Circuit design for point-to-point chip for high speed testing
    2.
    发明授权
    Circuit design for point-to-point chip for high speed testing 失效
    用于高速测试的点对点芯片的电路设计

    公开(公告)号:US5532983A

    公开(公告)日:1996-07-02

    申请号:US998427

    申请日:1992-12-30

    摘要: A test assembly for testing integrated circuits. The assembly includes a test chip that is located between the integrated circuit (IC) and a tester. The test chip has a very low input capacitance that approximates an open circuit, and has an impedance that matches the impedance of the integrated circuit and tester. The matching impedance of the test chip reduces the amount of signal ringing between the integrated circuit and tester.

    摘要翻译: 用于测试集成电路的测试组件。 组件包括位于集成电路(IC)和测试仪之间的测试芯片。 测试芯片具有非常低的输入电容,其近似于开路,并且具有与集成电路和测试器的阻抗匹配的阻抗。 测试芯片的匹配阻抗降低了集成电路和测试仪之间的信号振荡量。