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    Film adhesive for semiconductor vacuum processing apparatus
    3.
    发明授权
    Film adhesive for semiconductor vacuum processing apparatus 有权
    半导体真空处理设备的胶粘剂

    公开(公告)号：US09028646B2

    公开(公告)日：2015-05-12

    申请号：US13869603

    申请日：2013-04-24

    Applicant: Lam Research Corporation

    Inventor： Dean J. Larson ,  Tom Stevenson ,  Victor Wang

    IPC: H01L21/67 ,  B32B37/12 ,  H01L21/687

    CPC classification number: H01L21/67069 ,  B32B37/12 ,  H01L21/67103 ,  H01L21/68757 ,  Y10T156/10 ,  Y10T156/1062 ,  Y10T428/31504

    Abstract: A bonded assembly to reduce particle contamination in a semiconductor vacuum chamber such as a plasma processing apparatus is provided, including an elastomeric sheet adhesive bond between mating surfaces of a component and a support member to accommodate thermal stresses. The elastomeric sheet comprises a silicone adhesive to withstand a high shear strain of ≧800% at a temperature range between room temperature and 300° C. such as heat curable high molecular weight dimethyl silicone with optional fillers. The sheet form has bond thickness control for parallelism of bonded surfaces. The sheet adhesive may be cut into pre-form shapes to conform to regularly or irregularly shaped features, maximize surface contact area with mating parts, and can be installed into cavities. Installation can be manually, manually with installation tooling, or with automated machinery. Composite layers of sheet adhesive having different physical properties can be laminated or coplanar.

    Abstract translation: 提供了一种用于减少诸如等离子体处理装置的半导体真空室中的颗粒污染的粘合组件，包括在部件的配合表面和支撑构件之间的弹性片粘合剂粘合以适应热应力。 弹性体片材包括硅氧烷粘合剂，以在室温和300℃之间的温度范围内承受≥800％的高剪切应变，例如具有任选填料的可热固化的高分子量二甲基硅氧烷。 片材形式具有用于粘结表面平行度的粘结厚度控制。 片状粘合剂可以被切割成预成型形状以符合规则或不规则形状的特征，使与配合部件的表面接触面积最大化，并且可以安装到空腔中。 安装可以手动，手动安装工具或自动化机械。 具有不同物理性质的片状粘合剂的复合层可以层压或共面。

    FILM ADHESIVE FOR SEMICONDUCTOR VACUUM PROCESSING APPARATUS
    4.
    发明申请
    FILM ADHESIVE FOR SEMICONDUCTOR VACUUM PROCESSING APPARATUS 审中-公开
    用于半导体真空处理设备的胶膜粘合剂

    公开(公告)号：US20130292048A1

    公开(公告)日：2013-11-07

    申请号：US13869603

    申请日：2013-04-24

    Applicant: Lam Research Corporation

    Inventor： Dean J. Larson ,  Tom Stevenson ,  Victor Wang

    IPC: H01L21/67 ,  B32B37/12

    CPC classification number: H01L21/67069 ,  B32B37/12 ,  H01L21/67103 ,  H01L21/68757 ,  Y10T156/10 ,  Y10T156/1062 ,  Y10T428/31504

    Abstract: A bonded assembly to reduce particle contamination in a semiconductor vacuum chamber such as a plasma processing apparatus is provided, including an elastomeric sheet adhesive bond between mating surfaces of a component and a support member to accommodate thermal stresses. The elastomeric sheet comprises a silicone adhesive to withstand a high shear strain of ≧800% at a temperature range between room temperature and 300° C. such as heat curable high molecular weight dimethyl silicone with optional fillers. The sheet form has bond thickness control for parallelism of bonded surfaces. The sheet adhesive may be cut into pre-form shapes to conform to regularly or irregularly shaped features, maximize surface contact area with mating parts, and can be installed into cavities. Installation can be manually, manually with installation tooling, or with automated machinery. Composite layers of sheet adhesive having different physical properties can be laminated or coplanar.

    Abstract translation: 提供了一种用于减少诸如等离子体处理装置的半导体真空室中的颗粒污染的粘合组件，包括在部件的配合表面和支撑构件之间的弹性片粘合剂粘合以适应热应力。 弹性体片材包含硅氧烷粘合剂，以在室温至300℃的温度范围内承受≥800％的高剪切应变，例如具有任选填料的可热固化的高分子量二甲基硅氧烷。 片材形式具有用于粘结表面平行度的粘结厚度控制。 片状粘合剂可以被切割成预成型形状以符合规则或不规则形状的特征，使与配合部件的表面接触面积最大化，并且可以安装到空腔中。 安装可以手动，手动安装工具或自动化机械。 具有不同物理性质的片状粘合剂的复合层可以层压或共面。

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