PLASMA-EXCLUSION-ZONE RINGS FOR PROCESSING NOTCHED WAFERS

    公开(公告)号:US20230352278A1

    公开(公告)日:2023-11-02

    申请号:US17913935

    申请日:2021-03-26

    IPC分类号: H01J37/32

    摘要: A plasma-exclusion-zone ring for a substrate processing system that is configured to process a substrate includes a ring-shaped body, an upper portion of the ring-shaped body, a base and a plasma-exclusion-zone ring notch. The upper portion of the ring-shaped body defines a radially inner surface and a top surface. The base of the ring-shaped body defines a radially outer surface, a first bottom surface extending radially inward from the radially outer surface, and a second bottom surface extending radially inward from the first bottom surface. The plasma-exclusion-zone ring notch is proportional to an alignment notch of the substrate. The first bottom surface is tapered and extends at an acute angle from the second bottom surface to the radially outer surface. The first bottom surface is configured to extend over and oppose a periphery of the substrate.