dimensionally stabilizing layer. Finally, there is then thermally annealed the microelectronic fabrication to form from the planarizing passivation layer a thermally annealed planarizing passivation layer. By employing formed upon the planarizing passivation layer the dimensionally stabilizing layer, there is attenuated within the thermally annealed planarizing passivation layer replication of the topographic variation at the periphery of the patterned conductor layer.

摘要翻译： 在形成微电子制造的方法中，首先提供衬底。 然后在衬底上形成图案化导体层，该图案化导体层在图案化导体层的外围具有地形变化。 然后形成在衬底上并钝化图案化导体层的周边的地形变化，由可热再热材料形成的平坦化钝化层。 然后在平坦化钝化层上形成尺寸稳定层。 最后，然后将微电子制造热退火，从平坦化钝化层形成热退火的平坦化钝化层。 通过在平坦化钝化层上形成的尺寸稳定层，在图案化导体层的周边处的热退火的平坦化钝化层复制中的地形变化处被衰减。

公开(公告)号：US20170178547A1

公开(公告)日：2017-06-22

申请号：US14975748

申请日：2015-12-19

申请人： Kenneth Lin

发明人： Kenneth Lin

IPC分类号： G09F3/10 ,  B05D3/00

CPC分类号： G09F3/10 ,  G09F2003/0242

摘要： Processing and use of ultra-high solids formulations wherein no drying step is needed for the formulation to be incorporated in a wide variety of applications. Adhesives, top-coatings, sealants, fasteners are amongst the use areas.

公开(公告)号：US4846504A

公开(公告)日：1989-07-11

申请号：US238564

申请日：1988-08-30

申请人： John MacGregor ,  Frank J. Welch ,  Kenneth Lin

发明人： John MacGregor ,  Frank J. Welch ,  Kenneth Lin

IPC分类号： G09F3/02 ,  G09F3/18

CPC分类号： G09F3/02 ,  G09F3/185 ,  G09F2003/0205 ,  G09F2003/0242 ,  G09F2003/0272 ,  G09F2003/0273

摘要： A label assembly includes concealed promotional material, and is secured to the product package with the assembly including water-soluble adhesive. The promotional material may be in the form of a "cents-off" coupon or a scratch-off lottery-type game piece. The use of water-soluble adhesive deters tampering prior to purchase of the product, and the coupon or game piece is subsequently exposed when the water soluble adhesive is washed away. The label assembly may include either one, two, or three layers, with the lowermost label being secured to a backing strip or web preparatory to application to the product. When a single layer is employed, it is opaque, and the promotional material is on its lower surface. In a three-layer unit, the game piece may be sandwiched between an outer label having water-soluble adhesive, and the base label which is provided with permanent pressure-sensitive adhesive.

摘要翻译： 标签组件包括隐藏的促销材料，并且被固定到具有水溶性粘合剂的组件的产品包装上。 促销材料可以是“分钱”优惠券或刮刮彩票式游戏的形式。 在购买产品之前，使用水溶性粘合剂阻止篡改，随后将水溶性粘合剂冲洗掉时，优惠券或游戏件随后暴露。 标签组件可以包括一个，两个或三个层，其中最下面的标签被固定到准备应用于产品的背衬条或网。 当使用单层时，它是不透明的，并且促销材料在其下表面上。 在三层单元中，游戏件可以夹在具有水溶性粘合剂的外部标签和设置有永久性压敏粘合剂的基础标签之间。

公开(公告)号：US07045199B2

公开(公告)日：2006-05-16

申请号：US09881134

申请日：2001-06-14

申请人： Norman Yamamoto ,  Xing-Ya Li ,  Kenneth Lin ,  Zhisong Huang

发明人： Norman Yamamoto ,  Xing-Ya Li ,  Kenneth Lin ,  Zhisong Huang

IPC分类号： B32B7/02

CPC分类号： B42D1/08 ,  B41M5/52 ,  Y10T428/24802 ,  Y10T428/2495 ,  Y10T428/26

摘要： A photo album is provided having an ink-receptive coating on a surface of the photo album. A user may write text or draw pictures on the surface with an ink pen, such as with a gel-based ink pen. The ink-receptive coating protects the ink from smudging or smearing after the ink has dried. Consequently, the text and/or picture is durable. The writable or drawable surface may be the front or back exterior surface, and/or an interior surface.

公开(公告)号：US20200020253A1

公开(公告)日：2020-01-16

申请号：US16483681

申请日：2017-06-09

申请人： Kenneth Lin

发明人： Kenneth Lin

IPC分类号： G09F3/10 ,  B65C9/18 ,  G09F3/02

摘要： PSA Label Rolls using spent liners and a novel continuous process to convert a stack of face material into a roll of label stock by affixing adhesive coated face material onto a liner. Provides a process to recycle waste liner from conventional roll label stock application machines. Uses an ultra-high solids adhesive that needs no drying. Roll label stock made by such a process provides large cost savings and beneficial environmental impact.

公开(公告)号：US08729157B2

公开(公告)日：2014-05-20

申请号：US12798006

申请日：2010-03-29

申请人： Kenneth Lin

发明人： Kenneth Lin

IPC分类号： C08C1/14 ,  C08J3/00

CPC分类号： C08C1/14 ,  C08J3/00 ,  C08L93/04 ,  C08L2666/26 ,  C09J109/08

摘要： A process for making an ultra high solids emulsion adhesive that is coatable and dryable at room temperature. The process consists of increasing solids using a phase inversion process to accomplish the addition of increased solids into aqueous formulations thereby obtaining emulsion pressure sensitive adhesives with solids content in excess of 60%.

摘要翻译： 制备在室温下可涂覆和可干燥的超高固含量乳液粘合剂的方法。 该方法包括使用相转化方法增加固体，以实现将增加的固体添加到水性制剂中，从而获得固体含量超过60％的乳液压敏粘合剂。

公开(公告)号：US20110236573A1

公开(公告)日：2011-09-29

申请号：US12798006

申请日：2010-03-29

申请人： Kenneth Lin

发明人： Kenneth Lin

IPC分类号： B05D5/10 ,  C08L7/02

CPC分类号： C08C1/14 ,  C08J3/00 ,  C08L93/04 ,  C08L2666/26 ,  C09J109/08

摘要： A process for making an ultra high solids emulsion adhesive that is coatable and dryable at room temperature. The process consists of increasing solids using a phase inversion process to accomplish the addition of increased solids into aqueous formulations thereby obtaining emulsion pressure sensitive adhesives with solids content in excess of 60%.

摘要翻译： 制备在室温下可涂覆和可干燥的超高固含量乳液粘合剂的方法。 该方法包括使用相转化方法增加固体，以实现将增加的固体添加到水性制剂中，从而获得固体含量超过60％的乳液压敏粘合剂。

公开(公告)号：US20090024462A1

公开(公告)日：2009-01-22

申请号：US11778203

申请日：2007-07-16

申请人： Kenneth Lin

发明人： Kenneth Lin

IPC分类号： G06Q30/00

CPC分类号： G06Q30/02 ,  G06Q30/0251 ,  G06Q30/0271 ,  G06Q30/0273 ,  G06Q30/0277

摘要： A method and system for providing targeted advertising to consumers is disclosed. Identifying information for a consumer is received. A credit attribute for the consumer using the identifying information is retrieved. At least one advertisement is stored in which each advertisement includes a corresponding credit attribute range. An advertisement for presentation to the consumer is selected based on the credit attribute of the consumer and the credit attribute range of the advertisement.

摘要翻译： 公开了一种向消费者提供有针对性的广告的方法和系统。 收到消费者识别信息。 检索使用识别信息的消费者的信用属性。 存储至少一个广告，其中每个广告包括相应的信用属性范围。 基于消费者的信用属性和广告的信用属性范围来选择用于呈现给消费者的广告。