公开(公告)号：US12037491B2

公开(公告)日：2024-07-16

申请号：US16975374

申请日：2019-11-13

Applicant: LG CHEM, LTD.

Inventor： Yongseon Hwang ,  Changbo Shim ,  Hyunsung Min ,  Hye Rim Park

IPC: C08L71/12 ,  B32B5/10 ,  B32B5/26 ,  C08J5/24 ,  C08K9/06 ,  C08L9/06 ,  C08L79/08 ,  C08K3/36 ,  C08L27/18 ,  C08L67/00

CPC classification number: C08L71/12 ,  B32B5/10 ,  B32B5/26 ,  C08J5/244 ,  C08J5/249 ,  C08K9/06 ,  C08L9/06 ,  C08L79/08 ,  B32B2305/076 ,  C08J2309/06 ,  C08J2367/00 ,  C08J2371/12 ,  C08J2479/08 ,  C08K3/36 ,  C08L27/18 ,  C08L67/00

Abstract: The present invention relates to a resin composition including a binder resin and an organic-inorganic composite filler, a prepreg including the same, a laminated plate including the same, and a resin-coated metal foil including the same.

公开(公告)号：US11597837B2

公开(公告)日：2023-03-07

申请号：US17052488

申请日：2020-01-17

Applicant: LG CHEM, LTD.

Inventor： Changbo Shim ,  Yongseon Hwang ,  Hwayeon Moon ,  Hee Yong Shim ,  Hyunsung Min

IPC: C08K3/36 ,  C08L71/12 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20 ,  H01L23/14 ,  H01L23/498 ,  C08K9/04 ,  C08J5/24

Abstract: The present disclosure relates to a thermosetting resin composition for a semiconductor package including a modified phenylene ether oligomer or a modified poly(phenylene ether) having ethylenically unsaturated groups at both ends thereof; a thermosetting resin; a predetermined elastic (co)polymer; and an inorganic filler, and a prepreg and a metal clad laminate including the same.