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公开(公告)号:US5982632A
公开(公告)日:1999-11-09
申请号:US7349
申请日:1998-01-15
申请人: Larry Mosley , Anna Madrid , Siva Natarajan
发明人: Larry Mosley , Anna Madrid , Siva Natarajan
IPC分类号: H01L23/12 , H01L23/498 , H01L23/50 , H05K1/02 , H05K1/18 , H05K3/34 , H05K1/11 , H05K1/14 , H05K7/02
CPC分类号: H05K1/181 , H01L23/49816 , H01L23/50 , H01L24/49 , H05K1/0243 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48233 , H01L2224/48235 , H01L2224/49109 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H05K1/0262 , H05K1/0263 , H05K2201/09809 , H05K2201/10689 , H05K2201/10734 , H05K2201/10969 , H05K3/3431 , H05K3/3436 , Y02P70/611
摘要: A short power signal path integrated circuit package placed on a printed circuit (PC) board and having a first dielectric layer. On top of this first dielectric layer a metallized die pad and a first metal ring, surrounding this metallized die pad, are positioned. The metallized die pad and the first metal ring electrically couple to the PC board to receive respectively a first power supply signal and a second power supply signal. An integrated circuit die is then affixed to the metallized die pad. This integrated circuit die has a first power supply signal bond pad and a second power supply signal bond pad, which respectively are coupled to the metallized die pad and the first metal ring. Consequently, the metallized die pad and the first metal ring operate as a first power supply plane and a second power supply plane coupling the first and the second power supply signals coming from the PC board to the first and the second power supply signal bond pads on the integrated circuit die.
摘要翻译: 放置在印刷电路板(PC)板上并具有第一电介质层的短功率信号路径集成电路封装。 在该第一电介质层的顶部,定位金属化管芯焊盘和围绕该金属化管芯焊盘的第一金属环。 金属化管芯焊盘和第一金属环电耦合到PC板以分别接收第一电源信号和第二电源信号。 然后将集成电路管芯固定到金属化管芯焊盘。 该集成电路管芯具有分别耦合到金属化管芯焊盘和第一金属环的第一电源信号焊盘和第二电源信号焊盘。 因此,金属化管芯焊盘和第一金属环作为第一电源平面和第二电源平面工作,第二电源平面将来自PC板的第一和第二电源信号耦合到第一和第二电源信号焊盘上 集成电路管芯。
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公开(公告)号:US5532983A
公开(公告)日:1996-07-02
申请号:US998427
申请日:1992-12-30
IPC分类号: G01R31/28 , G01R31/319 , G01R35/00 , G04F8/00 , G01R1/073
CPC分类号: G01R31/3191 , G01R31/2889 , G01R35/005
摘要: A test assembly for testing integrated circuits. The assembly includes a test chip that is located between the integrated circuit (IC) and a tester. The test chip has a very low input capacitance that approximates an open circuit, and has an impedance that matches the impedance of the integrated circuit and tester. The matching impedance of the test chip reduces the amount of signal ringing between the integrated circuit and tester.
摘要翻译: 用于测试集成电路的测试组件。 组件包括位于集成电路(IC)和测试仪之间的测试芯片。 测试芯片具有非常低的输入电容,其近似于开路,并且具有与集成电路和测试器的阻抗匹配的阻抗。 测试芯片的匹配阻抗降低了集成电路和测试仪之间的信号振荡量。
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