公开(公告)号：US20240363311A1

公开(公告)日：2024-10-31

申请号：US18767915

申请日：2024-07-09

Applicant: Lam Research Corporation

Inventor： Weiyi LUO ,  Youn Gi HONG ,  WeiWu ZHONG ,  Himanshu CHOKSHI

IPC: H01J37/32 ,  C23C16/455 ,  C23C16/50 ,  C23C16/52

CPC classification number: H01J37/32183 ,  C23C16/45536 ,  C23C16/45544 ,  C23C16/50 ,  C23C16/52 ,  H01J37/3299 ,  H01J2237/332 ,  H01J2237/334

Abstract: A substrate processing system includes a plasma generator configured to supply (radio frequency) RF power to an electrode arranged in a processing chamber. A sensor is configured to sense a parameter of the RF power supplied to the electrode. A controller is configured to compensate variations in a rate of a plasma process due to variations in bulk resistivity of a substrate arranged on a substrate support by causing the sensor to sense the parameter at least one of prior to plasma processing of the substrate and after a predetermined period after the plasma processing of the substrate begins; and adjusting the parameter of the RF power for the substrate during the plasma processing of the substrate based on the parameter sensed for the substrate.

公开(公告)号：US20230369076A1

公开(公告)日：2023-11-16

申请号：US18217696

申请日：2023-07-03

Applicant: LAM RESEARCH CORPORATION

Inventor： Dengliang YANG ,  Haoquan FANG ,  David CHEUNG ,  Gnanamani AMBUROSE ,  Eunsuk KO ,  Weiyi LUO ,  Dan ZHANG

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/311

CPC classification number: H01L21/67069 ,  H01J37/32422 ,  H01J37/32449 ,  H01J37/32724 ,  H01J37/32146 ,  H01J37/32623 ,  H01J37/32972 ,  H01L21/31138 ,  H01J37/3299 ,  B08B5/023

Abstract: Several designs of a gas distribution device for a substrate processing system are provided. The gas distribution device includes a dual plenum showerhead. Additionally, designs for a light blocking structure used with the showerheads are also provided.