公开(公告)号：US09190450B2

公开(公告)日：2015-11-17

申请号：US14508790

申请日：2014-10-07

Applicant: LG INNOTEK CO., LTD.

Inventor： Geun-Ho Kim ,  Yu Ho Won

IPC: H01L27/15 ,  H01L33/62 ,  H01L33/50 ,  H01L29/866 ,  H01L33/48 ,  H01L33/60

CPC classification number: H01L33/105 ,  H01L27/15 ,  H01L29/866 ,  H01L33/486 ,  H01L33/50 ,  H01L33/507 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting device package is disclosed, which includes a first via hole and a second via hole disposed lower than a light emitting part, the first via hole and the second via hole are disposed at an outer area of the light emitting part, a bottom metal includes a first bottom metal, a second bottom metal, and a third bottom metal between the first bottom metal and the second bottom metal, a first conductive metal electrically connected to the first bottom metal through the first via hole and a second conductive metal electrically connected to the second bottom metal through the second via hole. Further, the first bottom metal, the second bottom metal are apart from the third bottom metal at a bottom surface of the substrate, and the third bottom metal is not electrically connected to the second conductive type metal layer.

Abstract translation: 公开了一种发光器件封装，其包括设置在比发光部低的第一通孔和第二通孔，第一通孔和第二通孔设置在发光部的外部区域，底部 金属包括在第一底部金属和第二底部金属之间的第一底部金属，第二底部金属和第三底部金属，通过第一通孔电连接到第一底部金属的第一导电金属和电连接到第一底部金属的第二导电金属 通过第二通孔连接到第二底部金属。 此外，第一底部金属，第二底部金属在基板的底面处与第三底部金属分离，并且第三底部金属不与第二导电型金属层电连接。

公开(公告)号：US08878229B2

公开(公告)日：2014-11-04

申请号：US14021577

申请日：2013-09-09

Applicant: LG Innotek Co., Ltd.

Inventor： Guen-Ho Kim ,  Yu Ho Won

IPC: H01L29/22 ,  H01L33/00 ,  H01L29/227 ,  H01L23/02 ,  H01L23/48 ,  H01L23/04 ,  H01L23/52 ,  H01L29/40 ,  H01L33/62 ,  H01L33/48 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L33/105 ,  H01L27/15 ,  H01L29/866 ,  H01L33/486 ,  H01L33/50 ,  H01L33/507 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Disclosed is a light emitting device package. The light emitting device package includes a substrate including a recess, a light emitting chip on the substrate and a first conductive layer electrically connected to the light emitting chip. And the first conductive layer includes at least one metal layer electrically connected to the light emitting chip on an outer circumference of the substrate.

Abstract translation: 公开了一种发光器件封装。 发光器件封装包括：衬底，包括凹部，衬底上的发光芯片和与发光芯片电连接的第一导电层。 并且第一导电层包括在衬底的外圆周上电连接到发光芯片的至少一个金属层。

公开(公告)号：US09893118B2

公开(公告)日：2018-02-13

申请号：US13651031

申请日：2012-10-12

Applicant: LG INNOTEK CO., LTD

Inventor： Geun Ho Kim ,  Yu Ho Won ,  Yong Seon Song

IPC: H01L29/18 ,  H01L33/00 ,  H01L27/15 ,  H01L33/38 ,  H01L33/62

CPC classification number: H01L27/156 ,  H01L33/0079 ,  H01L33/385 ,  H01L33/62 ,  H01L2224/24

Abstract: A light emitting device that includes a conductive substrate, an insulating layer on the conductive substrate, a plurality of light emitting device cells on the insulating layer, a connection layer electrically interconnecting the light emitting device cells, a first contact section electrically connecting the conductive substrate with at least one light emitting device cell, and a second contact section on the at least one light emitting device cell.

公开(公告)号：US09455375B2

公开(公告)日：2016-09-27

申请号：US14923229

申请日：2015-10-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Geun-Ho Kim ,  Yu Ho Won

IPC: H01L33/00 ,  H01L27/15 ,  H01L29/86 ,  H01L33/10 ,  H01L33/48 ,  H01L33/62 ,  H01L29/866 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L33/105 ,  H01L27/15 ,  H01L29/866 ,  H01L33/486 ,  H01L33/50 ,  H01L33/507 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting device package includes a substrate having a first cavity and a second cavity directly under the first cavity, a light emitting part on the second cavity, a first metal layer on an inner side surface of the substrate, a second metal layer on the inner side surface of the substrate, a third metal layer on a bottom surface of the substrate, the third metal layer electrically connected to the first metal layer by a first via hole, a fourth metal layer on the bottom surface of the substrate, the fourth metal layer electrically connected to the second metal layer by a second via hole, and a fifth metal layer on the bottom surface of the substrate, the fifth metal layer disposed between the first via hole and the second via hole.

Abstract translation: 发光器件封装包括具有第一空腔和位于第一空腔正下方的第二腔的衬底，第二腔上的发光部，衬底的内侧表面上的第一金属层， 所述基板的内侧表面，在所述基板的底面上的第三金属层，所述第三金属层通过第一通孔与所述第一金属层电连接，所述第四金属层在所述基板的底面上，所述第四金属层 金属层通过第二通孔与第二金属层电连接，第五金属层位于基板的底面上，第五金属层设置在第一通孔和第二通孔之间。

公开(公告)号：US09368697B2

公开(公告)日：2016-06-14

申请号：US14087532

申请日：2013-11-22

Applicant: LG INNOTEK CO., LTD.

Inventor： Yu Ho Won ,  Geun Ho Kim

IPC: H01L33/00 ,  H01L33/50 ,  H01L33/48 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L33/505 ,  H01L33/48 ,  H01L33/507 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A light emitting device package according to embodiments comprises: a package body; a lead frame on the package body; a light emitting device supported by the package body and electrically connected with the lead frame; a filling material surrounding the light emitting device; and a phosphor layer comprising phosphors on the filling material.